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Fujitsu Laboratories and imec Holst Centre Develop Wireless Transceiver Technology for Medical Devices

February 12, 2014

Kawasaki, Japan, and Eindhoven, The Netherlands, February 12, 2014 – Fujitsu Laboratories Ltd. and imec Holst Centre today announced that they have developed a wireless transceiver circuit for use in body area networks (BAN) for medical applications that adheres to the 400 MHz-band international standard.

While the subject of high expectations for medical applications, wireless monitoring of brainwaves or other vital signs has in the past required over a dozen milliwatts (mW) of electric power. Now, however, by optimizing the architecture and circuitry, Fujitsu Laboratories and … Read More → "Fujitsu Laboratories and imec Holst Centre Develop Wireless Transceiver Technology for Medical Devices"

Allegro MicroSystems, LLC Introduces a New Single Element, Tooth Detecting Speed Sensor IC

February 12, 2014

Worcester, MA – February 12, 2014 – Allegro MicroSystems, LLC introduces a unique addition to Allegro’s camshaft sensor family of products. As a single element, non-TPOS sensor it provides first falling edge detection, high running-mode edge accuracy, and direction/orientation insensitivity over the full operating range of air gap, speed, and temperature. Allegro’s Read More → "Allegro MicroSystems, LLC Introduces a New Single Element, Tooth Detecting Speed Sensor IC"

Synopsys, Realtek and UMC Collaborate on Industry’s First Single-Chip Ultra High Definition Smart TV SoC

February 12, 2014

HSINCHU, Taiwan and MOUNTAIN VIEW, Calif., Feb. 12, 2014 /PRNewswire/ —

Highlights:

Cadence Showcases System Development Solutions for Advanced Driver Assistance Systems at embedded world 2014

February 12, 2014

FELDKIRCHEN, Germany, Feb. 12, 2014—At this year’s embedded world Exhibition & Conference, visitors to the Cadence Design Systems, Inc. (NASDAQ: CDNS) booth can learn about early software development, hardware/software integration and co-verification of embedded subsystems. The Cadence® System Development Suite enables accelerated system integration, validation, and bring-up for concurrent hardware/software design and verification. A showcase of the company’s latest system development solutions focusing on advanced driver assistance systems is scheduled to be demonstrated.

In addition, visitors can learn about Cadence IP offerings such as Tensilica® Dataplane Processor Units (DPUs), the latest … Read More → "Cadence Showcases System Development Solutions for Advanced Driver Assistance Systems at embedded world 2014"

Class D Audio Amplifier from Diodes Incorporated Reduces Component Count

February 12, 2014

Plano, Texas – February 12, 2014 – Integrating an advanced 32-step up/down volume control, the PAM8407 Class D audio amplifier from Diodes Incorporated enables a reduction in component count in a variety of stereo speaker applications, including PCs, docking stations and wireless speakers.

Able to drive dual 4? speakers at 3W per channel, from a 5V supply, the amplifier provides designers with simple two key up/down volume control and high-quality sound reproduction.  With its fully differential inputs, the device ensures low noise, high PSRR and … Read More → "Class D Audio Amplifier from Diodes Incorporated Reduces Component Count"

Synopsys and Alango Technologies Deliver Voice Communication Package for DesignWare ARC Audio Processors

February 11, 2014

MOUNTAIN VIEW, Calif., and TIRAT CARMEL, Israel, Feb. 11, 2014 /PRNewswire/ —

Highlights:

  • Alango’s Voice Communication Package (VCP) offers advanced digital signal processing technologies for voice communication applications such as microphone arrays, acoustic echo cancellation, speech enhancement and noise reduction
  • Integrated solution consists of VCP ported to DesignWare ARC single- and dual-core audio processors to provide a pre-verified audio solution that shortens time to market and reduces design risk
  • Combination of VCP’s minimal memory requirements and ARC’ … Read More → "Synopsys and Alango Technologies Deliver Voice Communication Package for DesignWare ARC Audio Processors"

Wind River Advancing Carrier Grade Cloud Infrastructures as a Corporate Sponsor of the OpenStack Foundation

February 11, 2014

ALAMEDA, Calif. – Feb. 11, 2014 – Wind River®, a world leader in embedded software for intelligent connected systems, is now a Corporate Sponsor of the OpenStack Foundation. As part of the OpenStack community, Wind River will help apply OpenStack to telecommunications infrastructures and collaborate with other members to further promote and support open source cloud infrastructure advancements across industries.

OpenStack is an open source cloud computing platform that allows the management of large pools of compute, storage, and networking resources … Read More → "Wind River Advancing Carrier Grade Cloud Infrastructures as a Corporate Sponsor of the OpenStack Foundation"

Xilinx and Xylon Announce logiADAK Automotive Driver Assistance Kit Enabling Systems with up to Six Cameras

February 11, 2014

Feb 11, 2014 – SAN JOSE, Calif., Feb. 11, 2014 — Xilinx, Inc. (NASDAQ: XLNX) and Xylon today announced the logiADAK Zynq®-7000 All Programmable SoC Automotive Driver Assistance Kit, jointly developed by Xilinx, Xylon and ecosystem partners Embedded Vision Systems (eVS) and Digital Design Corporation (DDC).  The kit enables OEM automakers and Tier-1 automotive electronics suppliers with accelerated and simplified development of advanced driver assistance system (ADAS) capabilities with up to six cameras. Learn more about the logiADAK Automotive Driver Assistance Kit by visiting Xilinx at Embedded World, Feb. 25-27</ … Read More → "Xilinx and Xylon Announce logiADAK Automotive Driver Assistance Kit Enabling Systems with up to Six Cameras"

RTI Announces Connext DDS 5.1

February 11, 2014

SUNNYVALE, Calif.—Feb. 11, 2014—Real-Time Innovations (RTI), the real-time Internet of Things communications platform company, today announced Connext™ DDS 5.1, the latest version of the company’s robust software platform for the rapid development and integration of distributed Intelligent Systems.

The Internet of Things (IoT) poses significant new scalability, extensibility and deployment challenges. Legacy communication architectures and technologies simply cannot cope with the volume of applications and data, nor are flexible enough to handle the dynamic nature of IoT deployments. Connext DDS … Read More → "RTI Announces Connext DDS 5.1"

HOZOX™ Electromagnetic Interference (EMI) Absorption Tape and Sheets From Molex Provide Superior Noise Mitigation In Customizable Package

February 11, 2014

LISLE, IL – February 11, 2014– Molex Incorporated today launched its innovative HOZOX™ Electromagnetic Interference (EMI) Absorption Tape and Sheets, ideally suited for manufacturers of high-frequency equipment in multiple industries, including medical, consumer electronics, data/telecommunications and microwave/radio frequency.  HOZOX absorption technology utilizes a unique dual-layer … Read More → "HOZOX™ Electromagnetic Interference (EMI) Absorption Tape and Sheets From Molex Provide Superior Noise Mitigation In Customizable Package"

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