News – Page 1622 – EEJournal

Lattice’s New iCE40 Ultra Family Speeds Customization of ‘Killer’ Features for Mobile Devices

July 15, 2014

HILLSBORO, OR – July 15, 2014 – Lattice Semiconductor Corporation (NASDAQ: LSCC), the leader in ultra-low power, small form factor, customizable solutions, today introduced the iCE40 Ultra™ family, delivering unsurpassed integration of emerging infrared remote, barcode, touch, user identification, and pedometer functions with ample customization capabilities for makers of mobile consumer devices to quickly implement ‘killer’ features that differentiate their products.

iCE40 Ultra FPGAs deliver 5x more functionality at 30% smaller size than competing solutions. Lattice has also reduced power by 75% … Read More → "Lattice’s New iCE40 Ultra Family Speeds Customization of ‘Killer’ Features for Mobile Devices"

TI introduces its latest RF430 security MCU with highest RF integration in the industry; new evaluation module jumpstarts designs

July 15, 2014

Dallas, TX (July 15, 2014) – Expanding its broad portfolio of low-power, radio frequency (RF) solutions, Texas Instruments (TI) (NASDAQ: TXN) today introduces the RF430F5978 microcontroller (MCU) and accompanying evaluation module (EVM). Building on TI’s CC430 product family, the RF430F5978 MCU is a highly integrated RF solution with improved read zone and battery performance for ultra-low power applications. The RF430F5978 MCU includes a 3D low-frequency (LF) wake-up and transponder interface, an integrated 1GHz … Read More → "TI introduces its latest RF430 security MCU with highest RF integration in the industry; new evaluation module jumpstarts designs"

Fairview Microwave Announces New Lines of RF Rotary Joints

July 14, 2014

July 10, 2014 – Allen, TX – Fairview Microwave, Inc. a preeminent supplier of on-demand microwave and RF products, announces their new line of single-channel/single-axis and single-channel/multi-axis RF Rotary Joints.

Fairview Microwave’s RF rotary joints are needed wherever RF signals have to be transmitted between stationary and moving parts of a system, commonly used in commercial and military radar, land-mobile-radio communications and anti-missile defense applications. These rotary joints boast … Read More → "Fairview Microwave Announces New Lines of RF Rotary Joints"

New THIN Mini-ITX Barebone System with 4th Generation Intel® Core i5/Celeron for Medical, Gaming, Digital Signage Applications

July 14, 2014

July 8, 2014, Taipei – Advantech, a leading, global, embedded computing and intelligent applications provider today introduced the arrival of AIMB-B12300 series, a new industrial-grade thin barebone system embedded withAIMB-230 Mini-ITX motherboard, supporting the latest 4th generation Intel^®Core™ i5/ Celeron processors, … Read More → "New THIN Mini-ITX Barebone System with 4th Generation Intel® Core i5/Celeron for Medical, Gaming, Digital Signage Applications"

Zero-Drift Instrumentation Amplifier From Microchip Provides Low Power and High Accuracy With Self-Correcting Architecture

July 14, 2014

CHANDLER, Ariz., July 14, 2014 [NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced the expansion of its instrumentation amplifier portfolio with the new zero-drift MCP6N16. This self-correcting architecture maximizes DC performance by enabling ultra-low offset, low-offset drift, and superior common-mode and power-supply rejection, while eliminating the adverse effects of 1/f noise. The result is very high accuracy across both time and temperature.

The MCP6N16’s … Read More → "Zero-Drift Instrumentation Amplifier From Microchip Provides Low Power and High Accuracy With Self-Correcting Architecture"

Intersil Introduces New Voltage Options for Radiation Hardened Family of Ultra Low Noise, High Precision Voltage References

July 14, 2014

Milpitas, Calif. – July 14, 2014 – Intersil Corporation (NASDAQ: ISIL), a leading provider of innovative power management and precision analog solutions, today announced the expansion of its industry leading line of radiation hardened (rad hard) voltage references to include four new devices, the ISL71091SEH10, 20, 33 and 40. Providing voltages previously unavailable for the rad hard space market, the new family enables better overall accuracy for 11-bit and 12-bit ADC resolution applications. The ISL71091SEH family offers the industry’s best output voltage noise and a reference voltage that is stable … Read More → "Intersil Introduces New Voltage Options for Radiation Hardened Family of Ultra Low Noise, High Precision Voltage References"

memsstar Launches Next-Generation MEMS Etch and Deposition Equipment

July 11, 2014

LIVINGSTON, SCOTLAND — (Jul 8, 2014) – memsstar Limited, a leading provider of etch and deposition equipment and technology solutions to manufacturers of semiconductors and micro-electrical mechanical systems (MEMS), today launched itsORBIS™ platform of etch and deposition process tools for MEMS manufacturing. ORBIS systems deliver the industry’s most advanced single-wafer process capability, required to meet … Read More → "memsstar Launches Next-Generation MEMS Etch and Deposition Equipment"

CyberOptics® Features the New ReticleSense Airborne Particle Sensor and Announces Extension of its APS line to 150mm at SEMICON West 2014

July 11, 2014

San Francisco, CA — SEMICON WEST 2014 – July 7, 2014 — CyberOptics Corporation (NASDAQ: CYBE), a world leader in intelligent inspection and sensing solutions for electronics assembly and semiconductor process equipment, will showcase its most efficient and effective wireless measurement devices for chamber gapping, leveling, wafer handoff teaching, vibration and airborne particle measurement, at SEMICON West 2014 in Booth #2511 at the Moscone Center, San Francisco, July 8-10.

CyberOptics will demonstrate the newly available ReticleSense Airborne Particle Sensor (APSR) which is an extension of the wafer-shaped WaferSense Airborne Particle Sensor (APS) line that has been adopted by major semiconductor fabs and OEM equipment makers … Read More → "CyberOptics® Features the New ReticleSense Airborne Particle Sensor and Announces Extension of its APS line to 150mm at SEMICON West 2014"

Applied Materials Introduces CVD and CMP Systems for 3D Architectures

July 10, 2014

SANTA CLARA, Calif., July 7, 2014 – Demonstrating its expertise in precision materials engineering, Applied Materials, Inc. today announced two new systems that help customers solve critical challenges in manufacturing high-performance, power-efficient 3D devices. The Applied Reflexion^® LK Prime™ CMP system provides superior wafer polishing performance with nanometer-level precision for FinFET and 3D NAND applications. The Applied Producer^® XP Precision^™ CVD system solves the demanding, fundamental deposition challenges presented by vertical 3D NAND architectures. These new CMP* and CVD* tools directly address precision, materials and defect issues, enabling 3D designs to reach … Read More → "Applied Materials Introduces CVD and CMP Systems for 3D Architectures"

Microsemi Enables OEMs to Expedite Prototyping and Application Development with its Comprehensive New SmartFusion2 SoC FPGA Evaluation Kit

July 10, 2014

ALISO VIEJO, Calif.—July 9, 2014—Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of the company’s new leading-edge SmartFusion®2 SoC FPGA Evaluation Kit. The new SmartFusion2 Evaluation Kit is an easy-to-use, feature-rich, affordable platform designed to enable designers to quickly and easily accelerate evaluation or prototype their application. Utilizing Microsemi’s mainstream SmartFusion2 FPGAs enables original equipment manufacturers (OEMs) to leverage the device’s lowest power consumption in its class, high reliability capabilities and best-in-class security technology to build highly differentiated products that help them … Read More → "Microsemi Enables OEMs to Expedite Prototyping and Application Development with its Comprehensive New SmartFusion2 SoC FPGA Evaluation Kit"

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