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Atmel Licenses Sensinode’s 6LoWPAN Software Stack for Use in Ultra-Low Power Wireless Hardware Platforms

San Jose, CA, June 5, 2013 – Atmel® Corporation (NASDAQ: ATML), a leader in microcontroller (MCU) and touch technology solutions, today announced the company has signed an agreement with Sensinode, a pioneer and world leader in technology and software solutions, to license 6LoWPAN software solutions that will enable the rapid development of smart, connected wireless products that help make up The Internet of Things.

In this agreement, Sensinode will license its 6LoWPAN stack and router solutions, the NanoStackTM 2.0 and NanoRouterTM 3.0, to be used with Atmel’ … Read More → "Atmel Licenses Sensinode’s 6LoWPAN Software Stack for Use in Ultra-Low Power Wireless Hardware Platforms"

MEMSIC Introduces High-Performance Two-Axis Magnetic Sensor at Sensors Expo 2013

ROSEMONT, Ill., June 5, 2013 (GLOBE NEWSWIRE) — MEMSIC Inc. (Nasdaq:MEMS), a leading sensor solution provider, announced today at Sensors Expo (Booth #417) the availability of its MMC246xMT Two-Axis Magnetic Sensor. This fully integrated high performance part is provided in a miniature 2.0 mm. x 2.0 mm. x 1.0 mm. Land Grid Array (LGA) package and is capable of operating from a single 1.8 V supply. It offers the industry’s best performance at the lowest power consumption for a two-axis magnetic sensor, making it ideal for portable applications. Applications include electronic compassing, in-vehicle GPS assist, GPS wristwatches and industrial field measurements including traffic control … Read More → "MEMSIC Introduces High-Performance Two-Axis Magnetic Sensor at Sensors Expo 2013"

Ayla Networks Raises $5.4 Million, Unveils Platform to Allow Manufacturers to Create a New Generation of Connected Devices

June 5, 2013—Sunnyvale, Calif.—Ayla Networks, a leader in technology and cloud-based services for the  Internet of Things, formally unveiled the Ayla Platform, which allows manufacturers and service providers to transform thermostats, appliances, lighting and other everyday products into interactive connected devices quickly, easily and economically.

SINA, the most recognized Internet brand name among Chinese communities globally with more 500 million registered users worldwide, has incorporated Ayla’s technology into its Wi-Fi Weather Station. The Sunnyvale, Calif.-based company also announced that it has raised $5.4 million in Series A financing led by investors Voyager Capital and Crosslink Capital.

< … Read More → "Ayla Networks Raises $5.4 Million, Unveils Platform to Allow Manufacturers to Create a New Generation of Connected Devices"

GLOBALFOUNDRIES demonstrates 3D TSV capabilities on 20nm technology

GLOBALFOUNDRIES announced the accomplishment of a key milestone in its strategy to enable 3D stacking of chips for next-generation mobile and consumer applications. At its Fab 8 campus in Saratoga County, N.Y., the company has demonstrated its first functional 20nm silicon wafers with integrated Through-Silicon Vias (TSVs). Manufactured using GLOBALFOUNDRIES’ leading-edge 20nm-LPM process technology, the TSV capabilities will allow customers to stack multiple chips on top of each other, providing another avenue for delivering the demanding performance, power, and bandwidth requirements of today’s electronic devices.

TSVs are vertical vias etched in a silicon wafer that are … Read More → "GLOBALFOUNDRIES demonstrates 3D TSV capabilities on 20nm technology"

Epitaxial SiC Films Grown on 300mm Si Wafers

NEWPORT, England and BRISBANE, Australia — The Queensland Micro and Nanotechnology Facility (QMF) of Griffith University and industry partner SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, have announced epitaxial growth of 3C silicon carbide (SiC) films on 300mm silicon wafers. This breakthrough is the result of over 10 years research at QMF on low temperature SiC deposition on silicon and the joint development by QMF and SPTS of a commercial reactor to extend the epitaxial growth process to commercial scale production of SiC coated silicon wafers.

