News – Page 1918 – EEJournal

Digi-Key Corporation Inks Global Distribution Agreement with Holt Integrated Circuits, Inc.

February 6, 2013

THIEF RIVER FALLS, Minnesota, USA and Mission Viejo, Calif., USA – Global electronic componentsdistributor Digi-Key Corporation, recognized by design engineers as having the industry’s largest selection of electronic components available for immediate shipment, today announced the addition of Read More → "Digi-Key Corporation Inks Global Distribution Agreement with Holt Integrated Circuits, Inc."

Agilent Technologies and Alcatel-Lucent Bell Labs Collaborate to Demonstrate Record-Breaking Optical Signaling Agilent Oscilloscopes Enable Record Interface Rates

February 5, 2013

SANTA CLARA, Calif., Jan. 29, 2013 – Agilent Technologies Inc. (NYSE: A) today announced it has demonstrated the world’s fastest complex-modulation optical interface rates. A joint team from Alcatel-Lucent Bell Labs and Agilent conducted experiments using Infiniium 90000 Q-Series oscilloscopes to transmit data over long-haul distances at a record interface rate.

The experiments relied on advanced detection systems and data analysis from Alcatel-Lucent Bell Labs and on the unmatched measurement performance of Agilent’s Infiniium 90000 Q-Series oscilloscopes to achieve PDM 16 QAM 1.28-terabit dual-carrier optical signaling.

The joint … Read More → "Agilent Technologies and Alcatel-Lucent Bell Labs Collaborate to Demonstrate Record-Breaking Optical Signaling Agilent Oscilloscopes Enable Record Interface Rates"

GLOBALFOUNDRIES and Samsung Support New Cadence Virtuoso Advanced Node for 20- and 14nm Processes

February 5, 2013

SAN JOSE, CA–(Marketwire – February 05, 2013) – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, announced today that two of its major foundry partners — Samsung Foundry and GLOBALFOUNDRIES — are supporting new Cadence® custom/analog technology targeting designs at the advanced nodes of 20 and 14 nanometers. The two foundries are providing SKILL-based process design kits (PDKs) for the newly introduced Cadence Read More → "GLOBALFOUNDRIES and Samsung Support New Cadence Virtuoso Advanced Node for 20- and 14nm Processes"

Phison Licenses Tensilica’s Dataplane Processor (DPU) for NAND Flash Memory Controllers and SSD Applications

February 5, 2013

SANTA CLARA, Calif. – February 5, 2013 –Tensilica®, Inc. today announced that Phison Electronics Corp., the Taiwanese global market leader in flash and USB controller technology, has licensed Tensilica’s Xtensa® dataplane processor unit (DPU).

From high-end, multi-processor SSDs to single-processor consumer flash, the Xtensa DPU combines both signal processing and control, scales efficiently across multiple product lines and delivers 10x to 100x performance efficiency required for manufacturers to produce, flexible and differentiated products.

“Tensilica’s DPUs allow us to create highly competitive products that are optimized for our unique flash architectures without … Read More → "Phison Licenses Tensilica’s Dataplane Processor (DPU) for NAND Flash Memory Controllers and SSD Applications"

Element Six Increases Volume Manufacturing of Synthetic Diamond Optical Components in Silicon Valley; An Enabler for Laser Produced Plasma Extreme Ultraviolet Lithography

February 5, 2013

SAN FRANCISCO—Feb. 4, 2013—At SPIE Photonics West 2013, Element Six, the world leader in synthetic diamond supermaterials and member of the De Beers Group of Companies, today announced its Silicon Valley facility has expanded its high volume manufacturing capabilities of synthetic diamond optical windows, a critical component of Laser Produced Plasma (LLP) Extreme Ultraviolet (EUV) lithography systems. Reaching a new milestone in Chemical Vapor Deposition (CVD) synthesis and processing, Element Six has increased its total production capacity of synthetic diamond wafers by 50 percent at its U.S. location, further scaling the … Read More → "Element Six Increases Volume Manufacturing of Synthetic Diamond Optical Components in Silicon Valley; An Enabler for Laser Produced Plasma Extreme Ultraviolet Lithography"

