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Changing the World with Wireless Technology

Cambridge, UK, 28th April 2014 – While mobile communications has already had a major impact on the way we communicate, conduct business and organise our lives, we have reached a point where wireless technology can help to address some of the major global economic, environmental and societal challenges. This is the view of Stuart Orr, managing director of Accenture’s Communications Industry practice in the UK and Ireland, who will be presenting his vision of ‘Changing the World with Wireless Technology’, at the 6th CW Future of Wireless International Conference on 30th June – 31 July.

Accenture’s Orr will … Read More → "Changing the World with Wireless Technology"

Microchip Expands Portfolio of Digitally Enhanced Power Analog Controllers With Integrated MCU

CHANDLER, Ariz., May 8, 2013 [NASDAQ:  MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced an expansion  of its 8-bit PIC16F178X enhanced Mid-Range core microcontroller (MCU) family with increased Flash memory densities, intelligent analog and digital peripherals, such as on-chip 12-bit Analog-to-Digital Converters (ADCs), 16-bit PWMs, 8-bit and 5-bit Digital-to-Analog Converters (DACs), operational amplifiers, and high-speed comparators with 50 ns response time, along with EUSART (including LIN), I2C™ and SPI interface peripherals.  The PIC16F178X are the first PIC® MCUs to … Read More → "Microchip Expands Portfolio of Digitally Enhanced Power Analog Controllers With Integrated MCU"

Semi-Pac Releases PurePac™ Accelerated Life Testing Assembly Capability

Sunnyvale, CA – April 28, 2014 – Semi-Pac today announced that they have developed a high reliability assembly capability for semiconductor process and device qualification. This assembly technique was developed to not introduce additional failure mechanisms into the device under test and can withstand the rigors of 350°C life testing.

Semi-Pac has earned the reputation of developing creative solutions for difficult semiconductor packaging and assembly challenges. A number of years ago, one of the major semiconductor foundries approached Semi-Pac to help them come up with a solution for assembly induced qualification failures that were severely impacting the qualification testing results.

< … Read More → "Semi-Pac Releases PurePac™ Accelerated Life Testing Assembly Capability"

VadaTech’s New MCH Transforms Capabilities of MicroTCA-based Systems

Henderson, NV – April 28, 2014 – VadaTech, a manufacturer of embedded boards and complete application-ready platforms, now offers a MicroTCA Carrier Hub (MCH) with a 40GbE option, synchronous Ethernet, and advanced clocking/GPS capability.

The new MCH is VadaTech’s 3rd generation module with several unique features that will transform the capability of a MicroTCA-based solution.  The UTC004’s 40GbE option is a 4x boost in performance from today’s 10GbE solutions.  The MCH also provides PCIe Gen 3, SRIO Gen 2, and a crossbar switch (CBS) option.  The CBS allows any fabric to be utilized including custom solutions.

< … Read More → "VadaTech’s New MCH Transforms Capabilities of MicroTCA-based Systems"

Centaur Technology Deploys Synopsys’ Formality Ultra to Shorten Design Schedules by Weeks

MOUNTAIN VIEW, Calif., April 28, 2014 /PRNewswire/ —

Highlights:

  • Formality Ultra accelerates functional ECO cycles leading to weeks of schedule savings
  • Centaur Technology deploys Formality Ultra on its x86 compatible microprocessor designs

Synopsys, Inc. (Nasdaq: SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced that Centaur Technology, a subsidiary of VIA Technology, has deployed Synopsys’ Formality® Ultra tool for implementation and verification of engineering change … Read More → "Centaur Technology Deploys Synopsys’ Formality Ultra to Shorten Design Schedules by Weeks"

16-Bit, 210Msps ADC Delivers 80dB SNR for High Performance Communications & Instrumentation Systems

MILPITAS, CA – April 28, 2014 – Linear Technology Corporation announces the LTC2107, a 16-bit 210Msps high performance high-speed analog-to-digital converter (ADC) for high-end communications receivers and instrumentation applications. The LTC2107 has superior AC performance specifications, achieving 80dB … Read More → "16-Bit, 210Msps ADC Delivers 80dB SNR for High Performance Communications & Instrumentation Systems"

Xilinx Demonstrates FPGA-Based Acceleration Technology for Next-Generation Data Centers at IBM Impact 2014

SAN JOSE, Calif.April 25, 2014 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) today announced it will demonstrate the industry’s first key value store acceleration demo based on the IBM CAPI protocol at the IBM Impact 2014 Conference.  As a member of the IBM OpenPOWER Foundation, Xilinx is delivering FPGA-based acceleration technologies for use in next-generation data centers and is among the growing open development community dedicated to accelerating innovation using IBM’s POWER microprocessor. 

Through close collaboration with IBM and the OpenPOWER Foundation, … Read More → "Xilinx Demonstrates FPGA-Based Acceleration Technology for Next-Generation Data Centers at IBM Impact 2014"

Embedded Vision Alliance Announces Program for Embedded Vision Summit West

WALNUT CREEK, Calif., April 24, 2014 /PRNewswire/ — The Embedded Vision Alliance (www.Embedded-Vision.com) today announced the full program for the Embedded Vision Summit West 2014, an event for system, software, and chip design engineers. The Embedded Vision Summit West 2014 will be held Thursday, May 29, 2014, at the Santa Clara (California) Convention Center. The Summit is a full day of “how-to” presentations and demonstrations of technology and products in one of the hottest areas of technological innovation today: practical computer vision, which enables “machines … Read More → "Embedded Vision Alliance Announces Program for Embedded Vision Summit West"

ILS Technology, a Telit Company, and Jasper Collaborate to help Mobile Operators Deliver Innovative IoT Applications

London, UK, April 24, 2014 – ILS Technology, a Telit company, and Jasper today announced their expanded collaboration to help mobile operators deploy successful IoT initiatives on the Cloud-based Jasper Platform and the deviceWISE Application Enablement Platform (AEP) from ILS Technology. 

“IoT is transforming industries, enabling companies to build stronger relationships with their customers, deliver rich service models, and generate new and sustainable sources of revenue. Having the right software and systems to capitalize on these opportunities is critical,” said Ken Laversin, Global VP Sales, Jasper. “Today more than 1,000 companies manage millions of connected products and devices on the Jasper … Read More → "ILS Technology, a Telit Company, and Jasper Collaborate to help Mobile Operators Deliver Innovative IoT Applications"

IAR Systems adds stack usage analysis to its popular development tools for Renesas RX

Uppsala, Sweden—April 25, 2014—IAR Systems® is today proud to announce a new version of its development toolchain IAR Embedded Workbench® for RX. Version 2.60 contains stack usage analysis functionality and several other new features that make the world-leading toolchain for Renesas RX microcontrollers even more powerful.

“The stack is a fundamental property of an embedded system and incorrectly used it may damage your system and cause it to perform in the strangest ways,” says Micael Borgefeldt, Product Manager at IAR Systems. “With stack usage analysis … Read More → "IAR Systems adds stack usage analysis to its popular development tools for Renesas RX"

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