News – Page 1635 – EEJournal

Marvell Offers Full Range of Internet of Things Solutions with Industry’s Most Complete Line of Wire

June 9, 2014

SANTA CLARA, Calif. – (June 3, 2014) – Marvell (NASDAQ: MRVL) today unveiled the industry’s most complete line of silicon platform solutions targeting the full range of Internet of Things (IoT) applications including: wearables, home automation, home security, personal healthcare, smart appliances, accessories and remote controls, automotive, lighting, industrial Internet, and more. The new wireless product family, featuring Marvell’s EZ-ConnectTM software platform, includes: the MW300 Wi-Fi microcontroller, the MB300 Bluetooth microcontroller, and the MZ100 ZigBee microcontroller. These best-in-class silicon solutions leverage Marvell’s decade-long leadership in developing embedded wireless solutions, including Marvell’ … Read More → "Marvell Offers Full Range of Internet of Things Solutions with Industry’s Most Complete Line of Wire"

Greenvity Communications and Brain & Iris Technologies announce joint development of IoT products

June 9, 2014

MILPITAS, Calif. – June 9, 2014 – Greenvity Communications and Brain & Iris Technologies (BITPL) of Pune, India, today announced that they have entered into a Memorandum of Understanding for joint development of Internet of Things (IoT) products, consisting of smart meters, lighting nodes, and wireless and powerline communications (PLC) modules.

Through this joint development, Greenvity and BITPL expect to generate synergy through aggregating their respective strengths that will … Read More → "Greenvity Communications and Brain & Iris Technologies announce joint development of IoT products"

Airoha Technology Selects STMicroelectronics’ “Dynamic NFC Tag” Memories for its Latest Bluetooth Audio-Module Reference Design

June 9, 2014

Taipei, Taiwan, June 9, 2014 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications today announced that Airoha Technology, a leading fabless design company for wireless communication products, has selected ST’s latest family of “dynamic NFC tag” memories for its Bluetooth audio modules.

ST’s M24SR is the key component for Bluetooth pairing and parameter storage on Airoha’s AB1510/AB1511 optimized single-chip solution with integrated baseband and radio for … Read More → "Airoha Technology Selects STMicroelectronics’ “Dynamic NFC Tag” Memories for its Latest Bluetooth Audio-Module Reference Design"

Mentor Graphics Launches Xpedition Path Finder Suite for Efficient IC/Package/PCB Design Optimization, Assembly, and Visualization

June 9, 2014

WILSONVILLE, Ore., June 9, 2014—Mentor Graphics Corporation (NASDAQ: MENT) today announced its Xpedition™ Path Finder product suite, providing designers with the ability to assemble and optimize complex electronic systems, and thereby enabling improved design, increased chip performance, and cost efficiency. This product, the newest addition to the Mentor Graphics® Xpedition platform, supports a methodology that leverages layout data from the IC and board design teams to guide and automate IC package selection and optimization.

The Xpedition Path Finder suite provides a single environment … Read More → "Mentor Graphics Launches Xpedition Path Finder Suite for Efficient IC/Package/PCB Design Optimization, Assembly, and Visualization"

Applied Materials Enables Cost-Effective Vertical Integration of 3D Chips

June 9, 2014

SANTA CLARA, Calif., May 28, 2014 – Applied Materials, Inc. today introduced the Endura® Ventura(TM) PVD system that helps customers reduce the cost of fabricating smaller, lower power, high-performance integrated 3D chips. The system incorporates Applied’s latest innovations to its industry-leading PVD* technology that enables the deposition of thin, continuous barrier and seed layers in through-silicon-vias (TSVs). Demonstrating Applied’s precision materials engineering expertise, the Ventura system … Read More → "Applied Materials Enables Cost-Effective Vertical Integration of 3D Chips"

Powerbyproxi Announces Advances In Resonant Wireless Charging Including First Multi-Device 7.5 Watts Resonant Charging System for Smartphones

June 9, 2014

COMPUTEX, Taipei, Taiwan, June 3, 2014 – PowerbyProxi, developer of the world’s most advanced and safest wireless power solutions, will demonstrate the next evolution of resonant wireless charging at Computex 2014 this week. A first for the industry is a 7.5W, highly resonant charging solution for thin-form devices, such as smartphones and phablets. The solution, which offers multi-device charging and full spatial freedom, is also expandable to power tablets up to 15W.