Inverting, Boost or Buck-Boost µModule Converter Delivers up to 700mA with Only Four Small Passive Components

February 5, 2013

MILPITAS, CA – February 5, 2013 – Linear Technology Corporation introduces the LTM8045, a 2.8V-18V input, multi-topology DC/DC µModule^® (micromodule) converter, with onboard inductor, power switch and DC/DC controller delivering up to 700mA output current. With the addition of only two resistors and two capacitors, the LTM8045 can be configured to regulate either a positive output voltage (SEPIC topology) between 2.5V and 15V or a … Read More → "Inverting, Boost or Buck-Boost µModule Converter Delivers up to 700mA with Only Four Small Passive Components"

Cadence and GLOBALFOUNDRIES Collaborate to Enable Custom/Analog and Digital Design of 20nm Manufacturing Process

February 5, 2013

SAN JOSE, CA–(Marketwire – February 05, 2013) – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, announced today that GLOBALFOUNDRIES has certified essential Cadence® technologies for custom/analog, digital and mixed-signal design, implementation, and verification for its 20-nanometer LPM technology. The certification covers the Virtuoso and Encounter platforms, including the industry-standard SKILL process design kit (PDK).

“As the leading innovators move to these smaller geometries, they are looking for tools that can keep up with their ever-changing needs,” said Andy Brotman, … Read More → "Cadence and GLOBALFOUNDRIES Collaborate to Enable Custom/Analog and Digital Design of 20nm Manufacturing Process"

SiTime Expands Portfolio with +125C MEMS Oscillators for Industrial and High Reliability Applications

February 4, 2013

SUNNYVALE, Calif. – January 23, 2013 – SiTime Corporation, the fastest growing semiconductor company, today introduced the SiT8920 MEMS oscillator for industrial and high reliability applications. Due to its unique silicon MEMS and analog architecture, the SiT8920 outperforms quartz oscillators in every major performance category. While operating over the widest temperature range, -55°C to +125°C, the SiT8920 consumes half the power of quartz oscillators, is twice as stable, 20 times more reliable and 30 times more robust to shock and vibration. These key benefits … Read More → "SiTime Expands Portfolio with +125C MEMS Oscillators for Industrial and High Reliability Applications"

Cavium Announces Carrier Grade, Enterprise Quality, Commercial Software Development Environment for All OCTEON® Processors

February 4, 2013

SAN JOSE, Calif., Jan. 31, 2013 /PRNewswire/ — Cavium, Inc. (NASDAQ: CAVM), a leading provider of highly integrated semiconductor products that enable intelligent processing for networking, communications and the digital home, today announced a new commercial software development environment for all OCTEON^® processors. Software Development Kit 3 (SDK 3) provides a fully integrated Carrier Grade quality Linux 3.x distribution and bare metal software capabilities that can take advantage of the wide range of hardware accelerators included in OCTEON processors. Cavium’s OCTEON family is the industry’s leading embedded multi-core processor line designed into enterprise, data center and service provider equipment including … Read More → "Cavium Announces Carrier Grade, Enterprise Quality, Commercial Software Development Environment for All OCTEON® Processors"

TU Dresden Realized 28nm Low Power Test Chip with Tensilica Processor and RacyICs Power Management in GLOBALFOUNDRIES Process

February 4, 2013

Dresden, GERMANY – February 4, 2013 –Technische Universität (TU) Dresden, a leading German university in the field of electrical engineering, today announced the successful initial operation of a low-power test-chip featuring a Tensilica Xtensa LX4 DSP equipped with RacyICs power management IP implemented in GLOBALFOUNDRIES’ advanced 28nm Super Low Power (SLP) technology. The chip is able to operate in a wide voltage and frequency range from 0.7V to 1.1V and 90 MHz to 1 GHz. Within that range, the optimal voltage/frequency combination is determined adaptively based on a new hardware performance monitor concept. The complete baseline IP (standard cell libraries, IO … Read More → "TU Dresden Realized 28nm Low Power Test Chip with Tensilica Processor and RacyICs Power Management in GLOBALFOUNDRIES Process"

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