News – Page 1556 – EEJournal

Cavium’s XPliant™ Ethernet Switch Supports the Emerging Open Ecosystems

March 10, 2015

Open Compute US Summit 2015 – San Jose, CA, March 10, 2015 – Cavium, Inc., (NASDAQ: CAVM), a leading provider of semiconductor products that enable intelligent processing for enterprise, data center, wired and wireless networking today announced its commitment to driving an open ecosystem for data center switching. Qualification of hardware platforms as well as standardization of software interfaces enables both OEM and 3rd party innovation ushering in a new era in open Ethernet switching.

The Open Compute Project (OCP) was created with the goal of developing the most efficient data center designs for scalable solutions, by openly sharing ideas, specifications and … Read More → "Cavium’s XPliant™ Ethernet Switch Supports the Emerging Open Ecosystems"

Savings for Aerospace market as e2v inc releases the highest density MRAM device in the industry

March 10, 2015

The EV5A16B is a stacked solution, with two 16Mb MRAM devices from Everspin Technologies and is offered in a 54 pins stacked-package *TSOP. Available in commercial (0°C to 70°C) and Industrial (-40°C to 85°C) temperature ranges, the MRAM technology offers SRAM-compatible, 35-ns read/write timing with data retention and endurance and is used with microprocessors, **DSP, storage systems, instruments, and ***FPGAs.

Brad Little, Vice President and General Manager of e2v inc’s Semiconductor business unit commented, “Our new stacked-package MRAM will have a significant impact on our customers’ systems by addressing … Read More → "Savings for Aerospace market as e2v inc releases the highest density MRAM device in the industry"

QuickLogic Expands its SenseMe Software Library for Smartphone and Wearable Applications

March 10, 2015

Significant new capability added to the broadening SenseMe Software Library
Optimized for QuickLogic’s ArcticLink 3 S2 150uW programmable sensor hub platform
Algorithms provide industry-leading accuracy and power consumption efficiency with low latency

Sunnyvale, CA – March 10, 2015 – QuickLogic Corporation (NASDAQ: QUIK), the innovator of ultra-low power programmable sensor hubs, today announced the addition of several new algorithms to its SenseMe™ Sensor Algorithm Library. When coupled with QuickLogic’s sensor hub silicon platforms and reference designs, the SenseMe algorithms enable designers of … Read More → "QuickLogic Expands its SenseMe Software Library for Smartphone and Wearable Applications"

Market’s Smallest Single-Chip Dual-Channel Filter from STMicroelectronics Streamlines Design of ZigBee® Remotes for Consumer and IoT Devices

March 10, 2015

Geneva, March 10, 2015 – STMicroelectronics’ new DLPF-GP-01D3 integrated dual differential filter can replace up to 16 discrete surface-mount components and save 35mm² of pc-board area in ZigBee^® RF4CE^{^[1]} remotes and equipment such as set-top boxes, TVs, home gateways, alarms, and lighting. The extra space gives designers freedom to simplify board layout, reduce product size, or add new functions.

The DLPF-GP-01D3 is … Read More → "Market’s Smallest Single-Chip Dual-Channel Filter from STMicroelectronics Streamlines Design of ZigBee® Remotes for Consumer and IoT Devices"

RTI Announces New Service to Help Organizations Create and Accelerate Industrial Internet of Things (IIoT) Systems

March 10, 2015

SUNNYVALE, Calif. -March 10, 2015— Real-Time Innovations (RTI), the Industrial Internet of Things connectivity platform company, today introduced a new service, the RTI Industrial Internet of Things (IoT) FastTrax. Industrial IoT FastTrax will help companies capitalize on the economic growth and environmental impact of the exploding Industrial Internet. According to GE and others, the Industrial IoT will add over $10 trillion to global GDP over the next 20 years. This growth will drive change across industries. The RTI Industrial IoT FastTrax service gives companies tailored recommendations and guidance to transform existing solutions … Read More → "RTI Announces New Service to Help Organizations Create and Accelerate Industrial Internet of Things (IIoT) Systems"

Cypress QDR-IV SRAMs Enable World’s Lowest Latency Network Switch

March 10, 2015

SAN JOSE, Calif., March 10, 2015 – Cypress Semiconductor Corp. (NASDAQ: CY), the Static Random Access Memory (SRAM) market leader, today announced that networking equipment maker Exablaze has selected Cypress’s QDR-IV SRAM for itsExaLINK Fusion networking switch. The switch utilizes a modular design implemented using a Xilinx Ultrascale FPGA interfaced to a QDR-IV memory. The ExaLINK Fusion leverages Cypress’s fastest QDR-IV device running at 1066 MHz, which provides the highest Random Transaction Rate (RTR) of any memory on the market.

