News – Page 1623 – EEJournal

Agilent Technologies Introduces Industry’s Most Accurate Test Solution for USB 3.1 Receivers

July 10, 2014

SANTA CLARA, Calif., July 9, 2014 – Agilent Technologies Inc. (NYSE: A) today announced the industry’s most accurate test solution for characterizing USB 3.1 receivers. Using the Agilent USB 3.1 receiver test set, design and test engineers in the semiconductor and computer industry can now accurately characterize and verify USB 3.1 receiver ports in ASICs and chipsets.

USB interfaces are commonly used in today’s PCs, tablets, mobile phones and external storage devices. The new USB 3.1 specification was released by the … Read More → "Agilent Technologies Introduces Industry’s Most Accurate Test Solution for USB 3.1 Receivers"

VadaTech Announces Line of FMCs for Network Interface

July 10, 2014

Henderson, NV – July 10, 2014 – VadaTech, a manufacturer of embedded boards and complete application-ready platforms, now offers FMCs with high-speed interfaces up to 40GB speeds. This includes cages for dual QSPF+, SPF+, and RJ-45 as well as some quad cage versions.

The latest in the network interface series of FMCs is the FMC108. It features dual QSFP+ ports for 40GbE/SRIO, PCIe, and Aurora. The dual re-driver is on-board, allowing long copper cables to be used. The FMCs meet the VITA 57 specifications for FPGA Mezzanine Cards (FMCs). The front panel also has dual sets of LEDs for USER0, USER1, … Read More → "VadaTech Announces Line of FMCs for Network Interface"

4th International Workshop on Power Supply on Chip (PowerSoC2014) to be held at Northeastern University Boston MA on October 6-8, 2014.

July 10, 2014

MENDHAM, N.J.—July 10, 2014—The 4th International Workshop on Power Supply on Chip (PowerSoC2014 ) will be held at Northeastern University Boston MA on October 6-8, 2014. The Power Sources Manufacturers Association (PSMA) and IEEE Power Electronics Society (IEEE PELS) are jointly sponsoring, and the College of Engineering (COE) of Northeastern University (NEU) is hosting this workshop.

The workshop will focus on the integration of both modular and granular commercially successful minature power converters that include power … Read More → "4th International Workshop on Power Supply on Chip (PowerSoC2014) to be held at Northeastern University Boston MA on October 6-8, 2014."

Calling all tech start-ups to enter – Discovering Start-Ups 2014 Competition

July 9, 2014

08.07.14 Cambridge, UK: Cambridge Wireless and Silicon SouthWest are calling on innovative tech start-ups and digital entrepreneurs from across the UK to enter the Discovering Start-Ups 2014 competition. With extraordinary start-up stories coming from hi-tech hubs like Cambridge’s Silicon Fen and Shoreditch’s Silicon Roundabout, the annual competition provides a showcase for disruptive newcomers to the wireless technology industry and demonstrates that the UK start-up scene has everything it takes to successfully compete with Silicon </ … Read More → "Calling all tech start-ups to enter – Discovering Start-Ups 2014 Competition"

Indium Corporation Announces RMA-155 Pb-Free Solder Paste

July 9, 2014

Indium Corporation recently released RMA-155 Pb-Free Solder Paste. RMA-155 is the best solder paste for customers who are required to use RMA materials, but who need the performance benefits of modern Pb-free solder paste technology.

RMA-155 was designed for balanced performance, making it ideal for high-complexity boards with a variety of component sizes, as well as simple assemblies. Compatible with both SnPb and SAC alloys, RMA-155 delivers consistent transfer efficiencies, excellent response-to-pause, and a strong oxidation barrier, even for long and hot profiles. It is halogen-free, resists graping … Read More → "Indium Corporation Announces RMA-155 Pb-Free Solder Paste"

KLA-Tencor Introduces Inspection and Review Portfolio for Leading IC Technologies

July 8, 2014

SAN FRANCISCO, Calif., July 7, 2014—Today at SEMICON West, KLA-Tencor Corporation (NASDAQ: KLAC) announced four new systems—the 2920 Series, Puma™ 9850, Surfscan^® SP5 and eDR™-7110—that provide advanced defect inspection and review capability for the development and production of 16nm and below IC devices. The 2920 Series broadband plasma patterned wafer, Puma 9850 laser scanning patterned wafer, and Surfscan SP5 unpatterned wafer defect inspection systems deliver enhanced sensitivity and significant throughput gains. By enabling discovery and monitoring of yield-critical defects, these inspectors support chipmakers’ integration of complex structures, novel materials and … Read More → "KLA-Tencor Introduces Inspection and Review Portfolio for Leading IC Technologies"

Synopsys Expands Verification IP Portfolio with Compliance Test Suites

July 8, 2014

MOUNTAIN VIEW, Calif., July 8, 2014 /PRNewswire/ — Synopsys, Inc. (NASDAQ: SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced the availability of key protocol compliance test suites. Delivered as SystemVerilog source code to ease integration and enable re-use across multiple projects, the test suites are complete, self-contained and design-proven testbenches that eliminate the task of developing a verification environment and tests for protocol compliance verification. Furthermore, having test suites in source code enables end-users to easily customize or extend compliance … Read More → "Synopsys Expands Verification IP Portfolio with Compliance Test Suites"

ADLINK Announces Rugged SWaP-optimized 6U VPX Radar Solution

July 8, 2014

San Jose, CA – July 8, 2014 – ADLINK Technology, Inc., a leading global provider of cloud-based services, intelligent gateways and embedded building blocks for edge devices that enable the Internet of Things (IoT), today announced the VPX6000, a rugged 6U VPX blade featuring a dual processor design based on quad-core 4th generation Intel® Core™ i7-4700EQ processors. The VPX6000 is a high performance blade designed to meet MIL-STD-810F for harsh environments and provide the high availability required for mission-critical applications, including radar, sonar, UAV and UGV in defense and aerospace.

The two CPU sub-systems are connected by a … Read More → "ADLINK Announces Rugged SWaP-optimized 6U VPX Radar Solution"

Mentor Graphics Expands Automotive Portfolio, Acquires XS Embedded to Reduce Time to Start of Production (SOP)

July 8, 2014

WILSONVILLE, Ore., July 8, 2014 /PRNewswire/ — Mentor Graphics Corporation (NASDAQ: MENT) today announced the acquisition ofXS Embedded GmbH (XSe), a technology leader in the creation of automotive system architectures and hardware reference platforms. XSe … Read More → "Mentor Graphics Expands Automotive Portfolio, Acquires XS Embedded to Reduce Time to Start of Production (SOP)"

Imec and its Partners Achieve Record Efficiency for Large Area Industrial Crystalline-silicon n-PERT Solar Cell

July 8, 2014

SEMICON WEST/INTERSOLAR NORTH AMERICA (Booth #SH2311), San Francisco — July 7, 2014 — Nano-electronics research center imec, reported today an n-type PERT crystalline silicon (Si) solar cell fabricated on a large area wafer (15.6cm x 15.6 cm) reaching a top conversion efficiency of 21.5 percent (calibrated at ISE Callab). This is the highest efficiency achieved for this type of solar cell on an industrial large area wafer size. This result will accelerate the adoption of n-type PERT (Passivated Emitter, Rear Totally diffused) solar cells in the industry as it clearly shows the potential for improved conversion efficiencies for next generation standard two side … Read More → "Imec and its Partners Achieve Record Efficiency for Large Area Industrial Crystalline-silicon n-PERT Solar Cell"