GRENOBLE and CAEN, France – Oct. 23, 2013 – CEA-Leti, Fraunhofer IPMS-CNT and three European SMEs, IPDiA, Picosun and SENTECH Instruments, have launched a project to industrialize 3D integrated capacitors with world-record density.

The two-year, EC-funded PICS project is designed to develop a disruptive technology that results in a new world record for integrated capacitor densities (over 500nF/mm²) combined with higher breakdown voltages. It will strengthen the SME partners’ position in several markets, such as automotive, medical and lighting, by offering an even higher integration level and more … Read More → "Two Major EU Research Institutes and Three High-tech SMEs Launch Project to Industrialize New World Record High-density Capacitors"

Vantaa, Finland – 23^rd October 2013: Carbodeon has developed a thermal filler using nanodiamonds that increases the conductivity of thermally conductive polymers by 25 percent, providing significant performance increases for polymers used in electronics and LED manufacture.

Starting with a polyamide 66 (PA66) reference material containing 45 percent by weight of boron nitride as the thermal filler, Carbodeon created a new material using 44.9 percent boron nitride and 0.1% of its uDiamond^® nanodiamond powder. The thermal conductivity of the PA66 increased by 25 percent, averaged across all planes.

The increase in thermal conductivity is achieved without affecting the electrical … Read More → "Carbodeon thermally-conductive polymer gives 25 percent performance increase"