News – Page 1880 – EEJournal

Docea Power Unveils New Release of Aceplorer and AceThermalModeler, Enables Dynamic Power and Thermal Management Analysis with Real Use Cases

March 18, 2013

Grenoble, France and San Jose, CA – March 14, 2013 – Docea Power, the design-for-low-power company that delivers software solutions for power and thermal analysis at the architectural level, today announced new releases of Aceplorer 3.1 and AceThermalModeler 2.0.

Aceplorer 3.1 features a new solver for coupled power and thermal transient simulations featuring 1000x performance gains over the previous versions and a communication protocol enabling the co-simulation of Aceplorer … Read More → "Docea Power Unveils New Release of Aceplorer and AceThermalModeler, Enables Dynamic Power and Thermal Management Analysis with Real Use Cases"

World’s first Bluetooth low energy watch and color touchscreen control and display device for smartphones employs Nordic Semiconductor nRF51822 SoCs

March 18, 2013

Oslo, Norway – March 18, 2013 – Ultra low power (ULP) RF specialist Nordic Semiconductor ASA (OSE: NOD) today announces that Hong Kong-headquartered Dayton Industrial Co. Ltd – a world leading OEM/ODM (Original Equipment/Design Manufacturer) of wireless monitors and associated products (such as watches and bike computers) for top global sports & fitness consumer brands – is announcing a production-ready watch and touchscreen display device that can control smartphones and installed apps from a user’s wrist using Bluetooth low energy (which includes Bluetooth Smart) wireless technology delivered by the multiple award-winning Nordic nRF51822 SoC.

LEAP 2013 Conference to Showcase the Latest Advances in the Application of Parallel Computing Technology on Low-Energy Mobile CPU/GPU, FPGA and Embedded Devices

March 18, 2013

LONDON, England – 11th Mar 2013, LEAP, the first conference and networking event focused exclusively on the use of parallel computing technology on low-energy devices, today announced keynote speakers from Khronos and ARM will present at the conference and thatpre-registration is now open for delegates. LEAP 2013 takes place in London on May 21^st – 22^nd.

Low-Energy parallel computing is a new space, with new technologies, new applications, new opportunities and new issues to discuss. LEAP 2013 will give developers, researchers, engineers and technology managers the … Read More → "LEAP 2013 Conference to Showcase the Latest Advances in the Application of Parallel Computing Technology on Low-Energy Mobile CPU/GPU, FPGA and Embedded Devices"

JTAG CoreCommander checks-out FPGA Zone

March 18, 2013

Eindhoven, The Netherlands, March 2013 –CoreCommander for FPGAs, from JTAG Technologies, offers a generic solution based on VHDL code that allows engineers to bridge from the standard JTAG test and programming port (TAP) to proprietary IP cores (e.g. DDR controllers, E-net MAC, USB controllers etc.) and harness them for test purposes. Forming part of its exciting range of ETP (Embedded Test and Programming) products, CoreCommander FPGA is aimed primarily at hardware design and test engineers.

The base of CoreCommander for FPGAs uses a translator block to access proprietary IP cores through commonly … Read More → "JTAG CoreCommander checks-out FPGA Zone"

Peratech working on “Nose in clothes” and touch technology for wearable electronics

March 18, 2013

RICHMOND, North Yorks, England – 18 March 2013. Peratech, the innovators in touch technology, is working with the London College of Fashion, University of the Arts London to develop wearable electronics that use Peratech’s award-winning QTC sensors. This is a three and a half year PhD research project funded by an EPSRC ICASE award to explore the needs base and applications for wearable technology bringing together the expertise of industry and academe in a highly creative way.

