PHOENIX—July 31, 2013—Avnet Electronics Marketing, an operating group of … Read More → "Avnet Electronics Marketing Releases the MicroZed Next-Generation Zynq-7000 All Programmable SoC Evaluation Kit"
Brighton, UK, 31st July 2013 – With small form factor industrial PCs becoming increasingly more popular, Amplicon introduce a significant addition to the industrial embedded Impact-E series, the Impact-E PCIe.
The Amplicon Impact-E PCIe is the latest addition to the successful Impact-E series. The Impact-E PCIe is a compact fanless embedded system powered by the Intel® Atom™ D525 dual-core processor, making it ideal for multiple applications that support PCIe.
Pre-fitted with a choice of high-density serial communication cards, the new Impact-E PCIe system offers a choice of 4 or 8 COM ports, both of which are software … Read More → "New Impact-E PCIe from Amplicon offers wide expansion at low cost"
MILPITAS, CA – July 31, 2013 – Linear Technology Corporation introduces the LTM2892, a 6-channel SPI/digital or I²C µModule® (micromodule) isolator for 3.3V to 5V systems. Ground potentials can vary widely in systems, potentially exceeding common mode operating limits, which can interrupt communications, destroy components, and even create hazardous conditions. The LTM2892 breaks ground … Read More → "Six Channel 3500VRMS µModule Isolator Simplifies Protection and Expansion of SPI/Digital or I²C Systems"
Chatsworth, Calif. July 2013 – Aitech Defense Systems Inc., a pioneer in true embedded and mission critical computing technologies for environmentally-demanding military, defense and aerospace and rugged industrial applications, now offers the C873, a rugged SBC based on Intel’s 4th generation, quad-core Core i7 Haswell processor operating at 2.4 GHz.
The single-slot SBC is one of the first to boards to integrate this exceptional computing performance into a rugged, 3U OpenVPX platform, offering up to 20% more processing over previous generations of SBCs.
The Core i7 … Read More → "New Aitech Core i7 Haswell-based 3U VPX SBC Offers Enhanced Graphics/Data Processing"
July 29, 2013 – Laird, a global technology company, announced the release of two new products for the public safety industry, a new UHF Wideband Antenna and an elastomer spring for mobile coil antennas. These new products add to the variety of solutions Laird offers for police, fire, emergency and other first responders, as well as commercial 2-way radio users.
The B3803WS UHF Wideband Antenna is a high-performance mobile coil … Read More → "Laird Releases Two New Products for the Public Safety Industry"
SAN JOSE, CA–(Marketwired – July 29, 2013) – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced its sponsorship of MemCon, the premier conference on memory technology and innovation, started by Denali Systems, a company Cadence acquired in 2010. In addition to sponsoring this conference, Cadence is keynoting the event, participating in a panel, and demonstrating new products.
< … Read More → "Cadence to Keynote and Sponsor MemCon 2013"
ALISO VIEJO, Calif.—July 30, 2013—Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the world’s only secure, half-terabyte (TB) solid state drive (SSD) for mobile video surveillance operations, storage area networks (SANs) and other high capacity storage applications requiring superior real-time data protection. The ruggedized TRRUST-Stor™ Series 200 2.5” SATA SSD operates at sustained 200 megabytes per second (MB/s) and delivers the industry’s fastest full-hardware-based erase time of less than 10 seconds. The self-encrypting, half-terabyte SSD is … Read More → "Microsemi Answers Data Storage Security Threats with World’s Only Self-encrypted, Half-terabyte 2.5” SATA SLC Solid State Drive"
Geneva, July 30, 2013 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, the world’s top MEMS (Micro-Electro-Mechanical Systems) manufacturer, and the leading supplier of MEMS sensors for consumer and portable applications[1], has announced a new, ST-patented technology that isolates the pressure-sensing element within a fully molded package to meet the ultra-small form factor requirements and design creativity for the next generation of portable consumer devices.
Integrating the isolated pressure-sensing element in … Read More → "STMicroelectronics Unveils New Pressure Sensor Technology"
El Dorado Hills, Calif. – July 30, 2013 – The Multicore Association™, a global non-profit organization that develops standards to speed time-to-market for products with multicore processor implementations, has announced its latest program to turbocharge the development of complex multicore and manycore applications. The effort launches a new working group, the Software-Hardware Interface for Multi-Many Core (SHIM), which will … Read More → "New Multicore Association Working Group Will Enable Tools to Optimize and Manage Multicore and Manycore Software"
SAN JOSE, CA–(Marketwired – July 30, 2013) – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that MStar Semiconductor, Inc., a leading semiconductor company for display and digital home solutions, has licensed the Tensilica® Xtensa® DPU (dataplane processor unit) for a new SOC (system on chip) design for the home entertainment and home networking market segments. MStar utilized the customization capabilities of the Xtensa DPU to add application-specific interfaces and instructions … Read More → "MStar Licenses Tensilica IP Core From Cadence"
