News – Page 1872 – EEJournal

Altera Quartus II Software v13.0 Enables World’s Fastest FPGA Designs

May 6, 2013

San Jose, Calif., May 6, 2013—Altera Corporation (NASDAQ: ALTR) today announced the release of its Quartus® II software version 13.0, which delivers the highest levels of FPGA and SoC performance and designer productivity. Users targeting 28 nm FPGAs and SoCs will experience on average a 25 percent reduction in compile times. The most difficult-to-close designs targeting high-end 28 nm Stratix® V FPGAs will see compilation … Read More → "Altera Quartus II Software v13.0 Enables World’s Fastest FPGA Designs"

Molex Introduces Next-Generation High-Performance, Ultra-Low Power Memory Technology

May 6, 2013

LISLE, IL – May 1, 2013 – Molex Incorporated has introduced a portfolio of aerodynamic DDR3 DIMM sockets and Read More → "Molex Introduces Next-Generation High-Performance, Ultra-Low Power Memory Technology"

Starter Kit for COM Express™ Type 6 Modules with AMD Embedded R-Series APUs

May 3, 2013

Stutensee, Germany – For quick evaluation and prototyping of embedded systems based on COM Express^™ modules with AMD Embedded R-Series Accelerated Processing Unit (APU), MSC Vertriebs GmbH offers a complete starter kit. The intelligent starter kit MSC C6-SK-A7-T6T2 contains a COM Express^™ Type 6 baseboard, an active heat sink with fan and two DDR3 memory modules. Users of the kit are free to choose one of four COM Express^™ Type 6 computer modules with Embedded R-Series APU from MSC’s MSC C6C-A7 product family. Furthermore, the starter kit is also offered … Read More → "Starter Kit for COM Express™ Type 6 Modules with AMD Embedded R-Series APUs"

Agilent Technologies’ X-Series Signal Generator Enhancements Enable Faster, More Effective Verification

May 3, 2013

SANTA CLARA, Calif., May 1, 2013 – Agilent Technologies Inc. (NYSE: A) today introduced several key enhancements to its high-performance MXG and cost-effective EXG X-Series vector signal generators.

The enhancements are designed to improve measurement accuracy, accelerate research and development, and provide in-depth signal simulation for even the most comprehensive receiver verification. These enhancements, coupled with the unmatched performance of Agilent’s X-Series signal generators, make these systems ideal for component and receiver development in RADAR, military communications and consumer wireless applications.

“The ongoing innovation and … Read More → "Agilent Technologies’ X-Series Signal Generator Enhancements Enable Faster, More Effective Verification"

AMP’s New 4 Channel H.264 Encoder boasts less than 40ms compression delay

May 3, 2013

New York, USA and Cambridge, England, May 3, 2013 – AMP today announced immediate availability of its lowest latency H.264 encoding engine in a PCI-104 form factor.

Targeted at video distribution applications which demand a near real-time user experience, the H264ULL encodes four full frame rate, full resolution video inputs in parallel with latency of less than 4oms on all channels and with minimal CPU overhead. When paired with AMPs H264ULL-Decoder, glass-to-glass latency of less than 100ms is achieved.

Applications such as tele-op (teleoperation) of high speed vehicles and precise remote manipulation of objects across a … Read More → "AMP’s New 4 Channel H.264 Encoder boasts less than 40ms compression delay"

STMicroelectronics Increases Accessibility of MEMS Motion Portfolio by Simplifying Connection to Linux Systems

May 3, 2013

Geneva, May 2, 2013 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, the world’s top MEMS manufacturer, and the leading supplier of MEMS sensors for consumer and portable applications^[1], has simplified the use of MEMS in a wider range of applications by releasing ready-to-use software drivers for communication with Linux systems.

ST’s new driver architecture is supported in the latest revision of Linux Kernel</ … Read More → "STMicroelectronics Increases Accessibility of MEMS Motion Portfolio by Simplifying Connection to Linux Systems"

MEMS Industry Group’s ‘Sensor Performance Parameter Definitions’ Empowers Consumer-Platform Developers

May 2, 2013

PITTSBURGH—May 2, 2013—MEMS Industry Group (MIG) today publicly released “Standardized Sensor Performance Parameter Definitions,” a collaboratively authored document that identifies the performance parameter specifications of accelerometers, magnetometers, gyroscopes, pressure sensors, hygrometers, temperature sensors, ambient light sensors and proximity sensors. The MIG document, co-authored by Ken Foust of Intel and Carlos Puig of Qualcomm Technologies, Inc., is one of the first to provide apples-to-apples comparisons of disparate micro-electromechanical systems (MEMS) sensors from diverse sensor vendors. It is designed to allow chipset manufacturers, consumer-platform providers, original equipment manufacturers (OEMs), original … Read More → "MEMS Industry Group’s ‘Sensor Performance Parameter Definitions’ Empowers Consumer-Platform Developers"

Micron Unveils New PCIe I/O Accelerator

May 2, 2013

BOISE, Idaho, 2013-05-02 00:19 CEST (GLOBE NEWSWIRE) — Micron Technology, Inc. (Nasdaq:MU) today announced a new PCIe all-flash I/O accelerator to improve overall performance in enterprise servers, appliances and storage platforms. The new Micron P420m combines consistent performance with the inherent power efficiency of an all-flash system to deliver improved economics for enterprise data centers. The P420m accelerates performance of today’s demanding data center applications, including online transaction processing (OLTP), data warehousing and virtualization.

Ultimately, Micron’s P420m Read More → "Micron Unveils New PCIe I/O Accelerator"

InvenSense® Unveils World’s Lowest Profile 6-Axis MotionTracking Device

May 2, 2013

SUNNYVALE, Calif., May 2, 2013 – InvenSense, Inc. (NYSE: INVN), the leading provider of Read More → "InvenSense® Unveils World’s Lowest Profile 6-Axis MotionTracking Device"

MOSIS collaborates with imec, Tyndall and ePIXfab to offer advanced silicon photonics technology

May 2, 2013

Leuven, (Belgium), May 2, 2013 – MOSIS, a provider of low-cost prototyping and small volume production services for custom ICs, teams up with ePIXfab, the European Silicon Photonics support center providing low-cost prototyping services for photonic ICs. The partnership gives MOSIS’ customers access to imec’s state-of-the-art fully integrated silicon photonics processes and Tyndall’s advanced silicon photonics packaging technology.

Imec’s silicon photonics platform enables cost-effective R&D of silicon photonic ICs for high-performance optical transceivers (25Gb/s and beyond) for telecom, datacom, and optical sensing for life science applications. The offered integrated components include low-loss waveguides, efficient … Read More → "MOSIS collaborates with imec, Tyndall and ePIXfab to offer advanced silicon photonics technology"