Applied Materials Unveils Breakthrough E-Beam Metrology Tool for FinFET Transistors and 3D NAND Devices
- New VeritySEM® 5i is the industry’s first in-line 3D CD SEM metrology system for volume production of advanced 3D devices
- Proprietary electron-filtering technology for high-aspect-ratio imaging, coupled with high resolution and tilted electron beam enable in-line 3D metrology
SANTA CLARA, Calif., February 23, 2015 – At the SPIE* Advanced Lithography conference in San Jose, Calif., Applied Materials, Inc., today announced the industry’s first in-line 3D CD SEM* metrology tool for solving the challenges of measuring the high aspect ratio and complex features of 3D NAND and FinFET devices. The new Read More → "Applied Materials Unveils Breakthrough E-Beam Metrology Tool for FinFET Transistors and 3D NAND Devices"

