News – Page 1364 – EEJournal

The CEA Announces Expanded Collaboration with Intel to Advance Cutting-edge Research and Innovation in Key Digital Areas

May 18, 2016

The CEA (Atomic Energy Commission) and Intel are boosting their collaboration through a new R & D agreement signed in Paris on Thursday 12 May. This collaboration, extended to several key areas in digital technology, will enable the two sides to develop a shared R&D programme and jointly submit research and innovation projects on a European scale, particularly as regards High Performance Computing (HPC), as part of the Horizon 2020 programme.

The new CEA-Intel agreement involves several strategic research programmes with the teams of the CEA’s Leti Institute in Grenoble, including the Internet of Things, high-speed … Read More → "The CEA Announces Expanded Collaboration with Intel to Advance Cutting-edge Research and Innovation in Key Digital Areas"

FotoNation® Partners With Kyocera to Develop Intelligent Automotive Camera Technology

May 18, 2016

SAN JOSE, Calif., – May 17, 2016 – FotoNation Limited, a wholly owned subsidiary of Tessera Technologies, Inc. (NASDAQ: TSRA) and the leading provider of computational imaging and computer vision solutions for consumer and enterprise applications, has partnered with Kyocera Corporation (NYSE: KYO) (TOKYO: 6971) to develop advanced, intelligent, vision solutions for automotive applications. As part of the partnership and using FotoNation technology as a foundation, the two companies will jointly develop advanced computer vision solutions for the automotive market.

More stringent safety regulations and the promise of semi and fully autonomous vehicles are creating tremendous technology demands from automakers and automotive … Read More → "FotoNation® Partners With Kyocera to Develop Intelligent Automotive Camera Technology"

Triple-Channel Universal PMIC Supports Low Power FPGA and SoC Processors

May 18, 2016

Exar’s first Universal PMIC with three integrated synchronous MOSFET power stages
Board-space efficient solution supports broad range of FPGAs and SoC processors
Configurable through I2C using PowerArchitectTM 4 design and configuration software

Fremont, CA – May 18, 2016 – Exar Corporation (NYSE: EXAR), a leading supplier of analog mixed-signal products serving the industrial, high-end consumer and infrastructure markets, today announced the introduction of the XR77103 Read More → "Triple-Channel Universal PMIC Supports Low Power FPGA and SoC Processors"

Gap Wireless Distributing iBwave Wi-Fi® Suite for In-building Network Design

May 18, 2016

MISSISSAUGA, ON, May 18, 2016 /CNW/ – Gap Wireless, a leading stocking distributor of mobile wireless solutions, today announced the company has added the iBwave Wi-Fi® Suite to its extensive product portfolio. The iBwave Wi-Fi® Suite provides bundled cloud-connected products to streamline the in-building Wi-Fi network planning and design process.

“iBwave’s next-generation product … Read More → "Gap Wireless Distributing iBwave Wi-Fi® Suite for In-building Network Design"

Aldec Extends Spectrum of Verification Tools for Use in Digital ASIC Designs

May 17, 2016

Henderson, NV – May 17^th, 2016 – Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification solutions for digital system designs, today announces that its verification tools suite, honed over 30 years of complex FPGA design verification, is available for ASIC chip design.

Covering the full digital verification flow from design and test planning through simulation, emulation, and prototyping, Aldec’s popular verification tools help designers in small and large fabless companies ensure that complex digital ASIC designs meet all functional and timing requirements before being committed to a … Read More → "Aldec Extends Spectrum of Verification Tools for Use in Digital ASIC Designs"

Curtiss-Wright Demonstrates Power® Architecture-based Glass Cockpit Display Solution and Advanced Air-Flow Through (AFT) Cooling for 3U Systems

