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New tutorial discusses diagnosing defects and variances on DDR memory buses and high-speed serial IO

Richardson, TX (Dec 12, 2013) ? Slight variances and defects on circuit boards are more difficult than ever to detect and diagnose. Plus, they can result in system crashes and degrade performance later on because their harmful effects are cumulative. A new tutorial by ASSET InterTech (www.asset-intertech.com) investigates how advanced test and debug tools based on instruments embedded in chips are able to identify the root causes of defects and variances in complex chips and circuit … Read More → "New tutorial discusses diagnosing defects and variances on DDR memory buses and high-speed serial IO"

STMicroelectronics Strengthens Presence in RF Power Market with New Moisture-Resistant Devices

Geneva, December 11, 2013 – STMicroelectronics unveils two new moisture-resistant radio-frequency (RF) power transistors that increase the ruggedness and reliability of applications operating in high-moisture environments.

The cavity of the two 50V RF DMOS devices is filled with gel, protecting the die from electro-migration such as silver dendrite migration, a well-known phenomenon that appears in standard ceramic packages due to a combination of high temperature, biasing and humidity. The use of gel-filled packages helps reduce the overall maintenance costs of the applications running in high-moisture environments.

ST’s 150 … Read More → "STMicroelectronics Strengthens Presence in RF Power Market with New Moisture-Resistant Devices"

Silicon Labs Targets Internet of Things with Lowest Power and Smallest Form Factor Wireless MCUs

AUSTIN, Texas – Dec. 11, 2013 – Silicon Labs (NASDAQ: SLAB), a leader in high-performance, analog-intensive, mixed-signal ICs, today announced that it has expanded its family of 8-bit Si10xx wireless microcontrollers (MCUs) with two new options optimized for both cost-sensitive and performance-intensive designs. By combining its ultra-low-power MCU technology with its sub-GHz EZRadio® and EZRadioPRO® transceivers in a single-chip solution, Silicon Labs has created new energy-friendly wireless MCUs that achieve industry-leading RF performance with the lowest overall power consumption in their class. Supporting worldwide frequency bands from 142 to 1050 MHz … Read More → "Silicon Labs Targets Internet of Things with Lowest Power and Smallest Form Factor Wireless MCUs"

ISA to develop a new certification program as part of a $23 million grant to fund degree programs and prepare workers for careers in “Mission Critical Operations”

Research Triangle Park, North Carolina, USA (10 December 2013) — The International Society of Automation (ISA) announces today that it will begin developing a new certification program as part of a recently announced $23 million federal grant to fund two-year degree programs in “Mission Critical Operations” at five North Carolina colleges.

The grant, administered through the US Department of Labor, is designed to prepare tomorrow’s workforce to compete for increasingly demanding, high-wage and high-skill jobs in industrial operations and information technology, particularly those defined as mission critical—“operations requiring round-the-clock supervision of systems” and those “aimed at … Read More → "ISA to develop a new certification program as part of a $23 million grant to fund degree programs and prepare workers for careers in “Mission Critical Operations”"

Bruker Launches ContourSP 3D Optical Microscope for PCB Industry

TUCSON, Arizona – December 10, 2013 – Bruker announced today that it has launched the ContourSP large panel metrology system, which more than doubles the measurement throughput of the high-density interconnect (HDI) substrates in multi-chip modules (MCM) over previous generation SP models used by the semiconductor packaging industry. Specifically designed to measure each layer of the printed circuit board (PCB) panels during manufacturing, the gage-capableContourSP assures the minimum recipe development time, highest yield, maximum up-time, and lowest cost per measured panel in production. These features have already led … Read More → "Bruker Launches ContourSP 3D Optical Microscope for PCB Industry"

Texas Instruments introduces the industry’s most flexible haptics and capacitive touch combo solution enabling “Haptics for Everyone”

DALLAS (Dec. 10, 2013) – Expanding its broad portfolio of capacitive touch solutions, Texas Instruments (TI) (NASDAQ: TXN) today announced the industry’s most flexible haptics and capacitive touch combo solution on one chip. The new MSP430TCH5E haptics-enabled microcontrollers allow users to add vibrational feedback to all capacitive touch buttons, sliders and wheels on mobile computing and gaming devices, smart TV remotes, cameras, printers, industrial control panels, point-of-sale terminals and toys. Featuring a license for Immersion TouchSense® 2200 software, MSP430TCH5E MCUs allow developers to easily add and … Read More → "Texas Instruments introduces the industry’s most flexible haptics and capacitive touch combo solution enabling “Haptics for Everyone”"

Synopsys Demonstrates Industry’s First SuperSpeed USB 10 Gbps Platform-to-Platform Host-Device IP Data Transfer

MOUNTAIN VIEW, Calif., Dec. 10, 2013 /PRNewswire/ —

Highlights:

  • Demonstrated 10 Gbps USB 3.1 Host-Device data transfers at over 900 MBps enables increased performance for storage devices and PCs
  • Demonstration uses backward-compatible USB 3.0 connectors, cables and software drivers
  • Data transfer speeds of more than 900 MBps validated by the Ellisys Protocol Analyzer, the industry’s first USB 3.1 protocol analyzer
  •  Consumer products with integrated USB 3.1 Hosts benefit from high-performance external data access speeds that match internal data access speeds, allowing consumers to add storage without sacrificing performance.

Synopsys, Inc. ( … Read More → "Synopsys Demonstrates Industry’s First SuperSpeed USB 10 Gbps Platform-to-Platform Host-Device IP Data Transfer"

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