News – Page 1524 – EEJournal

Mentor Graphics Acquires Tanner EDA

March 12, 2015

WILSONVILLE, Ore., March 3, 2015

Mentor Graphics Corp. (NASDAQ: MENT) today announced it has acquired the business assets of Tanner EDA, a leading tool provider for the design, layout and verification of analog/mixed-signal (AMS) and MEMS integrated circuits. With this acquisition, more designers will now have access to Tanner’s AMS products based on the strength and reach of the Mentor Graphics global sales organization. All Tanner EDA products as well as existing AMS products from Mentor will continue to be available and supported.

“Tanner EDA has built an outstanding reputation as … Read More → "Mentor Graphics Acquires Tanner EDA"

Teledyne LeCroy Announces MIPI M-PHY Automated Physical Layer Compliance Test, Expanding Solutions for the Mobile Market

March 11, 2015

MIPI Alliance Members Meeting, Seattle, March 10, 2015 – Teledyne LeCroy today announces automated physical layer transmitter compliance test capability for the MIPI M-PHY standard. The new compliance test software, QPHY-MIPI-MPHY, enables the highest level of confidence in M-PHY compliance by measuring a large number of cycles in a short period of time. Testing can be done on HS-MODE, PWM-MODE and SYS-MODE signals at all currently specified GEARs. A new active termination adaptor specifically designed for M-PHY testing ensures connection between the device under test and the oscilloscope is made in a simple, cost-effective, high fidelity manner. The new QPHY-MIPI-MPHY compliance software … Read More → "Teledyne LeCroy Announces MIPI M-PHY Automated Physical Layer Compliance Test, Expanding Solutions for the Mobile Market"

Altera Announces 30-Amp Integrated Digital DC-DC Converter For Generation 10 FPGAs

March 11, 2015

San Jose, Calif., —March 11, 2015—Altera Corporation (NASDAQ: ALTR) is adding a 30-amp PowerSoC DC-DC step-down converter to its growing portfolio of Enpirion power solutions for FPGAs. The 30-amp EM1130 is the first in a family of integrated digital DC-DC step-down converters that will provide power management for Altera’s Generation 10 FPGAs, specifically for Arria® 10 and Stratix® 10 FPGA core and transceiver power supply rails. The result of the successful acquisition of the Enpirion, Inc power IC company by Altera in 2013, the EM1130 digital power management device represents a major milestone in Altera’s endeavor to bring unprecedented optimized power … Read More → "Altera Announces 30-Amp Integrated Digital DC-DC Converter For Generation 10 FPGAs"

Fairchild’s 800V SuperFET II MOSFET Family Delivers Lowest On-Resistance and Broad Package Range

March 11, 2015

SAN JOSE, Calif. – March 9, 2015 — Fairchild (NASDAQ: FCS), a leading global supplier of high-performance power semiconductor solutions, today introduced its 800V SuperFET^® II MOSFET family, featuring broad package offerings and the industry’s lowest on-resistance (Rdson) andoutput capacitance (Coss). The new family enables designers to improve the efficiency, cost-effectiveness and reliability of high performance solutions requiring breakdown voltage higher than 600V / 650V, and also reduces the board space of these designs … Read More → "Fairchild’s 800V SuperFET II MOSFET Family Delivers Lowest On-Resistance and Broad Package Range"

Synopsys Galaxy Design Platform Deployed by HiSilicon Technologies for Implementation of FinFET Designs

March 11, 2015

MOUNTAIN VIEW, Calif., March 10, 2015 /PRNewswire/ —

Highlights:

Design Compiler Graphical and IC Compiler save several weeks of design time by minimizing iterations between synthesis and place and route
IC Compiler achieves HiSilicon Technologies’ aggressive power, performance and area targets and delivers predictable design closure
PrimeTime ADV and IC Compiler enable single-pass timing and power ECO closure

Synopsys, Inc. (Nasdaq: SNPS) today announced that HiSilicon Technologies, a leading provider for telecom network, wireless terminal and digital media chipset solutions, has broadly deployed Synopsys’ Galaxy^{™</ … Read More → "Synopsys Galaxy Design Platform Deployed by HiSilicon Technologies for Implementation of FinFET Designs"}

Silicon Impulse, New Leti IC Design Platform, Offers One-Stop-Shop For Ultra-low-power Technologies

March 11, 2015

GRENOBLE, France – March 10, 2015 – CEA-Leti today announced the launch of its Silicon Impulse IC design competence center, a comprehensive IC technology platform offering IC design, advanced intellectual property, emulator and test services along with industrial multi-project wafer (MPW) shuttles.

