News – Page 1371 – EEJournal

Cadence Design IP to Support TSMC 16FFC and 28HPC+ Process Technologies

March 16, 2016

SAN JOSE, Calif., 15 Mar 2016 — Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that it is updating its leading-edge, high-speed SerDes communication interfaces and low-latency Denali® DDR memory IP solutions to support TSMC’s 16nm FinFET Compact (16FFC) and 28nm HPC Plus (28HPC+) process technologies. These key design IP solutions for TSMC’s 16FFC and 28HPC+ processes can help reduce time to market for customers designing advanced Systems-on-Chip (SoCs).

Cadence provides design IP for a wide array of industry standards such as DDR, PCIe, MIPI, Ethernet, USB, DisplayPort, and 802.11. Delivery of IP for 28HPC+ process technology will begin … Read More → "Cadence Design IP to Support TSMC 16FFC and 28HPC+ Process Technologies"

Xilinx Debuts Multiple Industry-First Solutions for Ultra-High Bandwidth Optical Networks at OFC 2016

March 16, 2016

SAN JOSE, Calif., March 16, 2016 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) will introduce multiple industry-first solutions for ultra-high bandwidth optical networks at OFC 2016. Targeting OTN and Datacenter Interconnect (DCI) applications, these never publicly demoed solutions enable systems OEMs to deliver fast-to-market, efficient and scalable transport of big data across data centers and optical transport networks. With data center traffic ever increasing, data center and optical network operators are constantly looking for efficient use of bandwidth and bandwidth scalability. Working closely with fellow … Read More → "Xilinx Debuts Multiple Industry-First Solutions for Ultra-High Bandwidth Optical Networks at OFC 2016"

Microsemi Announces New Secured FPGA Production Programming Solution to Prevent Overbuilding, Cloning, Reverse Engineering, Malware Insertion and Other Security Threats

March 16, 2016

ALISO VIEJO, Calif., March 15, 2016 — Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of its Secured Production Programming Solution (SPPS) for its field programmable gate arrays (FPGAs). The new solution securely generates and injects cryptographic keys and configuration bitstreams into Microsemi’s FPGAs thus preventing cloning, reverse engineering, malware insertion, leakage of sensitive intellectual property (IP) such as trade secrets or classified data, overbuilding and other Read More → "Microsemi Announces New Secured FPGA Production Programming Solution to Prevent Overbuilding, Cloning, Reverse Engineering, Malware Insertion and Other Security Threats"

Mentor Graphics Announces a Secure Plug-and-Play IoT Device and Data Acquisition Solution for Electronics Manufacturing

March 16, 2016

Wilsonville, OR, Mar. 16, 2016 — Mentor Graphics Corporation (NASDAQ: MENT) today announced the Valor® internet of things (IoT) Manufacturing solution, a robust hardware device with embedded software for live data collection from all shop-floor machines and processes, leveraging the new Open Manufacturing Language (OML) communication standard. The Valor IoT Manufacturing product enables seamless implementation of advanced practices such as Industry 4.0 and Smart Factory, with plug-and-play deployment and minimal change to the manufacturing environment and work processes.

The Valor IoT Manufacturing product utilizes built-in interfaces to acquire and normalize data … Read More → "Mentor Graphics Announces a Secure Plug-and-Play IoT Device and Data Acquisition Solution for Electronics Manufacturing"

Highly Integrated Multiprotocol Transceiver Reduces Component Count in RS485/RS232 Systems

March 16, 2016

MILPITAS, CA – March 16, 2016 – Linear Technology Corporation introduces the LTC2873, an RS485/RS232 multiprotocol transceiver in a small 20mm² package. The LTC2873 integrates all the functions necessary to provide the most compact multiprotocol IC available today. Supporting ±26kV HBM ESD bus protection, the LTC2873 provides a robust software-selectable interface for 3V to 5.5V systems. A simple logic interface, supporting voltages as low … Read More → "Highly Integrated Multiprotocol Transceiver Reduces Component Count in RS485/RS232 Systems"

New MEMS Design Contest Encourages Advances in MEMS Technology

March 16, 2016

Dresden, Germany – March 16, 2016 – Jointly sponsored by Cadence Design Systems, Coventor, X-FAB and Reutlingen University, a new MEMS Design Contest is being launched at DATE 2016. The objective of this contest is to encourage greater ingenuity with regard to the integration of MEMS devices and mixed-signal CMOS blocks. To kick off the contest, an informative session will be held in the Exhibition Theatre on Thursday, March 17, 2016 from 14:00 to 17:30 and is open to all DATE attendees free of charge.

