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Zuken Empowers Collaboration for Product-centric Design with CR-8000 Advanced PCB Solutions

May 13, 2015

12 May 2015 – Munich, Germany and Westford, MA, USA – Zuken continues to make team collaboration even more straightforward with powerful functionality available in the latest version of its CR-8000 single and multi-board design solution. Zuken’s CR-8000 is the industry’s only next-generation, product-centric design solution for creating complex product designs.

Kazuhiro Kariya, Zuken Inc. Chief Technology Officer, said: “We launched CR-8000 with a vision that design processes are moving from a traditional PCB-centric approach … Read More → "Zuken Empowers Collaboration for Product-centric Design with CR-8000 Advanced PCB Solutions"

Vector Software Announces Advanced Integration with Lauterbach’s TRACE32® powerful suite of development tools

May 13, 2015

Providence, RI – 5/12/2015 – Vector Software, the world’s leading provider of innovative software solutions for robust embedded software quality, announced today an advanced integration with the Lauterbach TRACE32 product. The leading Test Automation Platform, VectorCAST, now enables development, test, and certification teams, to set and continuously collect, practically unlimited volumes of test data from RAM constrained embedded systems.

This latest integration benefits customers in Aerospace, Defense, Automotive, Medical … Read More → "Vector Software Announces Advanced Integration with Lauterbach’s TRACE32® powerful suite of development tools"

Sonics Introduces Semiconductor IP Industry’s First Power Management Solution Combining Fine-Grain Partitioning and Autonomous Control

May 13, 2015

Milpitas, Calif. – May 12, 2015 – Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) technologies and services, today introduced the ICE-Grain (Instant Control of Energy) Power Architecture for system-on-chip (SoC) design teams that require an automated power management solution with “worry-free implementation” at the highest level of abstraction. Sonics’ ICE-Grain Power Architecture is the semiconductor IP industry’s first and only complete power management sub-system comprised of configurable hardware IP blocks, embedded … Read More → "Sonics Introduces Semiconductor IP Industry’s First Power Management Solution Combining Fine-Grain Partitioning and Autonomous Control"

UMC Certifies ANSYS Power Integrity and Electromigration Solutions for 28 AND 40nm Technologies

May 13, 2015

PITTSBURGH – May 12, 2015 – ANSYS (NASDAQ: ANSS) simulation tools, which deliver needed accuracy and reduced turnaround time, while ensuring power integrity and electromigration (EM) reliability, have been certified by UMC 28 and 40-nanometer (nm) technologies.

As the world’s appetite for smart products continues to grow, 28-nanometer process technology is becoming the workhorse for most of the mobile, computing and Internet of Things applications, while 40-nanometer is becoming the lead technology for such automotive applications as microcontrollers. UMC, a leading … Read More → "UMC Certifies ANSYS Power Integrity and Electromigration Solutions for 28 AND 40nm Technologies"

AVX Introduces New SV Series High Voltage, Automotive Grade, Multilayer Ceramic, Radial Leaded Capacitors

May 13, 2015

GREENVILLE, S.C. (May 12, 2015) – AVX Corporation, a leading manufacturer of passive components and interconnect solutions, has introduced the new SV Series high voltage, automotive grade, multilayer ceramic (MLC), radial-leaded capacitors. Qualified to AEC-Q200 and rated for 1,000VDC, the new SV Series capacitors are designed with C0G (NP0) Class I dielectric materials, which exhibit an extremely low dissipation factor — providing excellent high rms current handling capabilities with minimal power losses in medium to high power resonant converters — and radial leads, which enable the mechanical decoupling of the MLC chip from the board, and provide the maximum mechanical stress relief … Read More → "AVX Introduces New SV Series High Voltage, Automotive Grade, Multilayer Ceramic, Radial Leaded Capacitors"

Cadence USB 3.0 Host Solution on TSMC 16nm FinFET Plus Process Achieves Industry Certification

May 13, 2015

SAN JOSE, Calif., 12 May 2015 – Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its USB 3.0 host IP solution for TSMC’s 16nm FinFET Plus (16FF+) process is one of the first to pass USB-IF compliance testing and receive USB-IF certification. The complete controller and PHY integrated solution is pre-verified, which enables designers to mitigate project risk and reduce system-on-chip (SoC) integration and verification time.

For more information on Cadence® IP for USB offerings, please visit: http://www.cadence.com/news/USBIP.

Cadence offers a complete USB 3.0 solution including the controller, PHY and verification IP. The … Read More → "Cadence USB 3.0 Host Solution on TSMC 16nm FinFET Plus Process Achieves Industry Certification"

Synopsys’ Verification IP for DDR4 3DS Enables DRAM Designs with Higher Density and Performance at Reduced Power

May 13, 2015

MOUNTAIN VIEW, Calif., May 13, 2015 /PRNewswire/ — Synopsys, Inc. (NASDAQ: SNPS) announces the availability of Verification IP (VIP) for the DDR4 3D Stacking (3DS) specification. Synopsys VIP for DDR4 3DS, based on its native SystemVerilog UVM architecture, is architected for ease of integration and configurability. The VIP for DDR4 3DS supports all JEDEC commands and provides pre-built DIMM (UDIMM, RDIMM, LRDIMM) models with protocol and timing checks, including support for memory vendor and the JEDEC standard part configurations. Synopsys’ VIP for DDR4 3DS is natively integrated with its Verdi® Protocol Analyzer, … Read More → "Synopsys’ Verification IP for DDR4 3DS Enables DRAM Designs with Higher Density and Performance at Reduced Power"

LDRA and Green Hills Software Deliver Industry-Leading Multicore Development and Verification

May 13, 2015

Wirral, U.K., and Santa Barbara, CA. May 13, 2015—LDRA,the leader in standards compliance, automated software verification, source code analysis, and test tools, and Green Hills Software, the worldwide leader in high assurance operating systems, have partnered to provide high-assurance application development on multicore platforms used in safety- and security-critical markets.

The growing emergence of multicore platforms and applications paves the way for new verification tool capabilities needed to complete high-assurance safety- and security-critical compliance activities. LDRA has developed such capabilities in partnership with Green Hills Software, resulting in a solution that enables developers to fully trace … Read More → "LDRA and Green Hills Software Deliver Industry-Leading Multicore Development and Verification"

PIL Launches P43 Long Range UltraSonic Sensors

May 13, 2015

May 13, 2015 – Erlensee, Germany — PIL announces the availability of its new P43 ultrasonic sensors to measure distances. Applications include object recognition for agriculture and fluid levels, distance measuring for trucks and loading ramps, level sensing in dusty conditions, parking lot detection/barrier monitoring as well as a variety of other industrial and manufacturing applications.

The PIL P43 ultrasonic sensors provides the industry’s greatest range  – from 250 mm to up to 6000 mm. M12, M18 and M30 dimensions are available – with or without thread or cubic housing. Highly accurate, it provides a small sound cone shape, two integrated internal LED’ … Read More → "PIL Launches P43 Long Range UltraSonic Sensors"

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