Established to increase the competitiveness of Leti’s industrial partners, Silicon Impulse provides immediate access to Leti’s and CEA-List’s advanced IC technologies and systems expertise. It also leverages Leti’s extensive experience in technology transfer. Collaboration between Leti and List experts and ecosystem partners aims to shorten time to market from idea to production. This process includes … Read More → "Silicon Impulse, New Leti IC Design Platform, Offers One-Stop-Shop For Ultra-low-power Technologies"

18V, 2A Synchronous Buck-Boost DC/DC with Dual Input PowerPath Control Enables Multi-Inputs & Extended Run Times

March 11, 2015

MILPITAS, CA – March 10, 2015 – Linear Technology announces the LTC3118, a dual input, wide voltage range synchronous buck-boost DC/DC converter with an intelligent, integrated low loss PowerPath™ control. Its unique power switch architecture provides high efficiency operation from either input source … Read More → "18V, 2A Synchronous Buck-Boost DC/DC with Dual Input PowerPath Control Enables Multi-Inputs & Extended Run Times"

Cavium’s XPliant™ Ethernet Switch Supports the Emerging Open Ecosystems

March 10, 2015

Open Compute US Summit 2015 – San Jose, CA, March 10, 2015 – Cavium, Inc., (NASDAQ: CAVM), a leading provider of semiconductor products that enable intelligent processing for enterprise, data center, wired and wireless networking today announced its commitment to driving an open ecosystem for data center switching. Qualification of hardware platforms as well as standardization of software interfaces enables both OEM and 3rd party innovation ushering in a new era in open Ethernet switching.

The Open Compute Project (OCP) was created with the goal of developing the most efficient data center designs for scalable solutions, by openly sharing ideas, specifications and … Read More → "Cavium’s XPliant™ Ethernet Switch Supports the Emerging Open Ecosystems"

Savings for Aerospace market as e2v inc releases the highest density MRAM device in the industry

March 10, 2015

The EV5A16B is a stacked solution, with two 16Mb MRAM devices from Everspin Technologies and is offered in a 54 pins stacked-package *TSOP. Available in commercial (0°C to 70°C) and Industrial (-40°C to 85°C) temperature ranges, the MRAM technology offers SRAM-compatible, 35-ns read/write timing with data retention and endurance and is used with microprocessors, **DSP, storage systems, instruments, and ***FPGAs.

Brad Little, Vice President and General Manager of e2v inc’s Semiconductor business unit commented, “Our new stacked-package MRAM will have a significant impact on our customers’ systems by addressing … Read More → "Savings for Aerospace market as e2v inc releases the highest density MRAM device in the industry"

QuickLogic Expands its SenseMe Software Library for Smartphone and Wearable Applications

March 10, 2015

Significant new capability added to the broadening SenseMe Software Library
Optimized for QuickLogic’s ArcticLink 3 S2 150uW programmable sensor hub platform
Algorithms provide industry-leading accuracy and power consumption efficiency with low latency

Sunnyvale, CA – March 10, 2015 – QuickLogic Corporation (NASDAQ: QUIK), the innovator of ultra-low power programmable sensor hubs, today announced the addition of several new algorithms to its SenseMe™ Sensor Algorithm Library. When coupled with QuickLogic’s sensor hub silicon platforms and reference designs, the SenseMe algorithms enable designers of … Read More → "QuickLogic Expands its SenseMe Software Library for Smartphone and Wearable Applications"

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