News – Page 1472 – EEJournal

Pasternack Introduces New Portfolio of Millimeter Wave Directional Waveguide Couplers

July 9, 2015

Irvine, CA – Pasternack, a leading manufacturer and supplier of RF, microwave and millimeter wave products, unveils a brand new family of instrumentation grade directional waveguide couplers boasting accurate performance up to 110 GHz. These ultra-high frequency waveguide couplers are commonly used for signal sampling and other general purpose applications in wireless transmit/receive systems, test benches, satellite communications, radar systems, point-to-point backhaul and telecom.

In this latest release of waveguide directional couplers from Pasternack are 28 unique models spanning a frequency range of 18 GHz to 110 GHz in seven popular frequency bands including K, Ka, Q, U, … Read More → "Pasternack Introduces New Portfolio of Millimeter Wave Directional Waveguide Couplers"

IRT Nanoelec Partners Achieve 3D Chip-stacking Technology & 3D Network-on-chip Framework for Digital Processing

July 9, 2015

GRENOBLE, France – July 09, 2015 – IRT Nanoelec, an R&D consortium focused on Information and Communication Technologies (ICT) using micro- and nanoelectronics, and its partners CEA-Leti, STMicroelectronics and Mentor Graphics have realized an innovative 3D chip called “3DNoC” to demonstrate the use of 3D stacking technology in scalable, complex digital systems-on-chip (SoCs).

The 3DNoC chip is based on a 2D die that can be used in a stand-alone applicative mode, and also in a 3D stack with several dice, to multiply the processing performance of the system. The project’s complete demonstration platform shows both the simulated and … Read More → "IRT Nanoelec Partners Achieve 3D Chip-stacking Technology & 3D Network-on-chip Framework for Digital Processing"

TI makes high-accuracy measurement more attainable with the first current-sense amplifier to integrate a high-precision, low-drift shunt resistor

July 9, 2015

DALLAS (July 9, 2015) – Texas Instruments (TI) (NASDAQ: TXN) today introduced the industry’s first current-sense amplifier to integrate a high-precision, low-drift shunt resistor, which can deliver highly accurate measurements over a wide temperature range. TI’s INA250 integrates the shunt resistor with a bi-directional, zero-drift current-sense amplifier to support both low-side and high-side implementations. Its accuracy and low drift reduce or may eliminate designers’ calibration effort for many systems. This integration also enables lower system cost and a smaller board footprint compared to competitive solutions. For more information about the … Read More → "TI makes high-accuracy measurement more attainable with the first current-sense amplifier to integrate a high-precision, low-drift shunt resistor"

TI half-bridge gate driver improves power system performance in hybrid vehicles

July 8, 2015

DALLAS (July 8, 2015) – Texas Instruments (TI) (NASDAQ: TXN) today introduced the industry’s fastest 120-V automotive grade half-bridge gate driver with robust handling features. This driver provides a propagation delay at 15ns with short rise and fall times and the tightest delay matching of 1ns for 12-V to 48-V DC/DC power supplies. The UCC27201A-Q1 high-side/low-side gate driver offers advanced noise tolerance, resulting in improved overall system performance for hybrid vehicles. For more details, see www.ti.com/UCC27201A-Q1-pr.

The UCC27201A-Q1 is the only automotive gate driver to offer negative voltage handling capability … Read More → "TI half-bridge gate driver improves power system performance in hybrid vehicles"

Automotive High-Side Drivers from STMicroelectronics Meet Toughest Specifications for Use in Stop-Start Vehicles

July 8, 2015

Geneva, July 8, 2015 – STMicroelectronics has introduced the industry’s first automotive high-side drivers to meet the stringent cold-cranking specification[1] of the German car industry’s LV124 test schedule, making them ideal for vehicles with stop-start technology.

