News – Page 1920 – EEJournal

Lattice Semiconductor Will Feature Real-Time 3D Video Converter AT CES 2013

December 17, 2012

HILLSBORO, OR – DECEMBER 17, 2012 – Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced it will demonstrate 3D Impact Media’s RealityBox, a low density LatticeECP3™ FPGA-based real-time 3D video converter, in its private “Mobile Innovation” meeting suite at the Consumer Electronics Show (CES) January 8-11 in Las Vegas. Lattice suite 2980 will be located in the East Tower, Las Vegas Hotel.

STMicroelectronics selects IAR Embedded Workbench for record-breaking code speed

December 17, 2012

Uppsala, Sweden—December 17, 2012—IAR Systems® today announces that its development tool suite IAR Embedded Workbench® for ARM® has been selected by STMicroelectronics for its recently published outstanding scores on the CoreMark® benchmarks. The score 3.37 CoreMarks®/MHz is achieved using the latest version 6.50 of IAR Embedded Workbench for ARM with STMicroelectronics’ STM32F417IGt6 microcontroller running at an operating frequency of 168 MHz from internal flash memory.

Compared to the previous world-leading version of IAR … Read More → "STMicroelectronics selects IAR Embedded Workbench for record-breaking code speed"

Elliptic Technologies Selects Synopsys’ Discovery VIP for ARM AMBA Interconnect for Verification of its Leading Security Systems

December 17, 2012

MOUNTAIN VIEW, Calif., Dec. 17, 2012 /PRNewswire/ — Synopsys, Inc. (NASDAQ: SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced that Elliptic Technologies, a technology leader in embedded security solutions for mobile, networking, smart grid and automotive markets, successfully deployed Synopsys’ Discovery™ Verification IP (VIP) for the ARM® AMBA® protocol for verification of its new-generation Multi-Packet Manager security protocol accelerator (CLP-630). Elliptic cited performance, efficient ease-of-use and smooth deployment as some of the key benefits of Discovery VIP.

“The embedded security market demands delivery of error-free, rigorously verified security … Read More → "Elliptic Technologies Selects Synopsys’ Discovery VIP for ARM AMBA Interconnect for Verification of its Leading Security Systems"

QuickLogic Showcases Broad Range of CSSP Solutions for Mobile Devices at CES

December 13, 2012

Sunnyvale, CA – December 13, 2012 — QuickLogic Corporation (NASDAQ: QUIK), the leader in low-power Customer Specific Standard Products (CSSPs), is demonstrating a broad range of CSSP solutions for mobile devices next month at the 2013 Consumer Electronics Show (CES) in Las Vegas. QuickLogic’s CSSPs address common design challenges that mobile device OEMs face and offer features that create product differentiation within the market.

The company’s hospitality suite will feature a variety of processor-to-display and processor-to-processor bridging solutions that solve interface … Read More → "QuickLogic Showcases Broad Range of CSSP Solutions for Mobile Devices at CES"

Arasan Chip Systems further expands its Ethernet portfolio by adding AVB (Audio Video Bridging)

December 13, 2012

San Jose, California – December 10, 2012 -Arasan Chip Systems, Inc. (“Arasan”), a leading provider of Total IP Solutions, announced today that they have added AVB (Audio Video Bridging) to their Gigabit Ethernet MAC product family. The new Gigabit Ethernet MAC with AVB enables the transmission of audio and video streams synchronized within a microsecond of each other, with low delay, and with minimal lost data due to network congestion.

An AVB network implements a set of protocols developed by the IEEE 802.1 Audio/Video Bridging Task Group. There are four significant differences between the AVB MAC and standard 802 architectures; precise … Read More → "Arasan Chip Systems further expands its Ethernet portfolio by adding AVB (Audio Video Bridging)"

WiFi Front End Modules

December 13, 2012

RFMD’s new RFFM8xxx series provide complete integrated solutions in single front end modules (FEMs) for WiFi systems. The ultra-small form factor and integrated matching minimizes the layout area in the customer’s application and greatly reduces the number of external components. This simplifies the total front end solution by reducing the bill of materials, system footprint, and manufacturability cost. Each device is provided in a 2.5mm x 2.5mm x 0.45mm, 16-pin QFN package.

Features

Frequency:

RFFM8202 and RFFM8204: 2.4GHz to 2.5GHz
RFFM8502: 4.9GHz to 5.85GHz</ … Read More → "WiFi Front End Modules"

Imec Shows Path Toward Non-Si Devices at IEDM 2012

December 13, 2012

IEDM2012, San Francisco, USA – December 12, 2012 – At this week’s IEEE International Electron Devices Meeting (IEDM 2012), imec addressed key challenges of scaling beyond silicon-channel finFETs. Imec showed that channel mobility can be boosted by growing non-Si channels on a strain relaxed buffer (SRB), and demonstrated excellent scalability potential of the technology. Moreover, imec revealed insight on the unique influence oxide trapping has on the gate stack mobility in High-Mobility Ge and III-V channels.

For logic device technology, the industry previously used SiGe source/drain stressors to enhance the Si channel mobility. However, … Read More → "Imec Shows Path Toward Non-Si Devices at IEDM 2012"

DC/DC Converter from Diodes Incorporated Boosts Light Load Efficiency

December 13, 2012

Plano, Texas – December 13th, 2012 – Designed to help meet energy efficiency standards under light load and standby conditions, the AP65200 synchronous DC-DC buck converter from Diodes Incorporated achieves efficiency as high as 96% for a light load of 200mA and maintains efficiency above 70% down to 20mA. Its high level of integration and minimal external component count suits distributed power architectures in consumer electronics products, including TVs, monitors and set-top boxes.

Offering an input voltage range from 4.75V to 18V, the AP65200 provides a single device solution for both 5V and 12V bus systems, and delivers up … Read More → "DC/DC Converter from Diodes Incorporated Boosts Light Load Efficiency"

Nordic nRF8001-powered module from LiSeng makes bridging the gap between healthcare products and smartphones simple

December 13, 2012

Oslo, Norway – December 13, 2012 – Ultra low power (ULP) RF specialist Nordic Semiconductor ASA (OSE: NOD) today announces that Hong Kong-headquartered ODM LiSeng – a provider of design solutions from concepts to products – has developed and commercialized a Bluetooth® low energy module based on Nordic’s µBlue™ nRF8001 Single-Chip-Connectivity solution.

The module is a tested wireless device fully compatible with Bluetooth v4.0. The module is available in three sizes measuring from 15 by 22 mm to 23 by 33 mm and can be easily incorporated into a battery-powered healthcare product (or other portable consumer devices) without in-depth knowledge of RF … Read More → "Nordic nRF8001-powered module from LiSeng makes bridging the gap between healthcare products and smartphones simple"

Schneider Electric Selects Cypress 1-Mbit Serial nvSRAMs For Two New Programmable Automation Controllers

December 13, 2012

SAN JOSE, Calif., December 11, 2012 – Cypress Semiconductor Corp. (Nasdaq: CY) today announced that Schneider Electric has designed Cypress’s nonvolatile static random access memories (nvSRAMs) into two of its new programmable automation controllers. The Schneider BMXCRA31210 and BMXERT1604 controllers each employ Cypress’s CY14B101Q2 1-Mbit nvSRAM as a time-stamp buffer. When an event such as the closure of a switch or power line defect is detected, the nvSRAM records it in a rolling buffer. These types of events can occur an infinite number of times during the lifetime of a product, so it is critical to have a … Read More → "Schneider Electric Selects Cypress 1-Mbit Serial nvSRAMs For Two New Programmable Automation Controllers"

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