May 17, 2016

NXP FTF 2016 Technology Forum (Pedestals 551 and 554), AUSTIN, Texas – May 16, 2016 – Curtiss-Wright Defense Solutions today announced that it will feature two NXP® Power® Architecture-based COTS technology demonstrations during the NXP FTF 2016 Technology Forum. CoreAVI’s Glass Cockpit Demo will feature Curtiss-Wright’s Read More → "Curtiss-Wright Demonstrates Power® Architecture-based Glass Cockpit Display Solution and Advanced Air-Flow Through (AFT) Cooling for 3U Systems"

Fairchild Launches New Discrete and Bare Die IGBTs for Hybrid and All-Electric Vehicles

May 17, 2016

SUNNYVALE, Calif. – May 17, 2016 — Fairchild (NASDAQ: FCS), a leading global supplier of high-performance semiconductor solutions, is today expanding its growing portfolio of automotive-grade semiconductor solutions for hybrid electric vehicles (HEV), plug-in hybrid electric vehicles (PHEV) and electric vehicles (EV) with its new discrete and bare die IGBTs and diodes. These IGBTs and diodes are ideal for traction inverters, a core component of all HEVs, PHEVs and EVs that convert the batteries’ electricity from direct current into the three-phase alternating current required by the vehicles’ drive motors.</ … Read More → "Fairchild Launches New Discrete and Bare Die IGBTs for Hybrid and All-Electric Vehicles"

Xentech Solutions Ltd selects Achronix Speedster22i FPGAs for its Axtrinet™ Ethernet Packet Generators

May 17, 2016

Santa Clara, Calif., May 17, 2016 – Achronix Semiconductor Corporation today announced that Xentech Solutions Limited selected Achronix Speedster22i FPGAs for its compact and low-cost Axtrinet™ Ethernet Packet Generators. By using the embedded hard Ethernet and DDR3 controllers in Speedster22i FPGAs, Xentech was able to meet its aggressive cost and power targets.

The Speedster22i devices were the industry’s first FPGAs with embedded hard IP for high-performance wireline applications. The hard IP includes 10/40/100G Ethernet, Interlaken, PCI Express Gen3 x8 and up to DDR3 x72 controllers. Hardening key … Read More → "Xentech Solutions Ltd selects Achronix Speedster22i FPGAs for its Axtrinet™ Ethernet Packet Generators"

Arduino Primo base board features native Bluetooth low energy wireless connectivity and NFC Touch-to-Pair using Nordic Semiconductor nRF52832 SoC

May 17, 2016

Oslo, Norway – May 16, 2016 – Nordic Semiconductor today announces that Arduino – the world’s most successful open-source ecosystem for education, Maker, and Internet of Things (IoT) markets – has specified the Nordic Semiconductor nRF52832 Bluetooth® low energy (previously known as Bluetooth Smart) System-on-Chip (SoC) at the heart of its latest product: a low cost IoT-targeted programmable single board computer (or ‘base board’) called the ‘Arduino Primo’.

The Arduino Primo base board features native Bluetooth low energy wireless connectivity and also includes Near Field Communication (NFC), Wi-Fi and infrared (IR) technologies. Previously users were required to add shields – … Read More → "Arduino Primo base board features native Bluetooth low energy wireless connectivity and NFC Touch-to-Pair using Nordic Semiconductor nRF52832 SoC"

Ampleon GaN RF transistor family complements LDMOS portfolio with high-efficiency and wideband solutions for mobile broadband

May 17, 2016

Nijmegen, The Netherlands – May 17th, 2016 – Ampleon today announced its second generation of 50 Volts 0.5 um GaN on SiC RF power transistors, dedicated for mobile broadband applications. Providing a 5 % improvement in power efficiency compared to LDMOS-based devices, and enabling high-power multiband applications, this GaN family also offers a size reduction in the order of 30 to 50 %, when compared to similar LDMOS transistors. PA designers can now more easily find the perfect fit for each particular set of requirements, be it efficiency, size, power and cost, while getting the full … Read More → "Ampleon GaN RF transistor family complements LDMOS portfolio with high-efficiency and wideband solutions for mobile broadband"

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