“We are very excited to be involved in this project,” said David Lussey, Peratech’s CTO. “Our QTC™ materials have already been … Read More → "Peratech working on “Nose in clothes” and touch technology for wearable electronics"

TI introduces industry-leading High-Performance Interleaved Power Factor Correction (PFC) Kit and introductory Digital Power Workshop Kit

March 18, 2013

Houston, TX (March 18, 2013) – Digital power designs are now even easier with two new development kits from Texas Instruments Incorporated (TI) (NASDAQ: TXN). The TI C2000™ microcontroller (MCU) Interleaved Power Factor Correction (PFC) Kit offers best-in-class efficiency, power factor (PF) and total harmonic distortion (THD) performance, supporting advanced power metering functions and alternating current (AC) lines. The first of its kind, providing complete training materials, the Digital Power … Read More → "TI introduces industry-leading High-Performance Interleaved Power Factor Correction (PFC) Kit and introductory Digital Power Workshop Kit"

Tektronix Unveils Next Generation High Performance AWG Series

March 18, 2013

BEAVERTON, Ore., March 18, 2013 – Tektronix, Inc., a leading worldwide provider of test, measurement and monitoring instrumentation, today unveiled its next generation of arbitrary waveform generators <http://www.tek.com/awg70000> that offer up to 50 GS/s sample rate performance. With the industry’s best combination of high sample rate, long waveform memory and deep dynamic range, the new AWG70000 Series supports a wide range of demanding signal generation requirements in defense electronics, high-speed serial, optical networking and advanced research applications.

Tektronix Demonstrates MIPI® Alliance M-PHY® Test Solution with Synopsys Silicon-Proven HS-Gear3 M-PHY IP

March 15, 2013

BEAVERTON, Ore., March 14, 2013 – Tektronix, Inc., a leading worldwide provider of test, measurement and monitoring instrumentation today announced the industry’s first demonstration of a M-PHY test solution for silicon-proven HS-Gear3 IP, a key part of the MIPI Alliance M-PHY physical layer specification for mobile devices. The Tektronix test solution allows designers to quickly and efficiently characterize designs and verify performance, ensure compliance with M-PHY specifications or quickly isolate problems. Silicon proven IP helps semiconductor vendors adopt new standards based on M-PHY such as … Read More → "Tektronix Demonstrates MIPI® Alliance M-PHY® Test Solution with Synopsys Silicon-Proven HS-Gear3 M-PHY IP"

Agilent Technologies Integrates Device Modeling Flow with Shipment of Newest SPICE Model Extraction and Qualification Software

March 15, 2013

SANTA CLARA, Calif., March 13, 2013 – Agilent Technologies Inc. (NYSE: A) today announced shipment of the latest release of its industry-leading SPICE model extraction tool,Model Builder Program, and SPICE qualification tool, Model Quality Assurance.

MBP and MQA 2013 feature major enhancements designed to enable device modeling engineers to deliver higher-quality models to their customers. Chief among them are a fully integrated data flow across Agilent’s device modeling platform and the ability to establish and enforce standard … Read More → "Agilent Technologies Integrates Device Modeling Flow with Shipment of Newest SPICE Model Extraction and Qualification Software"

Mentor Graphics Empowers 32-bit Microcontroller Development with Connectivity and a Small Footprint Binary RTOS with Nucleus SmartFit

March 15, 2013

WILSONVILLE, Ore., March 15, 2013— Mentor Graphics Corporation (NASDAQ: MENT) today announced the Nucleus® SmartFit product, a cost-effective, binary version of the Nucleus RTOS (real time operating system) optimized to fit the limited internal memory of 32-bit MCUs. The Nucleus SmartFit product also includes Sourcery™ CodeBench development tools and provides developers with broad connectivity and power consumption options for developing products based on 32-bit microcontrollers (MCUs).

“32-bit MCUs provide an ideal hardware platform for devices that connect themselves to the Internet, such as those in machine-to-machine (M2M) applications or the Internet of Things,” said Scot … Read More → "Mentor Graphics Empowers 32-bit Microcontroller Development with Connectivity and a Small Footprint Binary RTOS with Nucleus SmartFit"

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