News – Page 1536 – EEJournal

Microsemi Strengthens Leadership in Defense and Security with Category 1A Trusted Supplier Accreditation From DMEA

February 20, 2015

ALISO VIEJO, Calif.—Feb. 18, 2015—Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced it has received the Category 1A Trusted Design, Test and Broker accreditation from the Defense Microelectronics Activity (DMEA). The completion of the Category 1A Trusted accreditation is a major milestone for Microsemi, and is part of its ongoing strategy to become one of a few companies to deliver Trusted Integrated Circuit (IC) solutions that can be leveraged in today’s critical applications requiring assurance of silicon design and manufacturing as outlined in DOD policy (DODI 5200.44). … Read More → "Microsemi Strengthens Leadership in Defense and Security with Category 1A Trusted Supplier Accreditation From DMEA"

4DSP’s PC870 Delivers High-Bandwidth Analog I/O and UltraScale FPGA Performance for PCIe

February 20, 2015

February 20, 2015 — Austin, TX – 4DSP announced a new high-performance PCI Express (PCIe) card today called the PC870 which provides one 10-bit analog-to-digital (A/D) channel at 5Gsps and one 10-bit digital-to-analog (D/A) channel at 5Gsps. Adapted from the Kintex UltraScale-based PC820 FPGA carrier card, the PC870 features advanced DSP capabilities, serial connectivity options, 4GB of DDR3 SDRAM, and a PCIe Gen3 interface that can support up to eight lanes.

The low-latency data path of the PC870 enables 2.2GHz of instantaneous analog bandwidth in both the receive and transmit directions. The analog signal input and output are available … Read More → "4DSP’s PC870 Delivers High-Bandwidth Analog I/O and UltraScale FPGA Performance for PCIe"

Saelig Introduces Pre-compliance EMC Probe Kits

February 19, 2015

Fairport, NY: Saelig Company, Inc. announces the availability of the TBPS01-TBWA2 EMC Probe Kit, which includes investigative near-field probes and a wideband amplifier to increase the versatility of economical spectrum analyzers to identify EMC issues. The economical TBPS01-TBWA2 EMC Probe Kit consists of four rubber-handled near-field probes (three H-field and one E-field), a 20dB or a 40dB wideband amplifier, and associated cables, supplied in an attractive wooden case. The shielded probes have built-in ferrites and insulated rubber handles to insure that measurements are insensitive to the human hand.

The H- or E-field probes … Read More → "Saelig Introduces Pre-compliance EMC Probe Kits"

Allegro MicroSystems, LLC Introduces New Hall-Effect Speed/Direction Sensor IC With Hysteresis Detection

February 19, 2015

Worcester, MA – February 17, 2015 – Allegro MicroSystems, LLC introduces a new Hall-effect speed and direction sensor IC with hysteresis detection. The A1232 is a highly sensitive, temperature stable, magnetic sensing device ideal for use in ring magnet based speed and direction systems in harsh automotive and industrial environments. It is the first device of its kind with the ability to detect when it powers … Read More → "Allegro MicroSystems, LLC Introduces New Hall-Effect Speed/Direction Sensor IC With Hysteresis Detection"

Power Factor Correction Boost Controller

February 19, 2015

MILPITAS, CA – February 19, 2015 – Linear Technology Corporation announces the LT8312, a power factor correction (PFC) boost controller that can achieve a power factor of greater … Read More → "Power Factor Correction Boost Controller"

STMicroelectronics Shatters Performance Limitations for Ultra Low-Power Applications with New STM32L4 Microcontrollers

February 19, 2015

Geneva, February 19, 2015 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has combined its ultra low-power microcontroller technology with ARM^® Cortex^®-M4 know-how to create the STM32L4 series for next-generation energy-conscious consumer, industrial, medical, and metering applications.

The first two microcontrollers in the series, the STM32L476 and STM32L486, … Read More → "STMicroelectronics Shatters Performance Limitations for Ultra Low-Power Applications with New STM32L4 Microcontrollers"

Imec Reports Breakthrough Results on Directed Self-Assembly at SPIE Advanced Lithography 2015

February 19, 2015

Leuven (Belgium)–Feb. 19, 2015–At next week’s SPIE advanced lithography conference, to be held in San Jose, Calif., Feb. 22–26, imec will present breakthrough results on Directed Self-Assembly (DSA) process development. Together with semiconductor equipment supplier Tokyo Electron and Merck, a leading chemical and pharmaceutical company that acquired AZ Electronic Materials in May 2014, imec has significantly improved DSA defectivity in the past year, … Read More → "Imec Reports Breakthrough Results on Directed Self-Assembly at SPIE Advanced Lithography 2015"

Dual-band Wi-Fi and dual-mode Bluetooth offered in a small, powerful, stand-alone module by u-blox

February 19, 2015

Thalwil, Switzerland – February 19, 2015 – u-blox, a global leader in wireless and positioning modules and chips, announces ODIN-W262, a new stand-alone multiradio module designed for Internet-of-Things applications. The professional-grade (-40 °C to +85 °C) module makes adding wireless connectivity to any product quick and easy, with the added benefit that it is radio type-approved in countries across the world. A robust, built-in antenna provides flexibility with respect to the module’s installed position and orientation. Applications include cable replacement running in Wireless Multidrop and Extended Data Mode for advanced … Read More → "Dual-band Wi-Fi and dual-mode Bluetooth offered in a small, powerful, stand-alone module by u-blox"

STMicroelectronics and Flextronics Reveal World’s First Plug-In Charger Platform with Zero No-Load Power Consumption

February 18, 2015

Geneva, Switzerland; San Jose, CA, February 18, 2015– STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and a leader in ICs for Power Conversion, and Flextronics,an innovative supply chain solutions company that delivers design, engineering, manufacturing and logistics services to a wide range of industries and end-markets and the worldwide leader in smartphone and tablet power adapters, have jointly developed a plug-in charging platform based on an ST multi-mode power-management controller that delivers breakthrough technology for mobile devices. The new energy-efficient platform is designed with the industry’s most effective power-management architecture to … Read More → "STMicroelectronics and Flextronics Reveal World’s First Plug-In Charger Platform with Zero No-Load Power Consumption"

Artesyn Embedded Technologies Announces Open Compute Project (OCP) Platform for Network Functions Virtualization

February 18, 2015

Artesyn Embedded Technologies today announced its first high performance integrated computing system inspired by Open Compute Project (OCP) standards. The Centellis^® OCP Platform is designed to help communication service providers dramatically lower the capital and operating expense associated with running their networks by leveraging open standard and open source hardware and software, and taking advantage of virtualization and cloud technologies. This new Centellis OCP Platform is a rack solution that integrates servers, storage and top-of-rack switches, and offers improvements in density, availability, flexibility, scalability, serviceability, … Read More → "Artesyn Embedded Technologies Announces Open Compute Project (OCP) Platform for Network Functions Virtualization"