PowerbyProxi’s integrated approach provides significant improvements over the 3.5 to 5W systems being offered today, by enabling high-speed wireless … Read More → "Powerbyproxi Announces Advances In Resonant Wireless Charging Including First Multi-Device 7.5 Watts Resonant Charging System for Smartphones"

Renesas Electronics Europe: IAR Embedded Workbench for ARM Now Supports Renesas Starter Kit for the RZ/A1 Microprocessor

June 6, 2014

Dusseldorf, June 4, 2014 — Renesas Electronics Europe, a leading supplier of advanced semiconductor solutions, today officially announced that IAR Systems® industry-leading toolchain IAR Embedded Workbench for ARM® has full support for the RZ/A1 “Renesas Starter Kit” (RSK) development suite.

A key differentiator of the RZ/A1 MPU is the abundance of up to 10MB of embedded SRAM. This is sufficient to remove the need for external RAM. Numerous customer benefits stem from this: hardware costs are reduced by moving from a 3-chip solution (CPU, Flash, RAM) to a 2-chip … Read More → "Renesas Electronics Europe: IAR Embedded Workbench for ARM Now Supports Renesas Starter Kit for the RZ/A1 Microprocessor"

Mentor Graphics Delivers Embedded Linux Software and Development Tools for Award-Winning AMD G–Series Platform

June 6, 2014

WILSONVILLE, Ore., June 4, 2014 – Mentor Graphics Corporation (NASDAQ: MENT) today announced the availability of Mentor® Embedded software for the new x86 AMD Embedded G-Series system-on-chip (SoC) (previously codenamed: “Steppe Eagle”) and central processing unit (CPU) (previously codenamed: “Crowned Eagle”) product families. As gold-level members of The Linux Foundation’s Yocto Project, AMD and Mentor Graphics have entered into a multi-year agreement to provide embedded developers with a comprehensive embedded Linux® -based tools solution.

Mentor Graphics’ partnership with AMD provides an embedded ecosystem for software developers to quickly build Linux-based applications for AMD G-Series devices. Embedded … Read More → "Mentor Graphics Delivers Embedded Linux Software and Development Tools for Award-Winning AMD G–Series Platform"

VadaTech Quadruples Transfer Rate of AMC Storage Modules with Upgrades

June 6, 2014

Henderson, NV – June xx, 2014 – VadaTech, a manufacturer of embedded boards and complete application-ready platforms, has upgraded its line of AMC Storage Modules with higher transfer rate, RAID and Host Bus Adapter options.

The first in the line of upgraded storage AMCs is the AMC626. The module meets the AMC.1 specifications for use in MicroTCA and AdvancedTCA systems. It comes in the single module, mid-size and holds a 2.5 inch drive for SATA III at a 6 Gbps transfer rate or SAS-3 for a 12 Gbps transfer rate. The AMC626 has a storage capacity of 900 GB per disk and includes a … Read More → "VadaTech Quadruples Transfer Rate of AMC Storage Modules with Upgrades"

XIMEA & imec Bring Smallest Hyperspectral Imaging Camera to Market

June 6, 2014

Imec Technology Forum—BRUSSELS (Belgium)— June 6, 2014 —Nanoelectronics research center imec and XIMEA, a progressive creator of machine vision systems, announced their partnership in integrating imec’s Hyperspectral Imaging (HSI) sensors together with XIMEA’s xiQ USB3.0 camera product line. Exceptional interoperability between camera and sensor’s technology streamlined the success of this integration.

“Combining imec’s hyperspectral sensor with XIMEA’s impressively compact xiQ cameras is a new milestone for us. The high-speed USB3.0 interface includes power supply over USB that removes the … Read More → "XIMEA & imec Bring Smallest Hyperspectral Imaging Camera to Market"

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