News – Page 1884 – EEJournal

Green Hills Software Announces INTEGRITY Multivisor for Trusted Mobile Devices Version 4

March 11, 2013

Green Hills Software, the largest independent supplier of embedded and mobile virtualisation solutions, has announced a major new release of itsINTEGRITY^® Multivisor™ for Trusted Mobile Devices. For the first time, enterprise and government mobile device users and administrators can take advantage of off-the-shelf mobile phones and tablets for both personal and business use, with both parties having complete confidence in security and privacy. Shipping since 2003, INTEGRITY Multivisor is the … Read More → "Green Hills Software Announces INTEGRITY Multivisor for Trusted Mobile Devices Version 4"

Xilinx Showcases 400G Applications for Optical and Wired OTN Markets at OFC 2013

March 11, 2013

Mar 11, 2013 – SAN JOSE, Calif., March 11, 2013 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) will demonstrate 400G optical and wired OTN applications based on its 7 series All Programmable FPGAs and recently announced portfolio of SmartCORE™ IP. These demonstrations highlight Xilinx’s commitment to address the growing ASIC and ASSP gaps for wired networks, enabling customers to design and deliver smarter and more efficient communications systems for next-generation Read More → "Xilinx Showcases 400G Applications for Optical and Wired OTN Markets at OFC 2013"

Aldec Releases Plot Window to Increase Productivity of Traditional Waveform-Based HDL Debugging

March 11, 2013

Henderson, NV – March 11, 2013 – Aldec, Inc. announces the latest release of its mixed-language advanced verification platform, Riviera-PRO™ 2013.02. This release includes numerous enhancements, including visual debugging tools that improve the presentation of simulation results for increased overall verification efficiency. Riviera-PRO 2013.02 includes a Plot window supporting four different plot types to enable more efficient visualization of large data sets, as well as the ability to visualize and analyze relations between any objects within a design with no additional programming required.

Lattice Announces World’s Smallest FPGA for Miniature Systems

March 11, 2013

Hillsboro, Oregon – March 11, 2013 – Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced the iCE40 LP384 FPGA, the smallest member of its expanding iCE40 family of ultra-low density FPGAs. Enabling designers to rapidly add new features and differentiate cost-sensitive, space-constrained, low-power products, the new small footprint FPGA is ideal for applications such as portable medical monitors, smartphones, digital cameras, eReaders, and compact embedded systems.

The tiny, low- power, low cost iCE40 LP384 FPGA has a capacity of 384 LUTs; consumes 25- Microwatts static core power; comes in packages as small as 2.5 mm x 2.5 mm with a migration path to 2.0 … Read More → "Lattice Announces World’s Smallest FPGA for Miniature Systems"

PCB Piezotronics Releases New 60,000 G MEMS Piezoresistive Triaxial Shock Accelerometer

March 11, 2013

March 1, 2013, Depew, NY – PCB Piezotronics, Inc., introduces a new triaxial High-G MEMS, Piezoresistive Triaxial Shock Accelerometer. The unit features an unique 45 degree package orientation, with DC response, damping and mechanical stops for over-range protection. PCB Model 3503A1060KG contains three silicon MEMS sensing elements. The sensor is designed for shock testing, and is packaged in atitanium housing, with two through-holes for 4-40 mounting screws and has a measuring range of 60,000 G and minimum zero-shift after a shock. The new sensor compliments PCB’s 20,000 G triaxial Model 3503A1020KG.

The accelerometer is … Read More → "PCB Piezotronics Releases New 60,000 G MEMS Piezoresistive Triaxial Shock Accelerometer"

CUI’s Baseplate-Cooled Ac-Dc Power Supplies Deliver 355 W at 93.5% Efficiency

March 7, 2013

TUALATIN, Ore. – March 5, 2013 – CUI Inc announces a family of compact ac-dc power supplies featuring baseplate-cooling. The VBM-360 series offers exceptionally high power density of 14.8 W/in3, providing 355 W in an industry standard footprint.

The space-saving power supplies are housed in two optional case styles: a compact open frame version measuring 5 x 3 x 1.6 inches (127.00 x 76.00 x 40.60 mm) and an enclosed version. Featuring typical efficiency above 93%, the power supplies are designed for applications where forced-air cooling is not preferred due to audible noise or space limitations. The VBM series is also ideally suited for sealed-box applications … Read More → "CUI’s Baseplate-Cooled Ac-Dc Power Supplies Deliver 355 W at 93.5% Efficiency"

Dongbu HiTek and Cortus to develop joint Platform Solution for the Microcontroller (MCU) Market

March 7, 2013

Montpellier, France and Seoul, Korea, March 5th, 2013 – Cortus, a technology leader in cost effective, silicon efficient, 32-bit processor IP, and speciality foundry Dongbu HiTek, announce that they are teaming up to offer platform solutions. The design platforms will be based on the Dongbu HiTek 0.13µm eFlash technology and energy efficient Cortus APS3R processor and peripheral IP.

Cortus S.A. licenses a range of 32-bit processor cores for embedded systems. The cores provide licensees with a scalable choice in embedded computational performance and silicon area to meet a wide variety of application needs.

STMicroelectronics Makes Analog 130nm H9A CMOS Process Available Through CMP

March 7, 2013

Rousset and Grenoble, France, 7 March 2013 – STMicroelectronics (NYSE:STM) and CMP (Circuits Multi Projets®) today announced that ST’s CMOS H9A process (at 130nm lithography node), which offers a large panel of analog and digital devices, is now available for prototyping to universities, research labs and design companies through the silicon brokerage services provided by CMP. The diffusion of the silicon wafers will take place at the ST plant in Rousset, near Aix-en-Provence (France). ST is releasing this process technology to … Read More → "STMicroelectronics Makes Analog 130nm H9A CMOS Process Available Through CMP"

Cadence Announces First Commercially Available Design IP and Verification IP for Mobile PCI Express

March 7, 2013

SAN JOSE, CA–(Marketwire – March 07, 2013) – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today introduced the first commercially available design IP (IP) and verification IP</ … Read More → "Cadence Announces First Commercially Available Design IP and Verification IP for Mobile PCI Express"

Digi-Key Corporation and MEMSIC Announce Global Distribution Agreement

March 7, 2013

THIEF RIVER FALLS, Minnesota, USA – Global electronic components distributor Digi-Key Corporation, the industry leader in electronic component selection, availability, and delivery, today announced the signing of a global distribution agreement with MEMSIC, a leading provider of MEMS sensor components, … Read More → "Digi-Key Corporation and MEMSIC Announce Global Distribution Agreement"