News – Page 1916 – EEJournal

Saelig Introduces BoardMaster Universal PCB Test System

February 8, 2013

Pittsford, NY, USA: Saelig Company, Inc.(www.saelig.com) has introduced the ABI BoardMaster 8000 PLUS – a unique, versatile, self-contained, and easy-to-use PCB test system. The BoardMaster 8000 Plus is a comprehensive set of test instruments, complete with built-in PC, for testing and fault-finding on almost any kind of PCB. Incorporating a full range of test instruments in one compact box and offering a variety of available test methods, the BoardMaster 8000 PLUSprovides a cost-effective standalone … Read More → "Saelig Introduces BoardMaster Universal PCB Test System"

NIT Demos WidDy Sensor Board with Lattice’s HDR60 Camera Development Kit at SPIE Photonics West

February 8, 2013

San Jose, CA – February 6, 2013 – Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced that New Imaging Technologies (NIT) is demonstrating its WiDy Sensor board with the LatticeECP3™-based HDR60 Camera Development Kit at Photonics West in San Francisco.

Featuring NIT’s NSC1005C high-dynamic range sensors, WiDy is a proxy sensor board, specifically designed to work with Lattice’s HDR60 camera development platform. This combination enables the rapid development of highly-differentiated, value-driven, robust vision systems for automotive, industrial, surveillance, transportation, medical and consumer markets.

“The simple integration of NIT’s WiDy board and the HDR60 … Read More → "NIT Demos WidDy Sensor Board with Lattice’s HDR60 Camera Development Kit at SPIE Photonics West"

TI delivers AEC-Q100 low-voltage power management unit

February 7, 2013

DALLAS (February 7, 2013) – Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced a low-voltage power management unit with the fastest start-up time of under 10 mS for demanding instant-on automotive applications, such as graphical cluster, infotainment and advanced driver assistance systems (ADAS). The TPS659119-Q1 is optimized to work with TI’s automotive OMAP™ processors, including the DRA6x family (codenamed “Jacinto”) of infotainment processors, and other ARM® Cortex™-A offerings. In addition, the TPS659119-Q1 is factory-programmed and has customizable power-up and power-down sequencing based on the customer’s processor of choice and system power needs. For more information or to … Read More → "TI delivers AEC-Q100 low-voltage power management unit"

UMC Adopts Synopsys IC Validator for Pattern Matching-Based Lithography Hot-Spot Verification at 28 nm

February 7, 2013

MOUNTAIN VIEW, Calif., Feb. 7, 2013 /PRNewswire/ —

Highlights:

UMC and Synopsys collaborate to address the challenge of design verification for manufacturability at advanced process nodes
UMC adopts IC Validator pattern-matching technology to accelerate physical signoff at 28 nm
Collaboration adds new benefits to In-Design physical verification with IC Compiler for UMC customers

Synopsys, Inc. (Nasdaq: SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced that United Microelectronics Corporation (UMC) has selected Synopsys’ IC Validator physical … Read More → "UMC Adopts Synopsys IC Validator for Pattern Matching-Based Lithography Hot-Spot Verification at 28 nm"

Adding a display to a Raspberry Pi is a piece of cake with Adafruit’s new kits at Newark element14

February 7, 2013

CHICAGO — Feb. 7, 2013 — Raspberry Pi fans can now easily add a display to their devices thanks to three new Adafruit Pi Plate kits, which are available at leading electronics distributor Newark element14.

The kits enable a display to be added to the Raspberry Pi without the usual wiring difficulties; they can control a 16×2 Character LCD using only the two I2C pins on the Raspberry Pi, and I2C-based sensors and RTS can also share the same bus.

< … Read More →

Increased Computing Performance in New CompactPCI Serial SBC from MEN Micro

February 7, 2013

AMBLER, Pa. February 2013 – MEN Micro Inc., a world-renowned provider of embedded computing and I/O solutions for mission-critical industrial, mobile and harsh environment applications, offers its latest 3U CompactPCI Serial SBC, the G22.

With speeds up to 3.3 GHz using Turbo Boost functionality, the new Intel Quad Core i7-based board provides exceptional processing performance in data-intensive environments. The G22 also provides high graphics performance as well as state-of-the-art I/O functionality.

As the second CompactPCI Serial-based SBC … Read More → "Increased Computing Performance in New CompactPCI Serial SBC from MEN Micro"

Agilent Technologies and Distributors Host Seminar Series for Hands-on Electronic Test

February 7, 2013

What: Agilent’s complimentary A+ Seminar Series, given by its technical expert distributors, is designed to provide hands-on labs, working sessions, tips, techniques, best practices and skills development.

Included in the day:

Three two-hour labs on scopes, power supplies and RF
Certificate of completion for participants
Chance to win a U1273 OLED Handheld DMM

When: Available now

Where: Canada and the US at over fifty locations, www.agilent.com/find/APlusSeminarSeries, registration is required … Read More → "Agilent Technologies and Distributors Host Seminar Series for Hands-on Electronic Test"

Cadence Expands IP Portfolio With Agreement to Acquire Cosmic Circuits

February 7, 2013

SAN JOSE, CA–(Marketwire – February 07, 2013) –

Cadence Design Systems, Inc. (NASDAQ: CDNS)

Cosmic Circuits is a leading IP provider with an extensive silicon-proven analog and mixed signal portfolio
Provides IP for mobile devices including USB, MIPI, Audio and WIFI at advanced process nodes including 40nm and 28nm
Top tier customer base has shipped more than 50 million ICs containing Cosmic Circuits IP in 2012

Cadence Design Systems, Inc. (NASDAQ: Read More → "Cadence Expands IP Portfolio With Agreement to Acquire Cosmic Circuits"

Micron Technology Samples New Single-Sided DDR3 Dram Module and TE Connectivity Releases Compatible, Single-Sided DDR3 Module Connectors

February 7, 2013

BOISE, Idaho, and SHANGHAI, 2013-02-07 14:00 CET (GLOBE NEWSWIRE) — Micron Technology, Inc. (Nasdaq:MU), one of the world’s leading providers of advanced semiconductor solutions, and TE Connectivity (TE) (NYSE:TEL), a world leader in connectivity, announced today the availability of a Single-Sided SODIMM and a low-profile single-sided, double data rate 3 (DDR3) SODIMM connector solution to take advantage of the burgeoning market for Ultrabook™ devices, convertibles, tablets and other thin … Read More → "Micron Technology Samples New Single-Sided DDR3 Dram Module and TE Connectivity Releases Compatible, Single-Sided DDR3 Module Connectors"

Altium Designer 2013 Available

February 7, 2013

Shanghai, China – 7 February 2013 – Altium Ltd. <http://www.live.altium.com/> , a global leader in Smart System Design Automation and provider of solutions for 3D PCB design (Altium Designer <http://products.live.altium.com/> ) and embedded software development (TASKING <http://www.tasking.com/> ), announces the release of Altium Designer 2013.

This is a significant turning … Read More → "Altium Designer 2013 Available"