News – Page 1777 – EEJournal

Vector Software Announces New Android-Specific Testing Capabilities

October 15, 2013

Providence, RI – 10/15/2013 – Vector Software, the leading provider of dynamic software testing solutions for embedded systems, today announced support for the Android Development environment within the VectorCAST™ tool suite. These capabilities help developers who want to quickly port legacy C and C++ applications to an Android platform. The integration of VectorCAST/Cover™, VectorCAST/C++™, and VectorCAST/RSP™, with the Android Native Development Kit (NDK) and Android Developer Tools (ADT) provides a turn-key solution for testing on either the Android mobile device emulator, or on Android-based hardware devices.

The Android-specific … Read More → "Vector Software Announces New Android-Specific Testing Capabilities"

Imagination reveals first MIPS ‘Warrior P-class’ CPU core

October 15, 2013

London, UK – 14 October, 2013 – Imagination Technologies (IMG.L), a leading multimedia, processor, communications and cloud technologies company, announces the first MIPS Series5 ‘Warrior P-class’ CPU, representing a major step forward in feature set for high-performance MIPS CPU IP cores. The new MIPS P5600 core delivers industry-leading 32-bit performance together with class-leading low power characteristics in a silicon footprint up to 30% smaller than comparable CPU cores, making it ideal for a wide range of mobile, consumer and embedded applications.

The MIPS P5600 incorporates key features needed for today’s leading-edge … Read More → "Imagination reveals first MIPS ‘Warrior P-class’ CPU core"

ARM and eyeSight bring robust gesture recognition to the world of ARM-based devices

October 15, 2013

ARM partners with eyeSight to offer gesture control on ARM® Mali™ GPUs
The Mali + eyeSight combination delivers gesture with leading performance, efficiency and robustness
This industry first provides a flawless Natural User Interface for a huge range of device types

Tel Aviv, Israel, 14^th October, 2013 – eyeSight, producer of the world’s most intuitive gesture control, today announces that it has completed extensive work in partnership with ARM to optimize its leading gesture recognition solution for use on ARM’s Mali T600 Graphics Processing Units. Manufacturers using ARM Mali GPUs … Read More → "ARM and eyeSight bring robust gesture recognition to the world of ARM-based devices"

Micropower Hall Switches from Diodes Raise Detection Circuit Performance

October 15, 2013

Plano, Texas – October 15th, 2013 –– Diodes has extended its family of Hall effect switches with the introduction of a pair of high sensitivity, micropower devices. Bringing greater design flexibility and savings in both power and space, the AH1902 and AH1903 help raise the performance bar of a wide range of contact-less switch applications in consumer, domestic, office and industrial products.

The AH1902 is an omnipolar device, detecting both north and south pole magnets. In default mode, the programmable AH1903 operates as a unipolar … Read More → "Micropower Hall Switches from Diodes Raise Detection Circuit Performance"

Telit 3G-ONLY Module to Deliver Compact, High-speed Data for U.S. Connected Devices

October 15, 2013

LONDON and SAN JOSE, California – October 15, 2013 – Telit Wireless Solutions, a global provider of high-quality machine-to-machine (M2M) solutions, products and services, today announced the introduction of the market’s first and smallest 3G-only-cellular module. The product which also incorporates a Python Script Language interpreter is capable of running customer applications internally without the need for additional electronics. The new 3G-only UL865 data-only module series delivers HSPA data rates of 7.2Mbps down and 5.76 Mbps up and will be available in a variant compliant with band and operator requirements for the North … Read More → "Telit 3G-ONLY Module to Deliver Compact, High-speed Data for U.S. Connected Devices"

STMicroelectronics Brings Smart-Grid Benefits to Life with Industry’s First Smart-Meter System-on-Chip

October 15, 2013

Geneva, October 15, 2013 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has revealed the industry’s first complete smart-meter System-on-Chip (SoC) that combines precision metering with flexible, programmable processing and PLC (Power-Line Communication) subsystems along with advanced security in a single device.

The STCOMET10 SoC delivers unprecedented integration, leveraging ST’s expertise in PLC and smart-meter ICs gained over 20 years and via more than 90 million devices delivered. OEMs can use this unique future-proof platform to simplify smart-meter design, reduce time-to-market, and … Read More → "STMicroelectronics Brings Smart-Grid Benefits to Life with Industry’s First Smart-Meter System-on-Chip"

Synopsys Introduces DesignWare ARC EM SEP Processor for Safety-Compliant Automotive Systems

October 15, 2013

MOUNTAIN VIEW, Calif., Oct. 15, 2013 /PRNewswire/ —

Highlights:

Optimized for high-efficiency, low-power embedded automotive applications
Automotive Safety Integrity Level D (ASIL D)-ready DesignWare ARC MetaWare Compiler streamlines development of ISO 26262-compliant software
Integrated safety features include parity support and error-correcting code (ECC) technology
Detailed IP safety documentation eases certification of ARC EM SEP-based systems

Synopsys, Inc. (Nasdaq:SNPS), a global leader providing software, IP and services used to accelerate innovation in chips … Read More → "Synopsys Introduces DesignWare ARC EM SEP Processor for Safety-Compliant Automotive Systems"

TERASEL, a new European effort to develop industrial production chain for manufacturing randomly shaped electronic circuits

October 14, 2013

Leuven, Belgium – October 8, 2013 – Imec and its project partners today announced the launch of TERASEL (Thermo-plastically deformable circuits for embedded randomly shaped electronics), a project under the European Union’s Seventh Framework Programme for Information and Communication Technologies (FP7). The overall goal of the project is the development, industrial implementation and application of large-area, cost-effective, randomly shaped electronics and sensor circuit technologies.

Conventionally, electronics are made on flat substrates. The TERASEL project will develop a basic technology platform for rigid large-area randomly shaped electronic circuits. To achieve this, a process to … Read More → "TERASEL, a new European effort to develop industrial production chain for manufacturing randomly shaped electronic circuits"

New High-reliability Chip Inductors Offer Temperature Ratings Down to -55°C

October 14, 2013

Cary, Illinois, USA —The new ST312RAG Series 0603 chip inductors from Coilcraft CPS (Critical Products & Services) offer extended temperature ratings (-55°C to 125°C), higher Q and lower DCR than other commercial 0603 inductors, making them ideal for a broad range of extreme-temperature applications.

The ST312RAG Series is available in 43 inductance values ranging from 1.8 to 150 nH, with current ratings up to 800 mA. They offer Q factors to 40, DCR as low as 0.030 Ohms and SRF values as high as 16 GHz. ST312RAG inductors are offered with tolerances of ± 1%, 2% or 5%.

Complete technical specifications for the ST312 … Read More → "New High-reliability Chip Inductors Offer Temperature Ratings Down to -55°C"

Texas Instruments demonstrates technical leadership with innovative system solutions for robust, intelligent and future-proof smart grid deployments

October 14, 2013

AMSTERDAM (Oct. 14, 2013) – Building on its commitment to bring more intelligence to the smart grid, Texas Instruments (TI) (NASDAQ: TXN), the systems provider of choice for implementing and maintaining smart grids across in the globe, today announced new innovations at European Utility Week 2013 in Amsterdam. The new technologies allow smart grid developers to make the next generation of products for smart metering, grid infrastructure and communication systems, including smart homes and the Internet of Things (IoT).

Implementing an … Read More → "Texas Instruments demonstrates technical leadership with innovative system solutions for robust, intelligent and future-proof smart grid deployments"

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