News – Page 1461 – EEJournal

EMA Adds Industry First Bi-directional Interface Between OrCAD and Arena PLM

August 4, 2015

Rochester, NY (August 4, 2015) – EMA Design Automation® (ema-eda.com), a fullservice provider of Electronic Design Automation (EDA) solutions, and Arena Solutions, the pioneer of cloud-based Product Lifecycle Management (PLM) applications, today announced that Cadence® OrCAD® PCB (printed circuit board) design tools and the Arena cloud-based PLM system are now more comprehensively integrated.

“This new software integration is a result of the strategic alliance we announced at … Read More → "EMA Adds Industry First Bi-directional Interface Between OrCAD and Arena PLM"

New Cadence Joules RTL Power Solution Delivers 20X Faster Time-Based Power Analysis within 15 Percent Accuracy to Signoff

August 4, 2015

SAN JOSE, Calif., August 4, 2015?Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the Cadence® Joules? RTL Power Solution. This new register-transfer level (RTL) power analysis solution enables system-on-chip (SoC) design teams to analyze power consumption accurately during design exploration. Built on a multi-threaded architecture, the Joules RTL Power Solution delivers 20X faster time-based RTL power analysis when compared to other methods.

Incorporating rapid prototype technology from the Cadence Genus? Synthesis Solution engine, the Joules RTL Power Solution can analyze designs of up to 20 million instances overnight with gate-level accuracy within 15 percent of final power as signed off … Read More → "New Cadence Joules RTL Power Solution Delivers 20X Faster Time-Based Power Analysis within 15 Percent Accuracy to Signoff"

New Chip Inductors Offer Highest Inductance and Lowest DCR of any 0402-sized RF Choke

August 4, 2015

Cary, IL, USA – Developed for use in mobile devices and cellular infrastructure equipment,Coilcraft’s new 0402DF Series chip inductors offer higher inductance values and significantly lower DC resistance than other 0402-sized inductors, making them ideal for RF choke and filtering applications.

Micrium RTOS Kernels Support Xilinx’ All Programmable Zynq UltraScale+ MPSoC

August 4, 2015

Weston, Florida–August 4, 2015– Micrium today announced commercial real time operating system (RTOS) support for Xilinx’ new All Programmable Zynq® UltraScale+™ MPSoC. Micrium’s µC/OS-II®, µC/OS-III® kernels and full suite of RTOS components run on the ARM Cortex A53 and Cortex R5 CPUs as well as the Xilinx MicroBlaze™ FPGA-based soft processor core, enabling customers to select a single OS for all their embedded software needs on … Read More → "Micrium RTOS Kernels Support Xilinx’ All Programmable Zynq UltraScale+ MPSoC"

Advantech Launches Full Support of Microsoft Windows 10 Enabling the IoT

August 4, 2015

July 30, 2015, Irvine, CA – Advantech, a global leader in the embedded system market, is pleased to announce its support of the newly released Windows 10 IoT (Internet of Things). Windows 10 IoT will power a range of intelligent connected devices from smaller equipment such as gateways or mobile point-of-sale units, to industrial devices like robots and specialty medical equipment. Designed to connect through Azure IoT Services, Windows 10 IoT offers enterprise-grade security along with native connectivity for machine-to-machine and machine-to-cloud scenarios.

Connecting to Azure Cloud Services

Azure IoT Suite is an integrated offering that takes advantage of … Read More → "Advantech Launches Full Support of Microsoft Windows 10 Enabling the IoT"

Toshiba Develops World’s First 256Gb, 48-Layer BiCS FLASH

August 4, 2015

IRVINE, Calif., Aug. 3, 2015 — Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today unveiled the new generation of BiCS FLASH™, a three-dimensional (3D) stacked cell structure flash memory*1. The new device is the world’s first*2 256-gigabit (Gb *4) (32 gigabyte) 48-layer BiCS FLASH device and also deploys industry-leading 3-bit-per-cell TLC (triple-level cell) technology. Sample shipments will start in September.

BiCS FLASH is based … Read More → "Toshiba Develops World’s First 256Gb, 48-Layer BiCS FLASH"

ST Unveils its DOCSIS 3.1 Chipset Solution, Opening Multi-Gigabit Era to Cable MSOs

August 4, 2015

Geneva, August 4, 2015 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced the STiD325 (codenamed Barcelona), its DOCSIS^{^[1]} 3.1 chipset for Broadband CPE^{^[2]} Cable Modems, embedded Media Terminal Adapters (eMTAs), and Gateways, as well … Read More → "ST Unveils its DOCSIS 3.1 Chipset Solution, Opening Multi-Gigabit Era to Cable MSOs"

RTI Introduces First Edge-to-Cloud Connectivity Software for the Industrial Internet of Things (IIoT)

August 4, 2015

SUNNYVALE, Calif. – August 4, 2015— Real-Time Innovations (RTI), the Industrial Internet of Things connectivity platform company, today introduced Connext DDS 5.2, the first software solution to address application-to-application data exchange at both the network edge and in the cloud. The new version adds support for load balancing of analytics and transaction processing via a message queuing service. This allows IIoT service providers to take advantage of cloud elasticity to process more data and transactions while retaining low latency.

Connext DDS now supports all of the fundamental communication patterns used in the … Read More → "RTI Introduces First Edge-to-Cloud Connectivity Software for the Industrial Internet of Things (IIoT)"

Wind River Achieves CMMI Level 3 Appraisal for Automotive Expertise and Services

August 4, 2015

ALAMEDA, Calif. – Aug 4, 2015 – Wind River®, a global leader in delivering software for the Internet of Things (IoT), announced that it has been appraised at Level 3 of the CMMI Institute’s Capability Maturity Model Integration (CMMI)® for its worldwide Automotive Solutions & Professional Services.

Wind River completed a CMMI SCAMPI ‘A’ appraisal and achieved a CMMI Capability Level 3 in 18 process areas, resulting in a CMMI Maturity Level 3. This appraisal further builds on Wind River’s past CMMI Level 3 achievements; the first of which … Read More → "Wind River Achieves CMMI Level 3 Appraisal for Automotive Expertise and Services"

Synopsys and ASMedia Announce Industry’s First USB 3.1 Interoperability Demonstration

August 3, 2015

MOUNTAIN VIEW, Calif. and TAIPEI, Taiwan, Aug. 3, 2015 /PRNewswire/ —

Highlights:

Interoperability demonstration shows successful 10 Gbps USB 3.1 data transfers between the DesignWare USB 3.1 Device Controller IP and ASMedia USB 3.1 Host Controller IC
Demonstration validates the readiness of the DesignWare USB 3.1 Device Controller for integration into SoCs
ASMedia’s USB 3.1 Host Controller IC, the first USB-IF certified USB 3.1 product, provides a silicon-proven IC solution for USB 3.1
USB 3.1 specification delivers double the data throughput of SuperSpeed USB 3.0 for 10 … Read More → "Synopsys and ASMedia Announce Industry’s First USB 3.1 Interoperability Demonstration"