Read More → "Epitaxial SiC Films Grown on 300mm Si Wafers"

ADLINK Introduces High Quality Visual Solutions Across Form Factors with 4th Generation Intel® Core™ Processor

June 4, 2013 – SAN JOSE, CA – Today ADLINK Technology, Inc., a leading provider of embedded computing products and application-ready intelligent platforms, announced availability of its initial offerings on the 4th generation Intel® Core™ processor family (formerly codenamed “Haswell”) with Intel® 8-series chipsets. The first products featuring the new generation processor are the Express-HL and Express-HL2 (COM Express®), NuPRO-E42 (PICMG 1.3), cPCI-3510 (CompactPCI®), and Matrix MXE-5400, enabling enhanced embedded applications in medical, defense, transportation, and industrial automation.

“The 4th generation Intel® Core™ processor-based platform allows ADLINK Technology to deliver up to double the graphics performance over … Read More → "ADLINK Introduces High Quality Visual Solutions Across Form Factors with 4th Generation Intel® Core™ Processor"

Teledyne DALSA Announces MEMS Integrated Design for Inertial Sensors (MIDIS™) Platform

WATERLOO, Ontario – June 4, 2013 – Teledyne DALSA Semiconductor, a Teledyne Technologies company and a world-leading pure-play MEMS foundry, today announced the availability of its new MIDIS 200 mm MEMS fabrication platform for motion sensing devices. The platform is designed to provide high volume, low cost manufacture of accelerometers and gyroscopes or the integration of both into an Inertial Measurement Unit (IMU), addressing the rapidly expanding demand for inertial sensors for consumer (mobile), automotive, and sports/health applications.

“Our MIDIS™ platform is a break-through … Read More → "Teledyne DALSA Announces MEMS Integrated Design for Inertial Sensors (MIDIS™) Platform"

Microchip Introduces World’s First Programmable USB2 Controller Hubs; Adds Simultaneous Support for USB2 and HSIC, Low-Power Modes

CHANDLER, Ariz., June 4, 2013 [NASDAQ:  MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced the expansion of the USB2 Controller Hub (UCH2) portfolio it gained from the recent SMSC acquisition.  The seven new UCH2 ICs across three families are the world’s first to provide programmability, enabling the developers of PCs and mobile devices to configure their designs without external memory.  Additionally, these are Microchip’s first UCH2s to support both USB2 and USB High Speed Interchip (HSIC) connectivity, maximum battery … Read More → "Microchip Introduces World’s First Programmable USB2 Controller Hubs; Adds Simultaneous Support for USB2 and HSIC, Low-Power Modes"

Real-Time Hypervisor for the 4th Generation Intel® Core(tm) Processors available now

Ravensburg, June 4,  2013 – Real-Time Systems, a member of the Intel® Intelligent Systems Alliance and a leader in embedded virtualization and real-time hypervisor technology, today announced Real-Time Hypervisor support for the 4th generation Intel® Core(tm) processors (formerly codename ‘Haswell’). The RTS Hypervisor allows the parallel execution of multiple, independent operating systems on a single hardware platform based on processors with the new Intel® microarchitecture.

The dual- and quad-core 4th generation Intel® Core(tm) processors with their enhanced support for virtualization lends itself to be partitioned using an embedded Hypervisor where each partition containing one or … Read More → "Real-Time Hypervisor for the 4th Generation Intel® Core(tm) Processors available now"

ESCATEC helps Azuri bring light and power to Africa

Heerbrugg, Switzerland – 4 June, 2013 – ESCATEC, the EMS innovator, has helped commercialise a novel design of solar power charging station for its client Azuri Technologies. The Indigo™ unit has a solar panel, two LED lamps and control unit with a charging point for a mobile phone. It has already won several major awards and is now in mass production in ESCATEC’s Malaysian production facilities.

In rural Africa, the typical source of light is a kerosene lamp, which is not only unhealthy and dangerous, but also expensive. It is not uncommon for people to be … Read More → "ESCATEC helps Azuri bring light and power to Africa"

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