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LogMeIn ups IoT play with next generation of Xively

April 22, 2015

BOSTON, April 22, 2015 – LogMeIn, Inc. (NASDAQ: LOGM) today unveiled the next generation of its Xively Internet of Things (IoT) solution designed to help companies rapidly bring secure, Internet connected products to market, while accelerating their transition into connected product businesses. Built on a new ultrafast and highly secure connectivity platform, the new Xively introduces new management capabilities to help companies securely capture, analyze and take action on connected product data. It also introduces a foundation for building first-of-their-kind connected business applications – applications that will bring connected product and connected customer information to line-of-business workers. As a result, product companies can … Read More → "LogMeIn ups IoT play with next generation of Xively"

Exar Releases New 40V PowerBlox Family

April 21, 2015

Fremont, CA – April 21, 2015 – Exar Corporation (NYSE: EXAR), a leading supplier of high-performance integrated circuits and system solutions, introduces a new line of 40V switching regulators to add to its popular PowerBlox™ family of DC/DC converter products. The XR76203, XR76205 and XR76208 are synchronous step-down regulators supporting point-of-load (POL) supplies of 3A, 5A and 8A, respectively. The devices are designed to provide a wide 5V to 40V input voltage range while providing excellent transient response and output accuracy over the entire voltage range using Exar’s proprietary emulated current mode Constant On-Time (COT) control loop. These … Read More → "Exar Releases New 40V PowerBlox Family"

Arteris Delivers FlexNoC Physical™ Interconnect IP to Accelerate SoC Layout

April 21, 2015

Linley Mobile Conference 2015, SANTA CLARA, California – April 22, 2015 – Arteris Inc., the inventor and only supplier of silicon-proven commercial network-on-chip (NoC) interconnect IP solutions, today announced availability of Arteris FlexNoC Physical interconnect IP, a breakthrough that accelerates system-on-chip (SoC) physical design.

Arteris FlexNoC interconnect IP has always been layout friendly because the Arteris NoC technology uses fewer wires, enables fine-grained pipeline register placement nearly anywhere in the interconnect, and allows distributed IP placement. This technology has been providing the world’s top semiconductor design teams the benefits of minimizing wire … Read More → "Arteris Delivers FlexNoC Physical™ Interconnect IP to Accelerate SoC Layout"

ASSET enhances software debug and hardware validation tools for Intel® Broadwell-DE microarchitecture

April 21, 2015

Richardson, TX (April 21, 2015) –Engineers designing microserver and other hyperscale workload systems based on the new Intel®microarchitecture codenamed Broadwell-DE will be able to quickly debug software and validate high-speed communications interconnects with ASSET® InterTech’s (www.asset-intertech.com) SourcePoint™ and ScanWorks® platforms. The first generation of the Intel Xeon® Processor D family is based on the microarchitecture previously referred to as Broadwell-DE. 

“The trajectory that cloud computing is following is unsustainable without breakthrough technology like the Broadwell microarchitecture and the Intel Xeon Processor D … Read More → "ASSET enhances software debug and hardware validation tools for Intel® Broadwell-DE microarchitecture"

“Thursday is Training Day” at the 52nd Design Automation Conference

April 21, 2015

LOUISVILLE, Colo. –– April 20, 2015 –– The  Design Automation Conference (DAC),  the premier conference devoted to the design and automation of electronic systems, will feature a day of training to provide engineers with the latest techniques required for today’s designs.  DAC 2015 will be held at the Moscone Center in San Francisco, Calif. from June 7-11, 2015 and conference registration is now open, including sign-up for “Thursday is Training Day.”

Organized into separate subject-specific tracks, each track comprises two separate half-day sessions: in the morning from 10:15am to 1:15pm, and in the … Read More → "“Thursday is Training Day” at the 52nd Design Automation Conference"

Wind River Delivers Solutions for Next Generation ADAS and Autonomous Vehicle Innovation

April 21, 2015

NEWS HIGHLIGHTS

•       New offering helps customers develop safety-critical automotive systems that are more secure and enables advanced vehicle applications such as ADAS and autonomous driving.
•       Wind River automotive software solutions address new demands rising from growth of IoT and connected car.
•       Wind River showcasing latest automotive technologies at SAE World Congress in booth 265 during April 21-23

SAE WORLD CONGRESS, DETROIT, Mi. – Apr. 21, 2015 – … Read More → "Wind River Delivers Solutions for Next Generation ADAS and Autonomous Vehicle Innovation"

Synopsys’ Modeling of 10-nanometer Parasitic Variation Effects Ratified by Open-Source Standards Board

April 21, 2015

MOUNTAIN VIEW, Calif., April 21, 2015 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS) today announced new extensions to its open-source Interconnect Technology Format (ITF) which enable modeling of complex device and interconnect parasitic effects at the advanced 10-nanometer (nm) process node. The new extensions include modeling of variation effects due to multi-patterning technology (MPT). Synopsys collaborated with the members of the Interconnect Modeling Technical Advisory Board (IMTAB) (member list available at www.imtab.org), an IEEE-ISTO Federation Member Program, to define and … Read More → "Synopsys’ Modeling of 10-nanometer Parasitic Variation Effects Ratified by Open-Source Standards Board"

Next-Generation Embedded-Flash Microcontrollers from STMicroelectronics Drive Car Safety and Security to a New Level

April 21, 2015

Geneva, April 21, 2015 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and a top supplier of automotive ICs, today announced  new members in its multi-core microcontroller (MCU) family aimed at making cars safer. These new devices are the first to be launched with ST’s proprietary in-house 40nm embedded Flash process.

The new automotive MCUs combine compliance with the most stringent automotive safety standards[1], encryption for security, and increased memory size for … Read More → "Next-Generation Embedded-Flash Microcontrollers from STMicroelectronics Drive Car Safety and Security to a New Level"

Cadence Expands OrCAD PCB Portfolio with New Products and Technologies to Enable Faster Product Creation

April 21, 2015

SAN JOSE, Calif., 21 Apr 2015

Highlights:

  • Latest release marks 30th anniversary of OrCAD innovation and product design
  • New products offer seamless product integration, more comprehensive fabrication checks and simplified documentation methods
  • Key feature updates focused on more interactive routing capability and additional high-speed design qualities

Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced five new OrCAD® products and three key feature updates … Read More → "Cadence Expands OrCAD PCB Portfolio with New Products and Technologies to Enable Faster Product Creation"

KLA-Tencor Introduces New Portfolio for Advanced Semiconductor Packaging

April 21, 2015

MILPITAS, Calif., April 16, 2015—Today, KLA-Tencor Corporation (NASDAQ: KLAC) announced two new systems that support advanced semiconductor packaging technologies: CIRCL-AP™ and ICOS® T830. Designed for characterization and monitoring of the diverse processes used in wafer-level packaging, CIRCL-AP enables all-surface wafer defect inspection, review and metrology at high throughput. The ICOS T830 provides fully automated optical inspection of integrated circuit (IC) packages, leveraging high sensitivity with 2D and 3D measurements to determine final package quality for a wide range of device types and sizes. Both … Read More → "KLA-Tencor Introduces New Portfolio for Advanced Semiconductor Packaging"

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