The new VND7050AJ12 and VND7140AJ12 have minimum supply voltage of 3.2V, which is the best in the market, to keep essential equipment such as dashboard instruments operating as the vehicle battery voltage dips during engine cranking. The ST devices provide a compact and reliable replacement for electromechanical relays and associated circuitry, and are 40% smaller than the nearest competing … Read More → "Automotive High-Side Drivers from STMicroelectronics Meet Toughest Specifications for Use in Stop-Start Vehicles"

Synopsys’ LightTools Delivers Innovative Modeling Capabilities for Freeform Optics in Illumination Systems

July 8, 2015

Synopsys, Inc. (Nasdaq: SNPS) today announced the availability of version 8.3 of its LightTools® illumination design software, which offers a new Advanced Design Module with robust capabilities for modeling freeform optics for a wide range of applications. The new capabilities enable users to easily incorporate freeform surfaces in illumination designs to produce optical systems that have increased energy efficiency, superior light control and innovative design forms. In addition, LightTools 8.3 delivers new features for highly accurate design and modeling of phosphor-based LED systems.

Advanced Design Module

The new LightTools Advanced Design Module introduces a set … Read More → "Synopsys’ LightTools Delivers Innovative Modeling Capabilities for Freeform Optics in Illumination Systems"

SmartDV’s USB Power Delivery Verification IP Successfully Deployed by Lattice Semiconductor

July 8, 2015

SAN DIEGO, CA – July 8, 2015 – Within a four week period, SmartDV Technologies, the verification intellectual property (VIP) company, delivered verification IP to Lattice Semiconductor Corporation (NASDAQ: LSCC), the leading provider of customizable smart connectivity solutions. Lattice Semiconductor used the verification IP to verify and tape out their chip with a type C/CC connector interface that supports the new USB power delivery specification.

USB Power Delivery Verification IP, one of 75+ VIPs from SmartDV, uses compiler technology that automates VIP creation as well as customization to meet customer needs, resulting in shorter support turnaround time. Customers have source code … Read More → "SmartDV’s USB Power Delivery Verification IP Successfully Deployed by Lattice Semiconductor"

STMicroelectronics Shows How to Transform Products to Suit Dynamic Mobile and IoT Markets in China

July 8, 2015

Shanghai, China, 8 July, 2015 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is showcasing its latest products and technologies for mobile, wearable, and Internet-of-Things applications at Mobile World Congress Shanghai, July 15-17, 2015. ST designs, manufactures, and delivers solutions that help its Chinese customers transform the world for the better.

China is one of the world’s largest and most dynamic Mobile and IoT markets. According to IDC^{^[1]}, 420.7 million smartphones were shipped to China in 2014 and the year-over-year growth for the smartphone market in China is … Read More → "STMicroelectronics Shows How to Transform Products to Suit Dynamic Mobile and IoT Markets in China"

LDRA Tool Suite Selected for Industry-Leading Structural Coverage and Standards Compliance

July 8, 2015

Wirral, U.K. July 8, 2015—LDRA, the leader in standards compliance, automated software verification, source code analysis and test tools, announces that Wind River® has selected the LDRA tool suite and DO-178 Qualification Support Packsfor both internal software quality assurance and to help Wind River customers expedite the qualification and certification of their aerospace and defense applications. The selection of LDRA hinged on the ability of its tools to achieve 100 percent MC/DC coverage at both source and assembler levels—a mandatory requirement for object code verification—and to perform data coupling … Read More → "LDRA Tool Suite Selected for Industry-Leading Structural Coverage and Standards Compliance"

STMicroelectronics Introduces First Automotive CAN ESD Protection Devices Compliant with All Key Interface Protocols

July 7, 2015

Geneva, July 7, 2015 – The continual introduction of new electronics-based features in cars, including various Advanced Driver Assistance Systems (ADAS), has led to a proliferation of communications protocols that offer different combinations of speed, cost, and flexibility. Now, STMicroelectronics has introduced two new devices that combine superior protection of CAN (Controller Area Network) bus lines against electrostatic discharges and other transients and market-unique compliance with all key automotive interfaces.

The ESDCAN02-2BWY and ESDCAN03-2BWY are automotive-grade dual-line Transil™ devices that leverage ST’s long-term leadership in transient protection devices^{^[1]}and … Read More → "STMicroelectronics Introduces First Automotive CAN ESD Protection Devices Compliant with All Key Interface Protocols"

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