News – Page 1922 – EEJournal

MegaChips Licenses Arteris FlexNoC Fabric IP for Next-Generation Imaging SoCs

January 29, 2013

SUNNYVALE, Calif., Jan. 29, 2013 /PRNewswire/ — Arteris Inc., the inventor and leading supplier of network-on-chip (NoC) interconnect IP solutions, today announced that MegaChips Corporation of Osaka, Japan, has selected Arteris FlexNoC fabric IP for use within next-generation imaging SoCs.

MegaChips previously licensed Arteris’ inter-chip link IP products for chip-to-chip connectivity. They chose Arteris’ FlexNoC interconnect fabric IP to support the small size and low power consumption requirements for the … Read More → "MegaChips Licenses Arteris FlexNoC Fabric IP for Next-Generation Imaging SoCs"

Synopsys Announces Energy-Efficient 28-nm PCI Express 3.0 PHY with Support for 10GBASE-KR

January 29, 2013

MOUNTAIN VIEW, Calif., Jan. 29, 2013 /PRNewswire/ —

Highlights:

Multi-rate PHY IP spans 1.25 Gbps to 10.3 Gbps data rates to cover a broad range of protocols
Multiprotocol solution supports key standards: PCI Express 3.0, 10GBASE-KR, 10GBASE-KX4, 1000BASE-KX, CEI-6G-SR, SGMII and QSGMII
Optimized for area and power consumption with support for IEEE’s Energy-Efficient Ethernet (EEE) standard to facilitate green enterprise technologies

Synopsys, Inc. (Nasdaq:SNPS), a global leader providing software, IP … Read More → "Synopsys Announces Energy-Efficient 28-nm PCI Express 3.0 PHY with Support for 10GBASE-KR"

Altium strengthens leadership team for next step in Smart System Design Automation

January 29, 2013

Karlsruhe, Germany – 29 January 2013 – Altium Ltd <http://www.live.altium.com/> ., global leader in Smart System Design Automation and provider of solutions for 3D PCB design (Altium Designer <http://products.live.altium.com/> ) as well as embedded software development (TASKING <http://www.tasking.com/> ), announces a global strategic change in its management team. The expanded corporate management team … Read More → "Altium strengthens leadership team for next step in Smart System Design Automation"

AWR and Zuken announce RF verification flow for PCB design

January 29, 2013

SANTA CLARA, Calif., DESIGNCON 2013 – BOOTHS #707, #164 – Jan. 29, 2013 – AWR Corporation, the innovation leader in high-frequency EDA software, together with Zuken, a leading provider of electrical and electronic engineering software solutions, today announce AWR Connected™ for Zuken. This RF printed circuit board (PCB) verification flow simplifies the PCB design process and therefore shortens design cycles by enabling users to quickly and easily simulate and verify embedded RF functionality. AWR Connected for Zuken provides a pathway from Zuken’s Read More → "AWR and Zuken announce RF verification flow for PCB design"

Renesas Electronics America Introduces New RX-Based Solutions Kit for Graphic/Touch Panel Solutions

January 29, 2013

SANTA CLARA, Calif., January 28, 2012 – Today, Renesas Electronics America Inc. announced the development of a new, cost-effective Solutions Kit for the RX family of MCUs, enabling engineers working in a broad mix of application segments to take advantage of Renesas’ low-power and high-performance RX family. The Embedded GUI Solution Kit will continue to drive innovation for the next generation of connected “smart society” applications, helping … Read More → "Renesas Electronics America Introduces New RX-Based Solutions Kit for Graphic/Touch Panel Solutions"

Tektronix Launches New Toolset for Serial Data Link Analysis

January 29, 2013

BEAVERTON, Ore., Jan. 28, 2013 – Tektronix, Inc., the world’s leading manufacturer of oscilloscopes, today announced a new Serial Data Link Analysis Visualizer software package (SDLA Visualizer) for Tektronix performance oscilloscopes including the DPO/DSA/MSO70000 Series. Designers working on next generation high-speed serial standards can use SDLA Visualizer to specify their link, de-embed any components from the measurement path, simulate virtual link components, apply equalization and take measurements at multiple points on the transmission line in a serial data system, module or chipset.

For designers doing physical layer … Read More → "Tektronix Launches New Toolset for Serial Data Link Analysis"

New 32-bit BA25 Application Processor Adds More Performance to Royalty-Free BA2x Family Page

January 29, 2013

Santa Clara, CA, USA — January 29, 2013 — Processor intellectual property company Beyond Semiconductor and IP provider CAST, Inc. today unveiled a more powerful member of the BA2x Family of 32-bit processor IP cores.

The BA25™ Advanced Application Processor is designed to fulfill the requirements of demanding embedded applications and is suitable for use as the main processor for systems running general-purpose operating systems like Linux or Android.

The new processor operates at high frequencies (more than 800 MHz and 1,360 DMIPS … Read More → "New 32-bit BA25 Application Processor Adds More Performance to Royalty-Free BA2x Family Page"

Microchip Adds Bluetooth® Module for Streaming Audio; Complete Certified Wireless Solution, Simple to Use On-Board Stack and Profiles

January 29, 2013

CHANDLER, Ariz., Jan. 29, 2013 [NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced the expansion of its wireless product portfolio with a certified Bluetooth^® Audio Module that supports audio for voice and music. The RN52 module provides extremely low power consumption in a small, surface-mount form factor, and includes standard Bluetooth audio and data profiles for all smart-phone platforms. These features makes it easy for designers … Read More → "Microchip Adds Bluetooth® Module for Streaming Audio; Complete Certified Wireless Solution, Simple to Use On-Board Stack and Profiles"

Imec and Qualcomm Extend R&D Collaboration to Advance CMOS Technologies for Next-Generation Products

January 28, 2013

Leuven (Belgium) and San Diego (USA) 28 January, 2013 – Nanoelectronics research centre imec and Qualcomm Technologies, Inc., a wholly owned subsidiary of Qualcomm Incorporated (NASDAQ: QCOM), announced today an extended collaboration agreement to accelerate scaling technologies for logic and memory devices. The first fabless integrated circuit company to become a core partner of imec, Qualcomm Technologies will gain comprehensive insight into all advanced process technologies under investigation at imec to help shape future product roadmaps.

Increasingly, it is challenging to design advanced systems and applications for each new technology node. By gaining early information on CMOS … Read More → "Imec and Qualcomm Extend R&D Collaboration to Advance CMOS Technologies for Next-Generation Products"

MEMS Industry Group Announces MEMS Executive Congress Europe 2013

January 28, 2013

PITTSBURGH—January 28, 2013—MEMS Industry Group (MIG) will host its second annual MEMS Executive Congress® Europ e, March 12, 2013 in Amsterdam. This European edition of MIG’s highly successful executive event features an opening presentation by MIG Managing Director Karen Lightman, keynotes by Continental Automotive GmbH and SORIN GROUP, and panels exploring micro-electromechanical systems (MEMS) as a core enabling technology in both established and emerging markets.

“European companies and … Read More → "MEMS Industry Group Announces MEMS Executive Congress Europe 2013"