News – Page 1366 – EEJournal

STMicroelectronics Reveals Advanced Silicon-Carbide Power Devices to Accelerate Automotive Electrification

May 16, 2016

Complete set of devices allows full conversion of auto power modules to silicon carbide (SiC) for greater vehicle range, convenience, and reliability
Advanced 6-inch wafer capability and process to bring superior SiC offer to carmakers and automotive suppliers
AEC-Q101 qualification program to complete in early 2017, ready for new OEM product launches

Geneva, May 16, 2016 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronic applications, has announced advanced high-efficiency power semiconductors for Hybrid and Electric Vehicles (EVs) with a timetable for qualification to the automotive quality standard AEC-Q101.</ … Read More → "STMicroelectronics Reveals Advanced Silicon-Carbide Power Devices to Accelerate Automotive Electrification"

Micronas Deploys ClioSoft SOS Design Collaboration Platform

May 16, 2016

REMONT, Calif., May 17, 2016 – Micronas, a TDK group company and the most preferred partner for sensing and control, has deployed ClioSoft’s SOS7 Design Management Platform. ClioSoft is the pioneer and leading developer of system-on-chip (SoC) design configuration and enterprise intellectual property (IP) management solutions for the semiconductor industry. ClioSoft’s SOS platform is integrated with major EDA flows from Cadence Design Systems, Keysight Technologies, Mentor Graphics and Synopsys.

The deployment of ClioSoft SOS for Synopsys Custom Compiler™ at Micronas’ operational headquarters in Freiburg, Germany, will improve design collaboration and data management among design teams as well as … Read More → "Micronas Deploys ClioSoft SOS Design Collaboration Platform"

Uurmi Fog Removal Software Now Available on Cadence Tensilica Vision DSPs

May 16, 2016

SAN JOSE, Calif., May 16, 2016–Cadence Design Systems, Inc. (NASDAQ: CDNS) and Uurmi Systems today announced that Uurmi’s fog removal software targeted for automotive and camera markets is now available on the Cadence® Tensilica® Vision digital signal processor (DSP). By porting their fog removal software to the Tensilica Vision DSP, Uurmi achieved up to 5X higher performance, with 15X less power consumption.

Uurmi’s fog removal software eliminates fog present in the photo and applies correction to improve the image. It uses … Read More → "Uurmi Fog Removal Software Now Available on Cadence Tensilica Vision DSPs"

Encapsulated DC-DC converters offer chassisor DIN rail mounting

May 13, 2016

XP Power today announced the DTE series of fully encapsulated single output DC-DC converters. The series comprises three ultra-wide input voltage range models offering 20 (DTE20), 40 (DTE40) and 60 Watts (DTE60) output power. The units are available in either a chassis mount or a DIN rail format, offering flexibility to the designer of the end-product. The fully encapsulated package also helps protect the converter from environmental factors often found in industrial applications in addition to aiding heat dissipation.

These highly efficient converters, with model-dependent typical efficiency in the range 89 – 92%, run cooler and consume less power compared … Read More → "Encapsulated DC-DC converters offer chassisor DIN rail mounting"

IAR Systems Presents How to Get Smaller, Faster and Smarter Code at IoT DevCon in Santa Clara, California

May 12, 2016

Foster City, CA, United States/Uppsala, Sweden—May 9, 2016—IAR Systems® announces that the company will be exhibiting at the Internet of Things Developers Conference (IoT DevCon) 2016, in Santa Clara, California, on May 25-26. During the event, IAR Systems will guide visitors on how the … Read More → "IAR Systems Presents How to Get Smaller, Faster and Smarter Code at IoT DevCon in Santa Clara, California"

Barco Silex launches flexible eSecure IP module as cornerstone for fully-secured IoT applications

May 12, 2016

Louvain?la?Neuve, Belgium ?? May 10, 2016 ?? Barco Silex, the leading provider of IP cores for security, launches a new IP module to turn ASIC and SoC designs into fully-secured IoT (Internet of Things) applications. The eSecure module functions as a root-of-trust, guaranteeing the authenticity and integrity of the application’s hardware, software, data, and communication. It offloads all security operations to hardware and scales according to the needs of the application. Its cryptographic engine supports all latest algorithms for TLS/DTLS 1.3, Thread Networking, Apple HomeKit, Bluetooth, ZigBee and more.

The heart of the eSecure module is a secure … Read More → "Barco Silex launches flexible eSecure IP module as cornerstone for fully-secured IoT applications"

Keysight Technologies Introduces Comprehensive Transmitter Testing Software for USB 3.1 Type-CTM Designs

May 12, 2016

Highlights:

Comprehensive and accurate transmitter testing
Addition of the Gen2 SSC, SCDx/LBPM and preshoot/de-emphasis tests
Support for Type-C Gen1 and Gen2 compliance testing

SANTA ROSA, Calif., May 10, 2016 – Keysight Technologies, Inc. (NYSE: KEYS) today introduced the Read More → "Keysight Technologies Introduces Comprehensive Transmitter Testing Software for USB 3.1 Type-CTM Designs"

Avnet Introduces Industrial IoT Starter Kit to Streamline Smart Device and Cloud Development

May 12, 2016

SANTA CLARA, Calif.—May 10, 2016—Internet of Things World – Read More → "Avnet Introduces Industrial IoT Starter Kit to Streamline Smart Device and Cloud Development"

Anritsu Adds Tools to VNA Families that Improve Signal Integrity Testing Capability for Verification of High-speed Designs

May 12, 2016

Morgan Hill, CA – May 2016 – Anritsu Company continues to address the test needs of signal integrity (SI) engineers with the introduction of options for its VectorStar® and ShockLine™ vector network analyzers (VNAs). The VectorStar Eye Diagram and ShockLine Advanced Time Domain (ATD) options are part of the expanding SI capabilities offered by Anritsu and provide SI engineers with improved tools to conduct channel diagnostics and model validation of high-speed digital circuit designs.

“As data rates continue to increase, signal channel characterization becomes increasingly challenging. The result is that VNAs are becoming more of a staple in signal integrity … Read More → "Anritsu Adds Tools to VNA Families that Improve Signal Integrity Testing Capability for Verification of High-speed Designs"

Innovative air cavity packaging brings significant cost reductions and performance improvements to RF transistors used in wireless infrastructure

May 12, 2016

Nijmegen, The Netherlands – May 12th, Ampleon today announced the availability of a new package platform that will be rolled out across the entire LDMOS and GaN product portfolio. Over a dozen variants of the SOT502 and SOT539 platforms are in development. The ACP3, a copper flanged air cavity package will initially be available for GEN9 and GEN10 high power RF transistors. The first products to use the ACP3 package are the BLC9G20XS-400AVT, BLC9G20XS-550AVT and the BLC9G22XS-400AVT devices, which are now in production. Several more products covering different power levels … Read More → "Innovative air cavity packaging brings significant cost reductions and performance improvements to RF transistors used in wireless infrastructure"