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University of Toronto and Sendyne to Present Innovative Power Supply Design for Mobile Devices at the IEEE Applied Power Electronics Conference

New York, New York, March 4, 2014 – A joint collaboration between the University of Toronto and Sendyne Corp. has yielded a new circuit that enables a smaller, lighter battery and power subsystem for tablet PCs and other portable devices. 

The volume occupied by the power supply circuit has been a limiting factor for  miniaturization of the electronics in mobile devices. Current power supply designs occupy anywhere between 20% and 80% of the volume of such devices, depending on the application. A significant portion of this volume is determined by the size of inductors and capacitors used in such power supply circuits.</ … Read More → "University of Toronto and Sendyne to Present Innovative Power Supply Design for Mobile Devices at the IEEE Applied Power Electronics Conference"

AMIQ EDA Releases Version 3.5 of the Design and Verification Tools (DVT) IDE

March 3, 2014, San Jose, CA – AMIQ EDA, a pioneer in integrated development environments (IDEs) for hardware design and verification, today announced the release of version 3.5 of the Design and Verification Tools (DVT) IDE. This version brings enhanced compilation, improved UVM support, a streamlined GUI, and capabilities that simplify DVT deployment.

The DVT IDE is a complete and powerful code development environment for the design and verification languages e, SystemVerilog, Verilog, VHDL. It is built on the Eclipse Platform and includes an IEEE standard-compliant parser, which continuously runs in the background. The tool integrates within a single window a … Read More → "AMIQ EDA Releases Version 3.5 of the Design and Verification Tools (DVT) IDE"

AMIQ EDA Releases Version 3.5 of the Design and Verification Tools (DVT) IDE

March 3, 2014, San Jose, CA – AMIQ EDA, a pioneer in integrated development environments (IDEs) for hardware design and verification, today announced the release of version 3.5 of the Design and Verification Tools (DVT) IDE. This version brings enhanced compilation, improved UVM support, a streamlined GUI, and capabilities that simplify DVT deployment.

The DVT IDE is a complete and powerful code development environment for the design and verification languages e, SystemVerilog, Verilog, VHDL. It is built on the Eclipse Platform and includes … Read More → "AMIQ EDA Releases Version 3.5 of the Design and Verification Tools (DVT) IDE"

Sonics Augments SpyGlass® IP Kit Verification Flow with SpyGlass Constraints

SAN JOSE, Calif. – March 3, 2014 – Atrenta Inc., the leading provider of SoC Realization solutions for the semiconductor and consumer electronics industries, along with Sonics, Inc., the world’s foremost supplier of on-chip network technologies and services, today announced that Sonics has adopted Atrenta’s SpyGlass Constraints tools to enhance its semiconductor intellectual property (IP) signoff flow. This addition will ensure that Sonics continues to provide the highest quality IP including fully verified timing exceptions, false … Read More → "Sonics Augments SpyGlass® IP Kit Verification Flow with SpyGlass Constraints"

CMOSIS Demonstrates High Speed / High Resolution CMOS Image Sensor CMV8000

Antwerp, Belgium / Shanghai, China, 3. March. 2014 – CMOSIS, the leading European supplier of advanced CMOS image sensors, announces the CMV8000, its latest high-speed 8 MP/105 fps image sensor at the occasion of VisionChina Shanghai 2014. The new CMV8000 strengthens CMOSIS’s leading product portfolio of global-shutter CMOS image sensors addressing the demanding markets of machine vision, traffic ITS, microscopy, security and surveillance, and medical applications. At VisionChina 2014 CMOSIS exhibits in Booth 1222-2, Hall E1 at the Shanghai New International Centre.

The CMV8000 is a 4/3” / 8-MP sensor with 3360 x 2496 5.5-µm sized active pixels using the patented 8T pixel … Read More → "CMOSIS Demonstrates High Speed / High Resolution CMOS Image Sensor CMV8000"

Mentor Graphics Cuts Linux Debugging Time by Two Thirds with Undo Software

Cambridge, UK, 3 March 2014, Undo Software today announced that Mentor Graphics Corporation, a world leader in electronic hardware and software design solutions, has purchased and is using its UndoDB reversible debugging tool to increase productivity and develop Linux code faster. By using UndoDB, Mentor Graphics has reduced the time spent debugging code by two thirds, vital in the competitive electronic design marketplace. 

UndoDB allows developers to record their program’s execution and then rewind their code in real-time to find bugs more quickly, saving time and reducing cost. Mentor Graphics initially adopted UndoDB 10 months ago in the Analog/ … Read More → "Mentor Graphics Cuts Linux Debugging Time by Two Thirds with Undo Software"

Semtech Announces Ultra-High Speed ADC and DAC for Advanced Communication Systems

CAMARILLO, Calif., March 3, 2014 — Semtech Corporation (Nasdaq: SMTC), a leading supplier of analog and mixed-signal semiconductors, today announced that 64GSPS ADC and DAC preliminary cores are available utilizing IBM’s 32nm SOI technology for integration in high performance System on Chip (SoC) solutions. 

Targeting the requirements of Advanced Communications Systems including the optical communications, radar and electronic warfare markets, these ultra-high speed data converters enable agile operation and concurrent multi-band / multi-beam operation as well as extremely high dynamic performance ideally suited for highly oversampled systems utilizing large instantaneous bandwidth at low power and small areas.  The 32nm data … Read More → "Semtech Announces Ultra-High Speed ADC and DAC for Advanced Communication Systems"

Element Six Collaboration with the University of Warwick Introduce an All-Diamond Packaging Solution for High Performance Electroanalytical Sensing Applications

CHICAGO – Mar.3, 2014 – AT PITTCON 2014—Element Six, the world leader in synthetic diamond supermaterials and member of the De Beers Group of Companies, today announced the development of an all-diamond packaging solution for electroanalytical sensing applications, in collaboration with the University of Warwick. The solution will transform next generation electroanalytical sensing systems to benefit the biomedical, environmental, food, industrial process monitoring, pharmaceuticals and oil and gas industries. 

The all-diamond packaging solution is comprised of Element Six’s Diafilm EA grade, a free-standing,  boron doped synthetic diamond electrode (introduced … Read More → "Element Six Collaboration with the University of Warwick Introduce an All-Diamond Packaging Solution for High Performance Electroanalytical Sensing Applications"

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