News – Page 1767 – EEJournal

Mentor Graphics Calibre PERC Reliability Checking Solution Used for IP Quality Program by TSMC

November 4, 2013

WILSONVILLE, Ore., October 29, 2013—Mentor Graphics Corp. (NASDAQ: MENT)
today announced that the Calibre® PERC™ reliability verification product has been added to the TSMC9000 IP quality program. TSMC and Mentor Graphics jointly developed electrical checks to help improve IP dependability as part of the TSMC9000 qualification process. The companies are also collaborating on an offering that will allow IP partners to access TSMC9000-compliant checking on a per-use basis. This extends the capabilities customers enjoy today with the Calibre PERC product to TSMC’s IP partners, enabling further pre-verification of third-party IP and increasing the coherence … Read More → "Mentor Graphics Calibre PERC Reliability Checking Solution Used for IP Quality Program by TSMC"

Chris Rowen to Deliver Keynote at Semico IMPACT Conference

November 4, 2013

SAN JOSE, CA–(Marketwired – November 04, 2013) – Cadence Design Systems, Inc. (NASDAQ: CDNS)

WHO:

Chris Rowen, Tensilica founder and Fellow at Cadence Design Systems, Inc. (NASDAQ: CDNS), is scheduled to deliver a keynote speech entitled “Creating the DSP Factory” at this year’s Semico IMPACT Conference: Focus on the IP Ecosystem.

WHEN:

< … Read More →

MEMSIC Introduces E-Compass Library At ARM TechCon 2013

November 4, 2013

Santa Clara, CA, 10/31/2013 (Globe Newswire)—MEMSIC Inc., a leading solutions provider, combining proprietary MEMS technology with systems solutions, today announced here at the ARM TechCON conference an Electronic Compass (e-Compass) library . It is the first member of its Atmel applications Gallery library to accelerate embedded designers’ ability to create smarter connected devices including consumer sensor hubs, Internet of Things (IoT) and wearables.

The e-Compass software applications extension provides a highly accurate fully tilt compensated electronic compass with calibration that supports the MEMSIC’s recently introduced MMC3416xPJ ultra low noise, low power magnetometer in … Read More → "MEMSIC Introduces E-Compass Library At ARM TechCon 2013"

Integrate and Connect to Manage Cross-Platform Data on Android with ITTIA DB SQL

November 1, 2013

October 31, 2013 — Bellevue, WA — ITTIA, the leader in modern database software for embedded systems and intelligent connected systems, today announced new features with which value added application developers and original equipment manufacturers, using Android, can bring their own data onto Android devices. With this new offering, mobile software developers quickly begin solving data management and distribution challenges on Android.

ITTIA continues to further advance data management for mobile Android platforms. When a job takes an employee out of the office, important business data must follow, and so mobility becomes important. Workers need the flexibility to access their records … Read More → "Integrate and Connect to Manage Cross-Platform Data on Android with ITTIA DB SQL"

Triple 10A Step-Down µModule Regulator Delivers Full Output Current at Over 50°C Ambient, with No Airflow or External Heat Sink

November 1, 2013

MILPITAS, CA – October 31, 2013 – Linear Technology has launched the LTM4633, a triple output 10A step-down µModule® (micromodule) regulator in a 15 x 15 x 5.01mm BGA package with integrated heat sink for … Read More → "Triple 10A Step-Down µModule Regulator Delivers Full Output Current at Over 50°C Ambient, with No Airflow or External Heat Sink"

InvenSense™ Introduces the World’s First MotionTracking SoC Optimized for Google’s Android KitKat 4.4

November 1, 2013

SAN JOSE, California, October 31, 2013 – InvenSense, Inc. (NYSE: INVN), the leading provider ofMotionTracking™system on chip devices, announced the 6-axis MPU-6515 MEMS SoC and corresponding MotionApps™ software platform optimized to support key new functions introduced in Android KitKat. The MPU-6515 incorporates an enhanced version of InvenSense’s patented Digital Motion Processor™ (DMP) to offload complex motion protocols and algorithms from the Application Processor (AP) as required by Android KitKat for low power inertial location tracking and contextual awareness. At 3x3x0.9mm, the MPU-6515’s integrated Gyroscope, Accelerometer … Read More → "InvenSense™ Introduces the World’s First MotionTracking SoC Optimized for Google’s Android KitKat 4.4"

Green Hills Software Expands INTEGRITY RTOS Support to ARM Cortex-A5

November 1, 2013

Green Hills Software, the largest independent supplier of embedded software solutions, has announced the availability of its industry-leading INTEGRITY® real-time operating systems (RTOS) and comprehensive MULTI® software development environment for the ARM® Cortex™-A5 architecture. The run-time and development solution brings the unique combination of high performance and real-time determinism with market-specific functional safety options to customers developing medical, smart grid, low-end smart mobile, industrial and automotive devices.

Early global customers … Read More → "Green Hills Software Expands INTEGRITY RTOS Support to ARM Cortex-A5"

VadaTech Offers Advanced 2D/3D Graphics Processing Boards With DVI-I Option

November 1, 2013

Henderson, NV – Nov 01, 2013 – VadaTech, a manufacturer of embedded boards and complete application-ready platforms, is offering a 6-channel GPGPU board in the Advanced Mezzanine Card (AMC) format. The board uses the AMD E6760 graphics processor chip for fast performance along with 1G of GDDR5 memory. The board is ideal for mil/aero, medical, video processing, energy exploration, border security, and other applications requiring advanced graphics processing capabilities.

The AMC343 from VadaTech features an AMD Radeon™ E6760 graphics processor chip providing 6-channel DVI-D (channel one outputs DVI-I). The GPU chip provides 576 GFLOPs floating point performance with DirectX® 11 compatibility. There … Read More → "VadaTech Offers Advanced 2D/3D Graphics Processing Boards With DVI-I Option"

Novel microfluidic material breakthrough for wafer-scale mass production of lab-on-chip

November 1, 2013

Tokyo – November 1, 2013 – Imec, a world-leading nanoelectronics research center and JSR, a leading materials company, announce that they have successfully used JSR’s innovative PA (Photo-patternable Adhesive) material for wafer-scale processing of lab-on-chip devices. With PA as a key enabling material, imec has processed microfluidic cell-sorter devices, merging microheaters and sensors with wafer-scale polymer microfluidics. PA is a breakthrough material: a good microfluidic channel material and adhesive at the same time, suitable for wafer-scale processes and mass production.

Lab-on-chip technology will drive a revolution in medical technology in the years to come. It will enable powerful point-of-care diagnosis … Read More → "Novel microfluidic material breakthrough for wafer-scale mass production of lab-on-chip"

Coventor Improves Speed and Compatibility of MEMS and IC Co-Design with New Release of Industry-Leading MEMS Design Suite

October 31, 2013

CARY, North Carolina – October 21, 2013 – Coventor^®, Inc., the leading supplier of design automation solutions for micro-electromechanical systems (MEMS), today announced its MEMS+^® 4.0 software suite for accelerating development of advanced MEMS devices and systems. The MEMS+ suite enables MEMS and IC designers to rapidly explore and optimize designs in parallel in the MathWorks MATLAB® and Cadence Virtuoso® environments. The MEMS+ 4.0 release features a new capability to export models in Verilog-A format and a … Read More → "Coventor Improves Speed and Compatibility of MEMS and IC Co-Design with New Release of Industry-Leading MEMS Design Suite"

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