News – Page 1903 – EEJournal

Green Hills Software and LieberLieber Software Partner for End-to-end Model-driven Approach for Embedded Systems

March 1, 2013

Green Hills Software, the largest independent vendor of embedded software solutions, and LieberLieber, worldwide renowned model engineering specialists on Enterprise Architect from Sparx Systems, today announced their partnership. Driven by the demand of their customers to support an end-to-end model-driven approach for embedded systems, Green Hills Software’s MULTI^® integrated development environment (IDE) and LieberLieber’s AMUSE (Advanced Modeling Using Simulation and Execution) will be fully integrated to provide an enhanced toolchain with new debugging and testing capabilities at the modeling level directly connected … Read More → "Green Hills Software and LieberLieber Software Partner for End-to-end Model-driven Approach for Embedded Systems"

Android(TM) Meets Embedded Systems

March 1, 2013

MAZeT GmbH, a leading provider of Electronic Design and Manufacturing Services of opto-electronic and embedded computing solutions, present their new Android based solutions for embedded systems. Modern requirements for embedded systems are that defined tasks need to be solved at maximum efficiency. This is at limited usage of operating systems and at minimal hard- and software effort. Price performance-radio, reliability and flexible data rates are high in demand. Embedded systems often use modified versions of operating system, such as Embedded Windows, Linux or Android. For systems with high requirements on performance and reliability it is also recommended to … Read More → "Android(TM) Meets Embedded Systems"

Softing Industrial Automation standardizes on IAR Systems’ embedded development tools

March 1, 2013

Munich, Germany/Uppsala, Sweden—February 26, 2013—When it comes to designing communication modules, Softing Industrial Automation, a world leading provider of industrial communication products and technologies for manufacturing and process automation, continues to rely on embedded development tools from IAR Systems®. The recently signed enterprise agreement allows Softing’s development teams to flexibly shift licenses between their sites in Germany and Romania. They also gain high flexibility when it comes to the choice of platform, as the comprehensive IAR Embedded Workbench® supports more than 7,800 MCUs within different architectures.

“We have been working with IAR … Read More → "Softing Industrial Automation standardizes on IAR Systems’ embedded development tools"

New Uninterruptible Power Supply for Naval Applications from Gresham Power

March 1, 2013

Gresham Power Electronics, the Salisbury based Naval power conversion and distribution specialist, announces the release of the new 1RCQ10KA, 10KVA Uninterruptible Power Supply (UPS) for Naval applications.

The new Gresham UPS provides a battery supported, 115V, 60Hz single phase output to ship-board loads. It is supplied with a separate battery cabinet configured to support the vessel’s specific autonomy requirements.

Input is the ship’s standard 440V 3phase 60Hz supply. In normal operation, the rectifier float charges the battery while supplying the DC input to the inverter which then supplies the output. In the … Read More → "New Uninterruptible Power Supply for Naval Applications from Gresham Power"

element14 celebrates Raspberry Pi’s first birthday

February 28, 2013

London, 28 February 2013 –As the phenomenon that is Raspberry Pi celebrates its first birthday,element14is today launching “Raspberry Pi Month” with a series of initiatives to celebrate the outstanding success of the microcomputer.

Raspberry Pi made its European debut on the element14 stand at Embedded World 2012. To celebrate an extraordinary year for the category defining ARM based microcomputer, element14 presented key innovators behind Raspberry Pi, Co-Founder Pete Lomas, and ecosystem developer and Read More → "element14 celebrates Raspberry Pi’s first birthday"

Arasan announces eMMC 5.0 Total IP Solution at Mobile World Congress

February 28, 2013

Barcelona, Spain – February 28, 2013 – Arasan Chip Systems, Inc. (“Arasan”), a leading provider of Total IP Solutions, announced today support for the upcoming eMMC 5.0 specification which is proceeding to ratification within the JEDEC standards organization. With its November Pro Class 2000 Flash Memory Devices, Samsung announced that it would be submitting the specifications to JEDEC for standardization. The upcoming eMMC standard revision is expected to double the maximum speed of the current eMMC 4.51 devices from 200MB/s to 400MB/s. Responding to strong customer interest, Arasan has expanded its eMMC Total IP Solution to support the upcoming specification.

congatec Qseven Starter Kit for mobile embedded applications includes smart battery module

February 28, 2013

embedded world, Nuremberg, 26 February 2013 * * * congatec AG, a leading manufacturer of embedded computer modules, presents the Qseven Mobility Kit, a complete starter package for the rapid prototyping of battery-powered embedded systems.

Qseven embedded computer modules are an ideal solution for virtually any low-power or ultra mobile embedded PC application thanks to their compact size and minimum power consumption. To minimize development costs of such systems, congatec has combined all necessary components in a comprehensive starter kit.

In addition to a compact Qseven carrier board and a 7″ LVDS single touch display with LED backlight, the starter kit … Read More → "congatec Qseven Starter Kit for mobile embedded applications includes smart battery module"

Cypress’s TrueTouch® Solution with Single-Layer Sensor Powers Touchscreen on New Vanzo Smart Phone

February 28, 2013

SAN JOSE, Calif., February 26, 2013 – Cypress Semiconductor Corp. (Nasdaq: CY) today announced that Vanzo Communication Inc., a global provider of mobile handset solutions based in China, has selected the TrueTouch^® touchscreen solution for its X1 series Android smartphone. The touchscreen uses Cypress’s SLIM^®(Single-Layer Independent Multi-touch) sensor to deliver high-performance accuracy and responsiveness with a true single-layer sensor panel. The SLIM sensor enables the phone to track common gestures such as pinch, zoom, flick, drag, swipe, and others requiring more than two … Read More → "Cypress’s TrueTouch® Solution with Single-Layer Sensor Powers Touchscreen on New Vanzo Smart Phone"

Introducing The Intelligent Systems Conference & Pavilion At The Sensors Expo – June 2013

February 28, 2013

SAN CLEMENTE, California – Intelligent Systems Source (ISS), will be hosting three conference tracks and a pavilion located within the 2013 Sensors Expo in Chicago, Illinois during the two day conference from June 5-6.

With over 4,000 attendees in 2012, Sensors Expo is the ideal location to combine intelligent sensing technology with embedded computing, and intelligent systems. This year’s Conference & Pavilion hosts three major conference tracks including sessions on embedded computing, specialized medical device development, and what it means to be a part of the emerging intelligent systems community. Applications covered include: retail/point-of-service, digital signage, industrial control, data … Read More → "Introducing The Intelligent Systems Conference & Pavilion At The Sensors Expo – June 2013"

HGST Reaches 10nm Patterned-Bit Milestone, Nanotechnology Process Will Double Today’s Disk Drive Data Density

February 28, 2013

SAN JOSE, Calif., February 28, 2013 – HGST (formerly Hitachi Global Storage Technologies and now a Western Digital company, NASDAQ: WDC) is leading the disk drive industry to the forefront in nanolithography, long the exclusive purview of semiconductor manufacturers, by creating and replicating minute features that will allow the doubling of hard disk drive (HDD) density in future disk drives.

HGST Labs announced today they have combined two innovative nanotechnologies — self-assembling molecules and nanoimprinting — to create large areas of dense patterns of magnetic islands only 10 billionths of a meter (10 nanometers) wide. These features … Read More → "HGST Reaches 10nm Patterned-Bit Milestone, Nanotechnology Process Will Double Today’s Disk Drive Data Density"

featured blogs

Sci-Fi and Fantasy Books They Should Make into Movies

May 6, 2026

Hollywood has struck gold with The Lord of the Rings and Dune'so which sci-fi and fantasy books should filmmakers tackle next?...