News – Page 1654 – EEJournal

Imec Presents Low-Power Chip for Intra-Cardiac Ventricular Fibrillation Detection

February 19, 2013

San Francisco, USA – February 19, 2013 – Imec demonstrated a low-power (20µW), intra-cardiac signal processing chip for the detection of ventricular fibrillation at this week’s International Solid State Circuits Conference (ISSCC 2013) in San Francisco with Olympus. An important step toward next-generation Cardiac Resynchronization Therapy solutions, the new chip delivers innovative signal processing functionalities and consumes only 20µW when all channels are active, enabling the miniaturization of implantable devices.

Robust and accurate Heart Rate (HR) monitoring of the right and left ventricles and right atrium is essential for implantable devices for Cardiac Resynchronization Therapy. And accurate motion … Read More → "Imec Presents Low-Power Chip for Intra-Cardiac Ventricular Fibrillation Detection"

Wind River Debuts Patent-Pending Packet Acceleration Technology and Real-Time Traffic Analysis for Intelligent Networks

February 19, 2013

ALAMEDA, Calif. – Feb. 19, 2013 – Wind River®, a world leader in embedded and mobile software, has introduced patent-pending packet acceleration technology and added a data plane software engine for network traffic flow analysis to the Wind River Intelligent Network Platform. The software platform is ideal for designing 4G/LTE wireless applications, firewall solutions and equipment requiring scalable packet analysis for the imminent wave of intelligent networks.

Wind River Intelligent Socket Layer, a new packet acceleration technology added to the Wind River Application Acceleration Engine, assists in scenarios such as the … Read More → "Wind River Debuts Patent-Pending Packet Acceleration Technology and Real-Time Traffic Analysis for Intelligent Networks"

EMA Releases TimingDesigner 9.3 with New Documentation Graphics and a Multi-Diagram Interface

February 19, 2013

Rochester, NY (February 19, 2013) – EMA Design Automation (ema-eda.com), one of the world’s largest Electronic Design Automation Value Added Resellers (VARs), today announced a new release of its static timing analysis tool, TimingDesigner 9.3, making the customization of diagrams and documentation easier and users more productive.

“With a fresh, redesigned user interface and improved controls, TimingDesigner 9.3 is the most intuitive timing analysis tool on the market,” said Manny Marcano, president and CEO of EMA. “We’ve made several useful additions to diagram and spreadsheet styling, as well as enhancements … Read More → "EMA Releases TimingDesigner 9.3 with New Documentation Graphics and a Multi-Diagram Interface"

Quick, efficient chip cleans up common flaws in amateur photographs

February 19, 2013

CAMBRIDGE, Mass. — Your smartphone snapshots could be instantly converted into professional-looking photographs with just the touch of a button, thanks to a processor chip developed at MIT.

The chip, built by a team at MIT’s Microsystems Technology Laboratory, can perform tasks such as creating more realistic or enhanced lighting in a shot without destroying the scene’s ambience, in just a fraction of a second. The technology could be integrated with any smartphone, tablet computer or digital camera.

Existing computational photography systems tend to be software applications that are … Read More → "Quick, efficient chip cleans up common flaws in amateur photographs"

Cavium Introduces TurboDPI™ II for OCTEON® Processors – Takes Deep Packet Inspection (DPI) To the Next Level

February 19, 2013

San Jose, Calif., January 31, 2012 –Cavium, Inc. (NASDAQ: CAVM), a leading provider of highly integrated semiconductor products that enable intelligent processing for networking, communications and the digital home, today introduced TurboDPI™ II, the next generation of its production-ready TurboDPI family of software, that now incorporates up to nine major DPI functional modules integrated into a holistic toolkit that have been optimized for OCTEON^® II processors. TurboDPI II’s Uniscan™ technology ensures that data is only scanned once by the OCTEON’s built-in hardware HFA DPI engines, and then the results are passed to the appropriate module.

TI introduces the industry’s smallest point-of-load DC/DC converters for harsh environments

February 19, 2013

DALLAS (Feb. 19, 2013) – Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced the industry’s smallest monolithic point-of-load (POL) DC/DC converters for harsh environments, including radiation tolerant, geological, heavy industrial, and oil and gas applications. The 6.3-V, 6-A TPS50601 and the 6.3-V, 3-A TPS50301 are synchronous step- down converters optimized for small form factor designs.

The devices’ current mode control, high switching frequency, and integration of the high- and low-side MOSFETs slash board space by 50 percent compared to other solutions, reducing the size of equipment needed for tight spaces, such as down-hole drilling. For more information or to … Read More → "TI introduces the industry’s smallest point-of-load DC/DC converters for harsh environments"

congatec paves way to affordable computing with support for Intel® Celeron® Dual-Core processors

February 19, 2013

San Diego, California, February 19^th, 2013 *** congatec, a leading manufacturer of embedded computer modules, introduces Intel® Celeron ® Dual-Core processors with 3^rd Generation Intel® Core™ technology for the conga-TS77 (type 6) and conga-BS77 (type 2) COM Express modules. The modules provide impressive performance and improved energy efficiency at a low price point.

The conga-TS77 and conga-BT77 are now available with the following new processor variants: dual-core Intel® Celeron® Processor 1020E (2M Cache, 2.20 GHz, 35W TDP); dual-core Intel® Celeron® Processor 1047UE (2M Cache, 1.40 GHz, 17W TDP); single-core Intel® Celeron® Processor 927UE (1M cache, 1.50 GHz, 17W TDP).

Semiconductor Industry Veterans From NVIDIA and Xilinx Join eBeam Initiative as Advisory Members

February 19, 2013

SAN JOSE, Calif., February 19, 2013? – The eBeam Initiative, a forum dedicated to the education and promotion of new semiconductor manufacturing approaches based on electron beam (eBeam) technologies, today announced that two semiconductor industry veterans—John Chen, vice president of technology and foundry management at NVIDIA Corporation, and Hugh Durdan, vice president of platform and solution marketing at Xilinx Inc.—have joined the organization as advisory members. These latest additions bring the total number of eBeam Initiative advisors and corporate members to 44. The eBeam Initiative also announced today the launch of its video journal The Fine Line … Read More → "Semiconductor Industry Veterans From NVIDIA and Xilinx Join eBeam Initiative as Advisory Members"

Real Intent to Exhibit, Participate in Panel and Present Tutorial at DVCon 2013

February 19, 2013

SANTA CLARA, CALIF. – (MARKET WIRE) Feb. 19, 2013 –

Who:

Real Intent, whose advanced verification solutions accelerate electronic design sign-off, eliminate complex failures in SoCs, and lead the market in performance, capacity, accuracy and completeness

What:

Will participate in a lively industry panel, present a joint ½-day tutorial with Calypto Design Systems and DeFacTo Technologies, and exhibit its Read More → "Real Intent to Exhibit, Participate in Panel and Present Tutorial at DVCon 2013"

LTE/3G Multimode RF Transceiver from Maxim Integrated Enables Successful Deployment of HetNet Small Cell Base Stations

February 18, 2013

San Jose, CA—February 18, 2013—Maxim Integrated Products, Inc. (NASDAQ: MXIM) today introduced the MAX2580*, a single-chip multistandard RF to Bits® small cell radio transceiver. This highly integrated solution requires very few external components to execute an all-band, multimode, multiple-input multiple-output (MIMO) radio design. The MAX2580 design package also includes full system-level reference designs to shorten time to market. This RF transceiver is ideal … Read More → "LTE/3G Multimode RF Transceiver from Maxim Integrated Enables Successful Deployment of HetNet Small Cell Base Stations"

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