News – Page 1714 – EEJournal

Synopsys Extends HAPS-70 Prototyping Family with New Solution Optimized for IP and Subsystems

December 16, 2013

MOUNTAIN VIEW, Calif., Dec. 16, 2013 /PRNewswire/ —

Highlights:

HAPS Developer eXpress (HAPS-DX) supports up to four million ASIC gates and easily integrates with HAPS-70 systems to enable seamless software development, hardware/software integration and system validation from IP to complete SoCs
HAPS-DX includes optimized software for FPGA synthesis, debug and clock optimization supporting fast prototyping modes to accelerate time-to-first prototype
Superior debug capabilities are built in with HAPS Deep Trace Debug, which can store seconds of signal trace … Read More → "Synopsys Extends HAPS-70 Prototyping Family with New Solution Optimized for IP and Subsystems"

MEMS is Revolutionizing the Internet of Things

December 16, 2013

PITTSBURGH — December 16, 2013 — MEMS Industry Group (MIG)’s conference session at the 2014 International CES®—“MEMS Sensor Fusion – Revolutionizing the Internet of Things”—will give consumer-electronics OEMs critical information on gaining all the benefits of MEMS technology—without the drawbacks. ‘MEMS Sensor Fusion’ features senior executives from companies such as ARM, Bosch Sensortec, Freescale Semiconductor, InvenSense, JAWBONE and Movea, all sharing information on how tiny micro-electromechanical … Read More → "MEMS is Revolutionizing the Internet of Things"

Saelig Introduces Precision Multi-layer Thickness Measurement System

December 13, 2013

Fairport, NY, USA: Saelig Company, Inc. (www.saelig.com) has announced the OptiGauge MLS™ – an innovative, patented non-contact thickness measurement system that is non-destructive and since it is self-calibrating, it leaves no opportunity for operator error. The OptiGauge MLS™ can measure each translucent coating in an … Read More → "Saelig Introduces Precision Multi-layer Thickness Measurement System"

ARM Acquires Geomerics

December 13, 2013

CAMBRIDGE, United Kingdom — ARM today acquired Geomerics, the leader in lighting technology for the gaming and entertainment industries. The acquisition expands ARM’s position at the forefront of the visual computing and graphics industries. Additionally, the agreement enables Geomerics to build on their existing partnerships as well as accelerate their development in mobile.

“The innovative technologies being developed by Geomerics are already revolutionizing the console gaming experience and are set to rapidly accelerate the transition to photo realistic graphics in mobile,” said Pete Hutton, EVP and GM Media Processing Division, ARM. “Empowering Geomerics’ portfolio … Read More → "ARM Acquires Geomerics"

Xilinx and ARM Democratizing Smarter Systems at ARM Technology Symposium Europe 2013

December 12, 2013

PARIS, Dec. 12, 2013 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) will present and showcase how it is democratizing smarter systems with ARM® at the ARM Technology Symposium Europe 2013. Through its demonstrations and presentation, Xilinx will highlight innovative customer and ecosystem products that utilize the Zynq®-7000 All Programmable SoC. Xilinx’s continued collaboration with ARM is integral to the rapid design and implementation of smarter systems across a broad set of applications, including smarter networks, vision based systems, factories, energy, and data centers. Learn more … Read More → "Xilinx and ARM Democratizing Smarter Systems at ARM Technology Symposium Europe 2013"

Quintic is Powering the Next Generation Wearable Devices Fueling the Quantified-Self Movement

December 12, 2013

Sunnyvale, Calif. – Dec. 11, 2013 – Quintic, the leading developer of integrated nano-power wearable platforms, today introduced its 9020; the first product from its wearable platform roadmap. The 9020 as well as proceeding products are designed specifically for the wearable technology market. Quintic’s wearable platform roadmap provides the best power consumption along with best performance on the market; enabling more intelligence in wearable devices with more sophisticated sensor fusion algorithm.

The 9020 will allow OEMs to deliver products with better battery life and increased wireless performance. The 9020 also offers the highest processing capabilities … Read More → "Quintic is Powering the Next Generation Wearable Devices Fueling the Quantified-Self Movement"

Ericsson third-generation 25A digital point-of-load regulator embeds dynamic loop compensation

December 12, 2013

New 25A regulator offers very high power density of 28.44W/cm3 (465W/in3) and 25 percent more output current in the same footprint as second-generation 20A module
Dynamic Loop Compensation improves stability and shortens time-to-market
Paralleling of seven modules with phase spreading delivers 175A, while ripple-and-noise is reduced to the lowest possible level

The new Ericsson 3E series BMR463-25A is a third-generation digital point-of-load (POL) regulator that features Dynamic Loop Compensation (DLC) and delivers a 25 percent increase in output current over the second-generation BMR463-20A, yet comes in … Read More → "Ericsson third-generation 25A digital point-of-load regulator embeds dynamic loop compensation"

Laird Offers New Tool to Simplify Selection of Bluetooth Products

December 12, 2013

December 10, 2013 — Laird, a leading global technology company, announced the release of the Laird Bluetooth Selection Tool. This simple online tool is an excellent resource for engineers to quickly narrow down Laird’s extensive Bluetooth offerings and choose the optimal Bluetooth module solution for their specific project requirements.

2013 brought an overhaul and refresh of Laird’s Read More → "Laird Offers New Tool to Simplify Selection of Bluetooth Products"

TI redefines MCU performance in high-end industrial applications with C2000™ Delfino™ F2837xD series, industry’s highest performing dual-core MCUs

December 12, 2013

Houston, TX (Dec. 11, 2013) – Announcing the latest innovation in industrial real-time control, Texas Instruments (TI) (NASDAQ: TXN) today set the new performance standard with the new C2000™ Delfino™ 32-bit F2837xD microcontroller (MCU) in the F2837x series. With dual-core C28x processing capabilities and dual real-time control accelerators, also known as control law accelerators (CLAs), these new MCUs provide 800 MIPS of floating-point performance, enabling designers to develop low-latency systems in computationally demanding control applications. Designers can also reduce complexity by consolidating multiple embedded processors into a single … Read More → "TI redefines MCU performance in high-end industrial applications with C2000™ Delfino™ F2837xD series, industry’s highest performing dual-core MCUs"

Pasternack Releases New Lines of Multi-Octave Wilkinson Power Dividers

December 12, 2013

Irvine, CA – Pasternack Enterprises, Inc., an industry leading manufacturer and global supplier of RF and microwave products, introduces a brand new line of Wilkinson power dividers (also referred to as Wilkinson power splitters). These multi-octave power dividers cover popular communications bands from 0.5 to 2.7 GHz including 3G and 4G, plus WiFi bands and are well suited for applications such as in-building distributed antenna systems (DAS) or test environments.

Pasternack is offering two Wilkinson designs covering 0.5 to 2 GHz and 0.7 to 2.7 GHz bands. The 0.5 to 2 GHz band power dividers utilize SMA connectors and are available as 2-way, 4 … Read More → "Pasternack Releases New Lines of Multi-Octave Wilkinson Power Dividers"