MILPITAS, CA – January 21, 2014 – Linear Technology Corporation introduces the LTC3875, a dual output current-mode synchronous step-down DC/DC controller that enables the use of … Read More → "Sub-Milliohm DCR Sensing Multiphase Current-Mode Synchronous Step-Down DC/DC Controller"
SANTA CLARA, Calif., Jan. 21, 2014 – Agilent Technologies Inc. (NYSE: A) today introduced the new M8000 Series BER test solution, a highly integrated and scalable bit error ratio test solution for physical-layer characterization, validation and compliance testing for receivers used in multigigabit digital designs. With support for a wide range of data rates and standards, the new M8000 Series BER test solution provides accurate and reliable results that accelerate insight into the performance margins of high-speed digital devices for computer, consumer, server, mobile computing and data-center products.
Loughborough, UK – 20th January 2014 – CommAgility today announced the AMC-V7-2C6670, a high performance Advanced Mezzanine Card (AMC) module with the processing power of a Xilinx Virtex®-7 FPGA and two TI TMS320C6670 multicore DSPs. The new AMC is designed for wireless processing applications including 4G, LTE, LTE Advanced and beyond.
The AMC-V7-2C6670 provides a high density XC7VX415T-2 Virtex-7 FPGA as standard, with other FPGA options available on request. … Read More → "CommAgility upgrades AMC for 4G and LTE with latest Xilinx Virtex-7 FPGA"
Grenoble, France—Jan. 20, 2014—Today, at the SEMI European 3D TSV Summit, world-leading nanoelectronics research center imec and Besi, a global equipment supplier for the semiconductor and electronics industries, announced they are joining forces to develop a thermocompression bonding solution for narrow-pitch die-to-die and die-to-wafer bonding with high accuracy and high throughput. Through this collaboration, imec and Besi will pave the way to industrial adoption of thermocompression bonding for 3D IC manufacturing.
3D IC technology, stacking multiple dies into a single device, aims … Read More → "Besi and Imec Collaborate on Thermocompression Technology for High-Accuracy Narrow-Pitch Bonding of 3D ICs"
WILSONVILLE, Ore., Jan. 20, 2014 – Mentor Graphics Corp. (Nasdaq: MENT), a leader in advanced system verification solutions, announced today that the Shanghai ZhangJiang Institute has adopted the Veloce® 2 emulation system for its research and development activities targeting the functional verification of System-on-Chip (SoC) integrated circuit designs.
The Shanghai ZhangJiang Institute is a pioneer in the development of technologies in multiple industries, serving as a source of innovation for original research and an incubator for new technologies in the Shanghai area and the rest of … Read More → "Mentor Graphics’ Veloce Emulator Adopted by the Shanghai ZhangJiang Institute, PRC"
Irvine, CA – Pasternack Enterprises, Inc., an industry leading manufacturer and global supplier of RF and microwave products, unveils new RF Circulators and Isolators, ideal for use in mobile infrastructure and distributed antenna systems (DAS). These new ferrite circulators and isolators cover many of the common communications bands including UHF, AMS, Tetra, Cellular, PCS, UMTS and LTE frequencies.
Pasternack’s 3-port RF circulators (also referred to as RF duplexers) control the signal direction and flow inside of an RF circuit. RF circulators are unidirectional and circulate the flow of energy from each port to its … Read More → "Pasternack Unveils New Lines of RF Isolators and Circulators"
MILPITAS, CA – January 15, 2014 – Linear Technology Corporation introduces the LTC3874, a dual phase synchronous step-down slave controller that generates currents up to 300A when paired with a companion master controller by extending the phase count in multiphase applications. Compatible master controllers include the LTC3866, LTC3875 and LTC3774, which all have … Read More → "Slave Current-Mode Step-Down Phase Extender for up to 300A with Sub-Milliohm DCR Sensing"
Stutensee, Germany – For evaluation and test of the MSC NANORISC-AM335x family of processor modules with Texas Instruments AM335x ARM processor, MSC Vertriebs GmbH offers the ready-to-use MSC NANORISC-SK-MB2 starter kit. The kit consists of the versatile MSC nanoRISC-MB2 baseboard with power supply, a 7” WVGA TFT display and a 7” PCT touch panel. A Debian Linux operating system installation on a bootable SD card or downloadable or free is ensuring immediate operation of the starter kit.
Even though the carrier board MSC nanoRISC-MB2 used for the starter kit provides an input for resistive 4-wire touch panels, a … Read More → "Starter Kit for nanoRISC Processor Modules with TI AM335x"
SANTA CLARA, Calif., Jan. 16, 2014 – Agilent Technologies Inc. (NYSE: A) today introduced a debugging tool that helps DDR memory designers perform precompliance tests, discover the root cause of compliance failures, and maximize design margins. The tool allows designers to easily navigate to areas of interest for further analysis and collect and analyze statistical data. The DDR3 and LPDDR3 debug tool runs on Infiniium 9000A, 90000A, 90000 X- and 90000 Q-Series oscilloscopes.
For engineers who work in the computer, server and mobile device industries, the new tool makes it easier to debug DDR memory devices. It includes statistical analysis on DDR3 … Read More → "Agilent Technologies Introduces Tool that Enables Faster, Easier Debugging of DDR Devices"
Plano, Texas – January 16th, 2014 – Diodes Incorporated has announced the introduction of a complete family of dual gate, advanced, ultra-low power CMOS logic devices. Designed for low voltage, low energy operation, the miniature 74AUP2G family extends the battery cell lifetime of a variety of hand-held consumer electronics, including cell phones, e-book readers and tablets.
With a leakage current of less than 0.9µA, the logic devices’ static power consumption is low, and a typical power dissipation capacitance of 6pF at 3.6V means dynamic … Read More → "Diodes Incorporated’s Dual Logic Helps Extend Battery Life"
