industry news archive
Subscribe Now

Cadence Introduces Voltus-Fi Custom Power Integrity Solution, Delivering Foundry-Certified SPICE-Level Accuracy for Transistor-Level Power Signoff

Highlights:

  • Provides best-in-class transistor-level EMIR accuracy, enabled by Spectre Accelerated Parallel Simulator SPICE simulation
  • Voltus-Fi Custom Power Integrity Solution completes Cadence power signoff solution
  • Delivers best-in-class accuracy for advanced node FinFET process

SAN JOSE, Calif., August 5, 2014–Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today introduced Cadence® Voltus™-Fi Custom Power Integrity Solution, a transistor-level electromigration and IR-drop (EMIR) solution that delivers foundry-certified SPICE-level accuracy in power signoff to … Read More → "Cadence Introduces Voltus-Fi Custom Power Integrity Solution, Delivering Foundry-Certified SPICE-Level Accuracy for Transistor-Level Power Signoff"

Econais Launches ProbMe(TM) WiSmart(TM) Secure Configuration Software

SAN JOSE, California, August 5, 2014 — Econais Inc, the world’s leading wireless Wi-Fi module solution provider for the Internet of Things, today announced that the ProbMe(TM) secure configuration software feature is available and shipping with Econais Wi-Fi Modules, Development Kits and Reference Designs. ProbMe solves one of the biggest challenges for consumer and commercial networking – how does an end user securely set up and configure new devices on their network as quickly and easily as possible?  Think WiSmart(TM).

Econais ProbMe provides an easy, fast and secure way to add new devices to a network.  With ProbMe, … Read More → "Econais Launches ProbMe(TM) WiSmart(TM) Secure Configuration Software"

NI Lowers Semiconductor ATE Cost With PXI-Based Test Systems

AUSTIN, Texas – NIWeek – Aug. 5, 2014 – NI (Nasdaq: NATI), the provider of solutions that enable engineers and scientists to solve the world’s greatest engineering challenges, today announced the NI Semiconductor Test System (STS) series. These PXI-based automated test systems reduce test cost for RF and mixed-signal devices by opening access to NI- and industry-offered PXI modules in semiconductor production test environments. Compared to conventional semiconductor automated test equipment (ATE), STS lead users are experiencing reduced production costs and increased throughput and can now … Read More → "NI Lowers Semiconductor ATE Cost With PXI-Based Test Systems"

Intersil’s Highly Efficient Buck Controller Supports New Levels of Flexibility for High Current Designs

Milpitas, Calif. – Aug. 4, 2014 – Intersil Corporation (NASDAQ: ISIL), a leading provider of innovative power management and precision analog solutions today announced the ISL78268 55V synchronous buck controller with 3A integrated high side and low side drivers. The most versatile high voltage buck solution available, the ISL78268 buck controller provides very high step-down efficiency for a wide variety of load currents from under 5 to over 25A, enabling it to support virtually every 12, 24, or 48 volt high current buck requirement for automotive and industrial applications.

For … Read More → "Intersil’s Highly Efficient Buck Controller Supports New Levels of Flexibility for High Current Designs"

Altera Enables Customer Design Starts for 14 nm Stratix 10 FPGAs and SoCs

San Jose, Calif., August 4, 2014 – Building on the success of early customer benchmarking results announced earlier this year, Altera Corporation (Nasdaq: ALTR) today released early access design software for Stratix® 10 FPGAs and SoCs, the industry’s first design software targeting 14-nm FPGAs. Customers today can start their Stratix 10 FPGA designs and experience firsthand the 2X core performance gains they can achieve as a result of the Stratix 10 HyperFlex architecture and the Intel 14 nm Tri-Gate process. With this design software, Altera introduces the Hyper-Aware design flow which includes … Read More → "Altera Enables Customer Design Starts for 14 nm Stratix 10 FPGAs and SoCs"

Calypto Catapult High-level Synthesis Platform Chosen by Olympus for C-Based Design and Verification

SAN JOSE, Calif., –August 4th, 2014 –Calypto® Design Systems, Inc., a leader in low-power RTL design and C-based design and verification, today announced that Olympus Corp., a leading provider of digital imaging technology solutions, has selected Calypto’s Catapult high-level synthesis (HLS) platform for their advanced ASIC designs.  Olympus evaluated several HLS tools and determined that the Catapult platform was the ideal choice given its proven success in ASIC tapeouts, best C language support and integrated HLS verification methodology.

“After Evaluating Catapult for high-level synthesis, we found it was possible to shorten the design … Read More → "Calypto Catapult High-level Synthesis Platform Chosen by Olympus for C-Based Design and Verification"

TI introduces integrated triple-output synchronous buck converters

DALLAS (July 31, 2014) – Texas Instruments (TI) (NASDAQ: TXN) today introduced the next generation of its integrated triple-output synchronous step-down switching regulators with smaller footprint and higher efficiency. The TPS65261 and TPS65262 DC/DC converters feature small QFN packages and up to 96 percent efficiency for such applications as digital television, set-top boxes, home gateway and access point networks, wireless routers, point-of-sale machines, and surveillance equipment. For more information, samples and an evaluation module, visit Read More → "TI introduces integrated triple-output synchronous buck converters"

featured blogs
Apr 24, 2026
A thought experiment in curiosity, confusion, and cosmic consequences....