News – Page 1900 – EEJournal

Merrick3 High Performance Computing Platform

November 14, 2011

Using advanced FPGA technology Merrick3 delivers an unrivalled scalable processing platform. Used stand alone, in a large multi-board system, or as a personal computer accelerator, it can deliver a processing capability up to 1000 times that of the more conventional X86 processor.

The Merrick3 is based on an array of 24 Xilinx™ Spartan™-6 FPGAs and 16 DDR3 memories. Supported by two further FPGAs offering high speed data communications and nearly instantaneous on the fly reconfiguration the platform delivers processing performance generally unobtainable in a standard personal computer.

NXP Delivers Breakthrough Class-AB and Class-D Audio Amplifiers for Start-Stop Systems

November 14, 2011

EINDHOVEN, NETHERLANDS–(Marketwire – Nov 14, 2011) – NXP Semiconductors N.V. (NASDAQ:NXPI)

New amplifiers enable uninterrupted in-car entertainment in energy-saving vehicles
NXP is first with both Class-AB and Class-D supporting 6V requirement in volume production

NXP Semiconductors N.V. (NASDAQ: NXPI) today announced the availability of two new automotive audio amplifiers supporting energy-saving Read More → "NXP Delivers Breakthrough Class-AB and Class-D Audio Amplifiers for Start-Stop Systems"

Microchip Launches Global Technical Training Series That Shows How to Easily Move Applications Among 8, 16 and 32-bit PIC® MCUs

November 14, 2011

CHANDLER, Ariz., Nov. 14, 2011 [NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, analog and Flash-IP solutions, today announced a worldwide series of technical training seminars—beginning in January—that will show designers how to easily adapt to changing product requirements by migrating a real-world application from 8, to 16, to 32-bit PIC^®microcontrollers (MCUs). These one-day classes will teach engineers how to migrate the application … Read More → "Microchip Launches Global Technical Training Series That Shows How to Easily Move Applications Among 8, 16 and 32-bit PIC® MCUs"

6WIND Announces Low-Latency Packet Processing Software for High-Frequency Trading Equipment

November 14, 2011

PARIS, France, November 14, 2011 — 6WIND, the industry standard for commercial multicore packet processing software, today announced the availability of a low-latency network layer as part of its 6WINDGate™ software solution. Optimized for high-frequency trading (HFT) applications, 6WINDGate provides low-latency protocols such as TCP Proxy (Termination and Retransmission), IP Forwarding and firewall. Along with 6WINDGate’s high-performance routing capabilities, these enhancements allow HFT Networking Equipment manufacturers to provide solutions without difficult-to-maintain, custom hardware technologies based on FPGAs or ASICs.

On GE’s WANic 56512 IP packet processor board, configured with a 750MHz Cavium OCTEON … Read More → "6WIND Announces Low-Latency Packet Processing Software for High-Frequency Trading Equipment"

Renesas Electronics and Renesas Mobile to License Imagination Technologies’ PowerVR Series6 Graphics Technologies

November 14, 2011

LONDON, UK and TOKYO, Japan, November 14, 2011–Imagination Technologies Group plc (LSE: IMG; “Imagination”), a leader in System-on-Chip Intellectual Property (“SoC IP”), Renesas Electronics Corporation (TSE: 6723; “Renesas”), a premier provider of advanced semiconductor solutions, and Renesas Mobile Corporation (“Renesas Mobile”), a wholly owned subsidiary of Renesas Electronics and an innovative supplier of advanced cellular semiconductor solutions and platforms, today announced that Imagination and Renesas Electronics signed a multiuse license agreement for IP from Imagination’s PowerVR Series6 ‘Rogue’ graphics family.

Renesas Mobile will initially deploy Imagination’s technologies in its … Read More → "Renesas Electronics and Renesas Mobile to License Imagination Technologies’ PowerVR Series6 Graphics Technologies"

Lamachan2 Extreme I/O Solution

November 14, 2011

Using a Xilinx™ Spartan™-6 FPGA to support a high performance PCI Express interface and large I/O count Lamachan2 offers an extreme I/O solution for High Performance Computing (HPC) systems. It is also capable of forming the basis of a low cost processing accelerator or even a combined I/O / accelerator processing solution.

Lamachan2 supports I/O solutions up to and including 266 I/O. Plugging in standard DIL modules, available directly from Enterpoint, allows the rapid construction of a wide range of I/O, communications, and … Read More → "Lamachan2 Extreme I/O Solution"

High-Voltage and Lowest Noise, Autozero Op Amp Extends System Uptime and Improves Sensor Performance

November 14, 2011

SUNNYVALE, CA—November 14, 2011—Maxim Integrated Products (NASDAQ: MXIM) introduces the MAX44251 a 20V, ultra-precise, low-noise dual op amp that extends maintenance system uptime and maximizes sensor performance. Proprietary autozero technology enables continuous self-calibration which, in turn, ensures system accuracy over time, temperature, and power-supply variations. The precision (< 6µV initial offset) over the wide 2.7V to 20V operating range is unmatched by the competition. This excellent precision improves system accuracy and minimizes errors during signal conditioning. The accuracy over the extended voltage range also makes the op amp more flexible for … Read More → "High-Voltage and Lowest Noise, Autozero Op Amp Extends System Uptime and Improves Sensor Performance"

Cadence Wins TSMC EDA Partner Award for 3D-IC Technology

November 14, 2011

SAN JOSE, CA–(Marketwire – November 14, 2011) – Cadence was cited for helping implement an interposer test vehicle using Cadence standard 3D-IC solutions that employed through-silicon vias (TSV). The project involved a system-on-chip (SoC) and eDRAM integrated on a silicon interposer.Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that TSMC has recognized Cadence with a TSMC EDA Partner Award for its 3D-IC technology. The award underscores the R&D investment from Cadence for this emerging technology, which … Read More → "Cadence Wins TSMC EDA Partner Award for 3D-IC Technology"

Dual Output Synchronous Step-Down Controller Produces 1.5VOUT From Up To 24VIN at 2MHz

November 14, 2011

MILPITAS, CA – November 14, 2011 – Linear Technology Corporation introduces the LTC3838, a high frequency controlled on-time dual output synchronous step-down DC/DC controller with differential output voltage sensing and clock synchronization. The controlled on-time, valley current-mode architecture enables a very fast transient response by increasing its operating frequency during a transient event, enabling the LTC3838 to recover from a large load … Read More → "Dual Output Synchronous Step-Down Controller Produces 1.5VOUT From Up To 24VIN at 2MHz"

eSilicon uses Magma to Tape Out 28-nm 1.5GHz Microprocessor Cluster for Embedded Platforms

November 11, 2011

SAN JOSE, Calif., Nov. 10, 2011 – Magma® Design Automation Inc. (Nasdaq: LAVA), a provider of chip design software, today announced that eSilicon Corporation, the largest independent semiconductor value chain producer (VCP), used Magma software to tape out a three-way microprocessor cluster based on MIPS’ leading-edge MIPS32® 1074Kf™ Coherent Processing System (CPS). Typical performance of the cluster is expected to be approximately 1.5GHz with worst-case performance of 1GHz. By leveraging Magma’s Talus® IC implementation platform and the Talus-Flow-Manager-Based Reference Flow for GLOBALFOUNDRIES’ 28nm-SLP process technology, eSilicon was able to achieve an impressive performance … Read More → "eSilicon uses Magma to Tape Out 28-nm 1.5GHz Microprocessor Cluster for Embedded Platforms"