The contest seeks companies, entrepreneurs, researchers and students from around the globe. Design teams are encouraged to propose imaginative design concepts … Read More → "New MEMS Design Contest Encourages Advances in MEMS Technology"

Cadence Design Tools Certified for TSMC 7nm Design Starts and 10nm Production

March 15, 2016

SAN JOSE, Calif., , 15 Mar 2016

Highlights:

Cadence tools and PDK enabled based on the latest 7nm DRM and SPICE for early customers
Cadence and TSMC collaborate on delivering new capabilities for 10nm digital, custom, and mixed-signal reference flows
Cadence tools validated by TSMC on high-performance reference designs in order to enable customers to reduce iterations and improve predictability

Cadence Design Systems, Inc. (NASDAQ: CDNS) … Read More → "Cadence Design Tools Certified for TSMC 7nm Design Starts and 10nm Production"

Dialog Semiconductor Releases the Lowest Power 12 Degrees-of-Freedom Bluetooth® Smart Sensor Development Platform

March 15, 2016

London, United Kingdom – March 15, 2016 – Dialog Semiconductor plc (FWB:DLG), a provider of highly integrated power management, AC/DC power conversion, solid state lighting (SSL) and Bluetooth® Smart technology, today announced the world’s lowest power and smallest 12 Degrees-of-Freedom (DOF) wireless smart sensor development kit for IoT applications. Dialog’s DA14583 SmartBond™ Bluetooth Smart SoC is combined with Bosch Sensortec’s gyroscope, accelerometer, magnetometer, and environmental sensors on a tiny 16mm x 15mm printed circuit board. The board is supplied as a dongle in a plastic housing. … Read More → "Dialog Semiconductor Releases the Lowest Power 12 Degrees-of-Freedom Bluetooth® Smart Sensor Development Platform"

GLOBALFOUNDRIES Broadens SiGe Power Amplifier Portfolio, Enhancing RF Performance and Efficiency for Wireless Devices

March 15, 2016

Santa Clara, Calif., March 15, 2016 – GLOBALFOUNDRIES today announced new advanced radio-frequency (RF) silicon solutions, further expanding the portfolio of Silicon Germanium (SiGe) power amplifier (PA) technologies designed to enable performance-optimized cellular and Wi-Fi solutions in increasingly sophisticated mobile devices and hardware.

GLOBALFOUNDRIES’ 5PAx and 1K5PAx, together called PAx, are the latest extensions to its broad family of SiGe-based PA technologies. The advanced offerings deliver optimized PA, LNA and switch technology with improved power efficiency, noise figure and insertion loss enabling more power efficient next-generation Wi-Fi and cellular solutions for faster data access and uninterrupted connections.

Cadence Announces Availability of Complete IC Packaging Design and Analysis Solutions for Advanced Fan-Out Wafer-Level Chip Scale Packaging

March 15, 2016

Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced its DDR4 and LPDDR4 IP products for TSMC’s 16nm FinFET Plus (16FF+) process have completed TSMC9000 Silicon Assessment. The Cadence® Denali® DDR controller IP, and both the Denali DDR4 and LPDDR4 PHY IP, have demonstrated operating speeds of up to 3200 Mbps, and each are in production with several customers. Memory interface performance is crucial for alleviating the key system bottleneck of memory access, which can overshadow increases in processor performance. The high performance of Cadence’s Denali DDR interface … Read More → "Cadence Announces Availability of Complete IC Packaging Design and Analysis Solutions for Advanced Fan-Out Wafer-Level Chip Scale Packaging"

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