News – Page 1898 – EEJournal

IAR Systems boosts functionality for STMicroelectronics’ STM8 tools

March 13, 2013

Uppsala, Sweden—March 13, 2013—Today, IAR Systems® launches a new version of its world-leading development tools for STMicroelectronics’ STM8. The new version 1.40 of IAR Embedded Workbench® for STM8 adds user-friendly functionality in the form of a new text editor and source browser, integration with the version control system Subversion and new license management features. Also added is support for additional devices and a new debugging guide.

IAR Systems’ new text editor is introduced, providing time-saving functionality such as code completion, parameter hints, code folding, block select and indent, bracket matching, zooming and word/paragraph … Read More → "IAR Systems boosts functionality for STMicroelectronics’ STM8 tools"

Tektronix Announces 400G Multi-carrier Superchannel Coherent Modulation Analysis

March 13, 2013

BEAVERTON, Ore., March 13, 2013 – Tektronix, Inc., a leading worldwide provider of test, measurement and monitoring instrumentation, today announced a new software option for its OM4000 <http://www.tek.com/optical-modulation-analyzer/om4000> optical modulation analyzer series that offers automated test support for 400G multi-carrier coherent optical modulation. This software option will greatly reduce test times for researchers working on 400G and faster coherent optical systems while providing the flexibility to define carrier count, carrier spacing and modulation formats. It also provides compiled carrier measurement results … Read More → "Tektronix Announces 400G Multi-carrier Superchannel Coherent Modulation Analysis"

Dual 750mA/250mA Linear LDO Regulator with Independent Inputs Offers Ultralow Noise

March 13, 2013

MILPITAS, CA – March 13, 2013 – Linear Technology Corporation announces the LT3030, a dual low noise, low dropout regulator with independent inputs and independent shutdown control for each channel. The device delivers continuous output current up to 750mA on one channel and 250mA on the other channel, with a low dropout voltage of only 300mV at full load. The LT3030 features a wide 1.8V to 20 … Read More → "Dual 750mA/250mA Linear LDO Regulator with Independent Inputs Offers Ultralow Noise"

HDL Design House Announces PCS IP Core

March 12, 2013

Belgrade, Serbia – March 12^th, 2013 – HDL Design House, provider of high performance digital and analog IP cores and SoC design and verification services, has announced availability of its Physical Coding Sublayer (PCS) IP core (HIP 500) which enables transmission and reception of data via 8-Lanes SerDes interface. It is able to multiplex a synchronous data stream over 8 Lanes, while guaranteeing data alignment and super-frame synchronization.

The PCS is responsible for generation of idle characters, lane striping and encoding on transmission and decoding, lane alignment and restriping on reception. … Read More → "HDL Design House Announces PCS IP Core"

Open source RF hardware project to further innovation using wireless communications spectrum

March 12, 2013

12 March 2012, Guildford, UK: Lime Microsystems has launched an open-source RF initiative to widen the community of developers and aid RF innovation.

Launched as a non-profit initiative, Myriad-RF aims to give both hobbyists and experienced design engineers a range of low-cost RF boards and free design files available for general use. Future board designs will come from the wider Myriad-RF community, with the first board (Myriad-RF 1) designed by Taiwanese distributor Azio Electronics.

Myriad-RF boards use field programmable RF (FP-RF) transceivers to operate on all mobile broadband standards – LTE, HSPA+, CDMA, 2G – … Read More → "Open source RF hardware project to further innovation using wireless communications spectrum"

Digi-Key Corporation and E Ink Sign Global Distribution Agreement

March 12, 2013

THIEF RIVER FALLS, Minnesota, USA – Global electronic components distributor Digi-Key Corporation, the industry leader in electronic component selection, availability and delivery, today announced a global distribution agreement with E Ink. This partnership … Read More → "Digi-Key Corporation and E Ink Sign Global Distribution Agreement"

TI introduces smart bypass diode with industry’s lowest power dissipation

March 12, 2013

DALLAS (Mar. 12, 2013) – Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced a smart bypass diode in a standard surface-mount package with 15-A current handling capability and the industry’s lowest power dissipation. In a typical application, each SM74611 lowers power dissipation by 80 percent and reduces the operating temperature inside the junction box by 50 degrees C when compared with a similar box using three conventional … Read More → "TI introduces smart bypass diode with industry’s lowest power dissipation"

FloorDirector 3.5 Provides Significant Dynamic Power Integrity Benefits at 28 nm

March 12, 2013

COPENHAGEN, Denmark, March 13th, 2013 – Teklatech®, an industry leader in EDA solutions for achieving dynamic power integrity and power noise closure in System-on-Chip (SoC) designs, today announced the release of version 3.5 of its FloorDirector® tool. FloorDirector enables Dynamic Power Shaping™ leading to reduced peak current demand, dynamic voltage drop and digital power noise in ASIC designs. Version 3.5 provides significant speed-ups, major usability enhancements, and an innovative new Pulse Softening™ capability, helping designers at 28 nm and below to achieve benefits on primary design targets such as yield, area and performance.

Dr. Tobias Bjerregaard, CEO and Founder of Teklatech, comments: “ … Read More → "FloorDirector 3.5 Provides Significant Dynamic Power Integrity Benefits at 28 nm"

Cadence Acquires Tensilica

March 12, 2013

SAN JOSE, CA., 12 Mar 2013

HIGHLIGHTS:

Tensilica® dataplane processing units (DPUs) combined with Cadence® Design IP will deliver more optimized IP solutions for mobile wireless, network infrastructure, auto infotainment and home applications.
Tensilica IP complements industry-standard processor architectures, providing application-optimized subsystems to increase differentiation and get to market faster.
More than 200 licensees, including system OEMs and seven of the top 10 semiconductor companies, have shipped over 2 billion Tensilica IP cores.

Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today … Read More → "Cadence Acquires Tensilica"

EV Group Extends Wafer Bonding Equipment and Process Solutions for Covalent Bonding Technology

March 11, 2013

ST. FLORIAN, Austria, March 5, 2013 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is developing equipment and process technology to enable covalent bonds at room temperature. This breakthrough technology will be available on a new equipment platform, called EVG580® ComBond®, which will include process modules that are designed to perform surface preparation processes on both semiconductor materials and metals. EVG built on its decades of experience with plasma activated wafer bonding to create a novel process through which the treated surfaces form strong bonds at … Read More → "EV Group Extends Wafer Bonding Equipment and Process Solutions for Covalent Bonding Technology"