Geneva, June 16, 2014 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has announced that SenseAnywhere, a leader in tags and modules for wireless sensing and location, has qualified the world’s first wireless devices incorporating ST’s new single-chip balun, which integrates essential circuitry for radio systems in a footprint of only 2.1mm².

The SenseAnywhere AiroSensor and AssetSensor active-RFID modules combine advanced RF transceiver technology with a low-power processor, low-voltage EEPROM, and miniature temperature, humidity, and ultra-efficient motion sensors to enhance performance and save cost in Internet of Things ( … Read More → "STMicroelectronics Hails Success of Advanced Single-Chip Integration in New Wireless Modules from SenseAnywhere"

PISCATAWAY, N.J., USA, 12 June 2014 – IEEE, the world’s largest professional organization advancing technology for humanity, today launched a new standards development project, IEEE P2413™, “IEEE Standard for an Architectural Framework for the Internet of Things (IoT).” Upon completion, the standard will provide a robust architectural framework for the IoT, reducing market fragmentation, improving interoperability, and serving as a catalyst for continued IoT growth and advancement. The first meeting of the IEEE P2413 Working Group (WG) will take place July 10 – 11, 2014, in Munich, Germany.

“This is one of those rare watershed moments, where the world gets to witness … Read More → "IEEE Begins Building Solid Foundation for the Internet of Things"