RTR, the number … Read More → "Cypress QDR-IV SRAMs Enable World’s Lowest Latency Network Switch"

ESCATEC investment enables it to offer manufacture and test of next generation, high density, micro-scale PCBs

March 9, 2015

Heerbrugg, Switzerland – 9 March 2015 – ESCATEC, one of Europe’s leading providers of contract and manufacturing services, has invested in the next generation of ultra small needles for bed of nails testing of high density, micro-scale PCBs. This will enable the company to provide customers with next generation, high density, micro-scale PCBs that are growing in popularity, especially for wearable electronics and Internet of Things (IoT) applications. Automated bed of nails testing ensures that production costs are kept low for customers and that yields are improved as manual testing with probes is eliminated.

“PCBs are always getting smaller and … Read More → "ESCATEC investment enables it to offer manufacture and test of next generation, high density, micro-scale PCBs"

Synopsys’ IC Compiler II Enables Toshiba’s Tapeout of Complex 40-nm SoC, Proves out Game-Changing Capabilities

March 9, 2015

MOUNTAIN VIEW, Calif., March 9, 2015 /PRNewswire/ —

Highlights:

IC Compiler II enables Toshiba’s successful tapeout of advanced 40-nm SoC
6X faster design turnaround time with one-third of the memory footprint
60 percent smaller buffer area during clock tree synthesis delivers superior design area and power QoR
Seamless handling of multiple modes and corners reduces timing ECO iterations

Synopsys, Inc. (Nasdaq: SNPS) today announced that its IC Compiler^™ II place and route solution has enabled Toshiba to accelerate tapeout of an advanced 40 … Read More → "Synopsys’ IC Compiler II Enables Toshiba’s Tapeout of Complex 40-nm SoC, Proves out Game-Changing Capabilities"

IAR Systems adds major functionality to leading tools for Texas Instruments’ MSP430 microcontrollers

March 9, 2015

Uppsala, Sweden—March 9, 2015—IAR Systems® has launched a new version of its leading development toolchain IAR Embedded Workbench® for Texas Instruments’ ultra-low-power MSP430™ microcontrollers. In addition to the add-on product C-STAT® for integrated static code analysis, version 6.30 introduces stack usage analysis and faster build times through parallel build.

Stack usage analysis provides details on the maximum stack depth in an application. Calculating the stack space is notoriously hard for all but the smallest embedded systems. This fact makes worst case maximum stack depth very useful information in most embedded projects. Using the stack information now available … Read More → "IAR Systems adds major functionality to leading tools for Texas Instruments’ MSP430 microcontrollers"

Cypress Samples Its Second-Generation USB Type-C Controller in an Ultra-Small Chip-Scale Package for USB 3.1 Cables and Cable Adapters

March 9, 2015

SAN JOSE, Calif., March 9, 2015 – Cypress Semiconductor Corp. (NASDAQ: CY), the USB market leader, today sampled an ultra-small footprint, integrated USB Type-C cable controller solution with power delivery (PD). Optimized for 2.4-mm thin USB Type-C cable connectors, the programmable EZ-PD™ CCG2 controller is fully capable of supporting any USB Type-C Downstream Facing Port (DFP) or Upstream Facing Port (UFP) applications. EZ-PD CCG2 is available in a 3.3 mm2 Wafer Level Chip Scale Package (WLCSP) and is the first programmable solution to fully integrate both the Type-C transceiver and termination resistors … Read More → "Cypress Samples Its Second-Generation USB Type-C Controller in an Ultra-Small Chip-Scale Package for USB 3.1 Cables and Cable Adapters"

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