industry news archive
Subscribe Now

Bosch SMI130 sensor measures acceleration and yaw rate in three dimensions

  • Acceleration and yaw rate sensor with six sensing axes
  • AEC-Q100 qualified for automotive applications
  • Wide range of setting options in an ultra-compact package

Bosch has announced the launch of a new sensor which offers six degrees of freedom (6DoF) by measuring acceleration in all three spatial dimensions and yaw rates around all axes. The SMI130 is designed for non- safety-critical applications in the automotive industry, including in-dash navigation and telematics systems such as toll, eCall, and alarm systems.

For users of navigation devices, the new … Read More → "Bosch SMI130 sensor measures acceleration and yaw rate in three dimensions"

Leading Research Institutes and Charitable Foundations Contract with imec for the Development of Powerful Next-Generation Tools for Neuroscience Research

Leuven (Belgium), November 7, 2013 – Nanoelectronics research center imec announced today that the Howard Hughes Medical Institute (HHMI), the Allen Institute for Brain Science, the Gatsby Charitable Foundation, the Wellcome Trust, and University College London (UCL) have committed 4.2 million Euro ($5.5 million) in R&D collaboration contracting with imec to develop and manufacture a state-of-the-art sensor array for recording neural activity in animal brains.

The proposed sensor array will advance current neural probe technology used to detect extracellular electrical activity in the brain. The innovative solution will incorporate recording electrodes at … Read More → "Leading Research Institutes and Charitable Foundations Contract with imec for the Development of Powerful Next-Generation Tools for Neuroscience Research"

Innovasic Launches Next-Generation Industrial Ethernet Switch

Albuquerque, New Mexico, November 2013 – Innovasic announces its next generation of Industrial Ethernet switch identified as the fido5000, Real-time Ethernet, Multi-protocol (REM) Switch.  The fido5000 REM Switch can be paired with any processor including any ARM® CPU or Innovasic’s fido1100® communication controller and supports PROFINET, PROFINET IRT (version 2.3), EtherNet/IP, EtherNet/IP with Beacon-based DLR, ModbusTCP, EtherCAT, SERCOS, and POWERLINK all in a single silicon solution.

Unlike other standalone switches that leave protocol integration up to the user, the fido5000 REM Switch comes with a driver … Read More → "Innovasic Launches Next-Generation Industrial Ethernet Switch"

PRO DESIGN Launches New Modular Virtex 7 Duo System For High Performance ASIC & SoC Prototyping

Munich, 08 November 2013 – PRO DESIGN, veteran in the EMS and EDA industry, today announced the launch of its proFPGA duo V7 Prototyping System, a high performance, modular, flexible and cost efficient solution, which fulfils highest demands in the area of ASIC & SoC Prototyping.

The system consists of the proFPGA duo motherboard and various pluggable Virtex 7 based FPGA modules. One unique feature of the proFPGA solution is, that you can mix and match different Xilinx Virtex 7 based FPGA Modules like the XC7VX330 … Read More → "PRO DESIGN Launches New Modular Virtex 7 Duo System For High Performance ASIC & SoC Prototyping"

Merit Sensor Systems, Inc. Introduces TR Series Pressure Sensor Product Line

Napa, California, November 7, 2013 — Merit Sensor Systems, Inc., a leading designer, developer and manufacturer of pressure sensing solutions, announced here today at the MEMS Industry Group (MIG) Annual Executive Congress, its TR Series temperature-compensated pressure sensor product line. The TR Series packaged pressure sensor features Merit Sensor’s “back-side entry” approach, where the sensing media cannot come in contact with the active, top side of the pressure sensing die. With this approach, the media remains isolated from the electronic circuitry of the Silicon pressure sensing element. This technology gives customers a robust and reliable solution while minimizing the greater … Read More → "Merit Sensor Systems, Inc. Introduces TR Series Pressure Sensor Product Line"

LDRA Tools Help Coressent Technology Clients Achieve Rigid Safety-Critical Standards

Wirral, U.K. November 7, 2013. LDRA, the leader in standards compliance, automated software verification, source code analysis and test tools, chooses Coressent Technology as a value-added reseller (VAR) of its point tools—LDRAunit, LDRArules, and LDRAcover. Coressent Technology combines intellectual property development, consulting services, and embedded technology to address device production for clients. LDRA tools complete Coressent Technology solution for safety-critical products designed for … Read More → "LDRA Tools Help Coressent Technology Clients Achieve Rigid Safety-Critical Standards"

Multi-function Boundary-scan Testers Cover All Bases

Eindhoven, the Netherlands, November 2013,– JTAG Technologies is proud to announce the latest in its highly regarded range of boundary-scan controller hardware for PCB assembly and system testing– the versatile JT 5705 series. This completely new design concept incorporates both JTAG/boundary-scan controller functions and mixed-signal I/O channels. Extensive input protection is provided to ensure high levels of in-service reliability and low maintenance. Connection to the tester is via a USB interface. 

The first in the series –  JT 5705/USB – is supplied as desk-top instrument, primarily aimed at hardware validation applications in … Read More → "Multi-function Boundary-scan Testers Cover All Bases"

Low-cost, brushless motor development in the palm of your hand: TI introduces InstaSPIN-FOC™ MCU LaunchPad and motor drive BoosterPack

Houston, TX (Nov. 7, 2013) – Adding to the popular, low-cost TI MCU LaunchPad evaluation kit ecosystem, Texas Instruments (TI) (NASDAQ: TXN) today announced the new C2000™ InstaSPIN-FOC™ (field-oriented-control) LaunchPad and DRV8301motor drive BoosterPack plug-in module, creating a fully-functional sensorless motor control system for just $66 USD. Traditional sensorless motor control development is complicated and unattainable for most developers … Read More → "Low-cost, brushless motor development in the palm of your hand: TI introduces InstaSPIN-FOC™ MCU LaunchPad and motor drive BoosterPack"

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...