Microsemi Expands DDR3 SDRAM Family with 4GByte Solution for High-reliability Applications
ALISO VIEJO, Calif.—Nov. 2, 2011—Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced a DDR3 SDRAM memory device that is the first of its kind to be packaged in a single plastic ball grid array (PBGA) and offered as a compact x64/x72 unregistered dual in-line memory module (UDIMM )/small outline dual in-line memory module (SODIMM). The solution provides up to 4GByte compact memory densities that support high-performance processors and chipsets in mission-critical applications such as avionics, UAVs, missile systems and other defense applications that require high … Read More → "Microsemi Expands DDR3 SDRAM Family with 4GByte Solution for High-reliability Applications"