News – Page 1380 – EEJournal

GUC/Partner Jointly Develop USB3.1 PHY/Controller IP

February 26, 2016

Hsinchu, Taiwan, February 26, 2016 – Global Unichip Corp. (GUC), the Flexible ASIC LeaderTM and leading analog mixed-signal IP provider, worked jointly with a major Japanese IDM partner to develop USB3.1 PHY/Controller IP by using GUC’s PHY and partner’s Controller.

The combined USB 3.1 IP is compliant with both USB 3.1 and USB 2.0/1.1 specifications. The IP supports all USB bus speeds: Super Speed Plus (10 Gbps), Super Speed (5 Gbps), High Speed (480 Mbps), Full Speed (12Mbps), and Low Speed (1.5Mbps). It is compliant with Battery Charging Specification </ … Read More → "GUC/Partner Jointly Develop USB3.1 PHY/Controller IP"

eBeam Initiative to Expand Education Efforts on eBeam Technology Requirements for EUV and Nanoimprint Lithography

February 26, 2016

SAN JOSE, Calif., February 23, 2016–The eBeam Initiative, a forum dedicated to the education and promotion of new semiconductor manufacturing approaches based on electron beam (eBeam) technologies, today announced that it will expand its education efforts in 2016 to increase the industry’s focus on eBeam technology requirements and new developments to support extreme ultraviolet (EUV) lithography, nanoimprint lithography (NIL) and multi-beam mask writing. Each of these topics will be addressed by industry luminary guest speakers at the annual eBeam Initiative members and press luncheon event being held today during the SPIE Advanced Lithography Conference at the San Jose Convention Center.</ … Read More → "eBeam Initiative to Expand Education Efforts on eBeam Technology Requirements for EUV and Nanoimprint Lithography"

Imec reveals impact of DSA process variations on electrical performance of DSA-formed vias.

February 26, 2016

Leuven (Belgium) Feb 24, 2016 – Today, at SPIE Advanced Lithography Conference (San Jose, Feb 21-25), world-leading nanoelectronics research center imec will present electrical results of DSA (directed self-assembly)-formed vias, gaining insight in the impact of DSA processing variations on electrical readout. The results accelerate learning towards implementation of DSA for via patterning at the N7 technology node and beyond.

DSA processes with cylinder-forming block copolymers (BCP) have gained attention for contact hole shrink applications with improved contact hole roughness, and for their potential to increase the contact hole density that is obtained with optical lithography. … Read More → "Imec reveals impact of DSA process variations on electrical performance of DSA-formed vias."

Silicon Labs Significantly Reduces Design Time Using the Cadence Mixed-Signal Low-Power Flow

February 26, 2016

SAN JOSE, Calif., February 24, 2016 – Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that Silicon Labs http://www.silabs.com used a Cadence® mixed-signal low-power flow to reduce overall design time, significantly speeding time to market. Silicon Labs adopted the flow for its new Blue Gecko family of wireless system-on-chip (SoC) devices http://www.silabs.com/BlueGecko that provide ultra-low-power Bluetooth Smart connectivity for Internet of Things (IoT) applications.

For design, Silicon Labs used the comprehensive Cadence mixed-signal, low-power flow based on the unified OpenAccess (OA)-enabled Incremental Technology Database (ITDB) to seamlessly interoperate between the Cadence Virtuoso® … Read More → "Silicon Labs Significantly Reduces Design Time Using the Cadence Mixed-Signal Low-Power Flow"

New Automotive Microcontrollers from STMicroelectronics Enhance Safety of Smarter Vehicles

February 25, 2016

Geneva, February 23, 2016 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has introduced first microprocessors in the SPC57 family that break new ground in automotive applications by offering the industry’s best combination of safety assurance and cost/performance. Building on the successful 32-bit Power Architecture^™ SPC5 microprocessor platform, the new product family targets cost-sensitive automotive systems that must meet the most stringent safety requirements, up to the highest ISO26262 ASIL-D Automotive Safety Integrity Level.

The new microcontrollers … Read More → "New Automotive Microcontrollers from STMicroelectronics Enhance Safety of Smarter Vehicles"

New Next Generation 6U VME i7 Processor Board

February 25, 2016

WIXOM, Mich., Feb. 24, 2016 /PRNewswire/ — Acromag’s XVME-6510 is a high-performance 6U VME single board computer based on the 4^th Generation Intel® Core™ i7 processor and utilizes the Intel 8-Series QM87 PCH chipset for extensive I/O support. Two ruggedized SODIMMs offer up to 16GB of high-speed DDR3L removable memory plus 32GB of flash memory. The air-cooled … Read More → "New Next Generation 6U VME i7 Processor Board"

gridComm, Virtual Extension Partner to Provide Advanced Hybrid PLC-Wireless Networks for IoT/M2M Applications

February 25, 2016

TEL AVIV, ISRAEL and SINGAPORE–(Marketwired – Feb 24, 2016) – gridComm, a provider of the world’s most reliable and robust narrow-band power line communications (PLC) solutions that enable the transformation of traditional power grid into a smart grid, and Virtual Extension, a leader in high-performance wireless mesh networks for IoT/M2M and DALI (Digital … Read More → "gridComm, Virtual Extension Partner to Provide Advanced Hybrid PLC-Wireless Networks for IoT/M2M Applications"

Spectrum’s 32 Channel Digital Data Acquisition card acquires at up to 720 MBit/s rates

February 25, 2016

Grosshansdorf, Germany — February 25 2016 — The Spectrum M4i.77xx series of Digital Data Acquisition cards represent a major performance breakthrough for test engineers who require high-speed digital data logging with multi-channel logic analysis over extended time periods. Based on Spectrum’s proven M4i series PCI Express (PCIe) platform the cards are small and compact. Each card comes equipped with 32 fully synchronous channels, large 4 GB on-board memory and a PCI Express x8 Gen 2 interface that offers outstanding data streaming performance. If more channels are needed, up to eight cards can … Read More → "Spectrum’s 32 Channel Digital Data Acquisition card acquires at up to 720 MBit/s rates"

GrammaTech Announces Binary Analysis Support for ARM

February 25, 2016

Ithaca/USA, Nuremberg, Germany — February 23, 2016 – GrammaTech, a leading provider of software assurance, hardening, and cyber-security solutions, today announced expansion of CodeSonar’s static analysis engine to include binary analysis for ARM, the dominant processor of the Internet of Things (IoT). CodeSonar is the only commercially-available static analysis tool on the market to provide binary analysis, allowing engineering teams to analyze application software, middleware, and firmware.

Analyzing machine code has become extremely important in the expanding world of IoT, where deployed devices are subjected to countless … Read More → "GrammaTech Announces Binary Analysis Support for ARM"

Synopsys to Showcase Software Integrity Platform for ‘Software Signoff’ at RSA Conference

February 25, 2016

MOUNTAIN VIEW, Calif., Feb. 25, 2016 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS) today announced it will showcase its Software Integrity Platform, a comprehensive suite of software security testing solutions for software signoff, at the RSA Conference in San Francisco (February 29-March 4). Through a combination of best-in-class automated testing and analysis tools, Synopsys’ Software Integrity Platform enables organizations to reduce risk, cost, and time to market by rapidly detecting and … Read More → "Synopsys to Showcase Software Integrity Platform for ‘Software Signoff’ at RSA Conference"