News – Page 1720 – EEJournal

CSR Meets Growing Needs of the Wearable Technology Market with New Bluetooth® Smart Solution

December 2, 2013

San Jose, California and Cambridge, UK – December 2, 2013 – CSR plc (LSE: CSR; NASDAQ: CSRE) today announces the launch of a new Bluetooth® Smart platform designed to meet the needs of developers looking to create low-power wearable accessories. The CSR1012™, which is part of the proven CSR µEnergy® range, provides a smaller form factor package making it … Read More → "CSR Meets Growing Needs of the Wearable Technology Market with New Bluetooth® Smart Solution"

Stylish Bluetooth Smart floating remote temperature sensor makes it easy to use a smartphone to accurately monitor air or water temperature anywhere

November 29, 2013

Oslo, Norway – November 27, 2013 – Ultra low power (ULP) RF specialist Nordic Semiconductor ASA (OSE: NOD) today announces that British startup, Blue Maestro, has specified a Nordic nRF51822 System-on-Chip (SoC) in each of its GBP £29 ($50) ‘Tempo’ Bluetooth Smart (Bluetooth low energy) temperature sensors that allow consumers to accurately measure and monitor air or water temperature 24×7 anywhere in their home or business, from a smartphone.

In operation, the weather- and water-proof Tempo is takes full advantage of the embedded Nordic nRF51822 SoC high +4dB maximum output power to maximize operating range to up to 250-ft (75m) – … Read More → "Stylish Bluetooth Smart floating remote temperature sensor makes it easy to use a smartphone to accurately monitor air or water temperature anywhere"

Imec Simplifies i-PERC Solar Cell Processing by implementing laser doping from ALD-Al2O3

November 29, 2013

Leuven (Belgium), November 27, 2013—Nanoelectronics research centre imec announced today that they have developed large area (156x156mm2) i-PERC-type silicon solar cells using a new processing sequence based on laser doping from a thin atomic layer deposited (ALD) aluminum oxide (Al2O3) layer to realize the local aluminum Back Surface Field (BSF) and Ni/Cu plating to form the front contact. The cells achieved average conversion efficiencies of 20.2%.

The new laser doping processing sequence eliminates the necessity of a firing step to create the local BSF in i-PERC solar cells. Combined with imec’s Ni/ … Read More → "Imec Simplifies i-PERC Solar Cell Processing by implementing laser doping from ALD-Al2O3"

Microchip Expands dsPIC® DSCs for Appliance, Automotive and Industrial Applications

November 29, 2013

CHANDLER, Ariz., Nov. 26, 2013 [NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced a new family of dsPIC33 Digital Signal Controllers (DSCs) — the dsPIC33EP512GM710 family. This is an expansion of Microchip’s dsPIC® DSC portfolio that adds higher levels of integration for motor control applications. The new family of DSCs enables efficient dual motor control with 12 motor control PWM channels (6 pairs), dual 12-bit ADCs, multiple 32-bit Quadrature Encoder Interfaces, and … Read More → "Microchip Expands dsPIC® DSCs for Appliance, Automotive and Industrial Applications"

SiC MOSFET-based Power Modules Utilizing Split Output Topology for Superior Dynamic Behavior

November 29, 2013

Unterhaching, Germany, 28th November 2013 – The body diode reverse recovery charge of a SiC MOSFET is lower than that of an Si MOSFET, but still not as beneficial as with SiC Schottky diodes. As the switching performance demands for new wide band-gap components increases, so do the requirements for the commutation process. The split output topology provides an additional tool to reduce turn-on losses and boost cross-conduction suppression. Installed at the module level it negates the limitations of the SiC MOSFET. The module behaves in inverter applications in the same way as in a boost circuit. This makes it possible … Read More → "SiC MOSFET-based Power Modules Utilizing Split Output Topology for Superior Dynamic Behavior"

Renesas Electronics and IAR Systems Announce IEC61508 Safety Compliant Development Tool for RX Microcontroller Designs

November 29, 2013

Santa Clara, Calif., November 26, 2013—Renesas Electronics America, a premier provider of advanced semiconductor solutions, has teamed up with its software alliance partner IAR Systems to offer a development tool for Renesas’ 32-bit RX microcontroller (MCU) series with compliance to the safety standard IEC61508.

“IAR Systems’ certified tool suite will enable customers designing with Renesas RX MCUs to streamline the certification process and reduce time to market,” said Ritesh Tyagi, senior director of microcontroller product … Read More → "Renesas Electronics and IAR Systems Announce IEC61508 Safety Compliant Development Tool for RX Microcontroller Designs"

Ericsson adds simulation to DC/DC Power Designer software, reducing time-to-market

November 29, 2013

Three new major simulation tools added to Ericsson Power Designer

Loop compensator optimizes transient response, stability and capacitance optimization
Phase spreading significantly reduces current ripple, amount of filtering and board space
Voltage tracking simplifies complex power setups
Intuitive interface and complete system overview help reduce time-to-market for power architects

Ericsson has announced the latest version of its DC/DC Digital Power Designer software tool, including a number of important new features that enable board power designers and system architects to simulate either simple or … Read More → "Ericsson adds simulation to DC/DC Power Designer software, reducing time-to-market"

Leti Announces MEMS Research Collaboration with OMRON

November 27, 2013

GRENOBLE, France – Nov. 27, 2013 – CEA-Leti today announced a development agreement that will utilize Leti’s deep MEMS expertise and leading-edge infrastructure with OMRON, a global leader in factory automation and control solutions for the transportation, healthcare and consumer-goods industries.

While Leti has a Tokyo office and has partnered with Japanese companies and research organizations for many years, the agreement is Leti’s first collaboration with a Japanese MEMS producer.

“OMRON is looking forward to this collaboration with Leti in the field of MEMS,” said Yoshio Sekiguchi, senior general manager at OMRON’s Micro Devices HQ. “We … Read More → "Leti Announces MEMS Research Collaboration with OMRON"

Vector Software Announces Support for Microsoft Visual Studio

November 27, 2013

Providence, RI – 11/27/2013 – Vector Software, the world’s leading provider of innovative software solutions for testing safety and mission critical embedded applications, announced today that the VectorCAST™ test suite now supports Microsoft™ Visual Studio® 2012. With this integration, developers can now seamlessly test C and C++ applications built using Visual Studio compilers.

Vector Software’s support for Visual Studio 2012 continues the company’s mission to help customers develop high quality applications by enabling developers to thoroughly test them. Utilizing the new support for the Microsoft Visual Studio release, engineers can use the Studio Integrated Development … Read More → "Vector Software Announces Support for Microsoft Visual Studio"

Small Boost DC/DC Converter with Avalanche Photodiode Current Monitor

November 26, 2013

MILPITAS, CA – November 26, 2013 – The LT3905 is a fixed frequency, current-mode step-up DC/DC converter designed to bias avalanche photodiodes (APD) in optical receivers. The LT3905 features high … Read More → "Small Boost DC/DC Converter with Avalanche Photodiode Current Monitor"