News – Page 1355 – EEJournal

ARM Extends Solutions for Custom SoC development in Embedded and IoT Markets

June 6, 2016

Cambridge, UK, June 6, 2016 – ARM has expanded its ARM^® DesignStart™ initiative to offer simplified and expedited access to EDA tooling and design environments from Cadence and Mentor Graphics. The new partnership, announced at DAC 2016, builds on the benefits of free access to ARM Cortex^®-M0 processor IP offered through the DesignStart portal. The new ARM Approved Design Partner program also provides DesignStart users with a global list of audited design houses for … Read More → "ARM Extends Solutions for Custom SoC development in Embedded and IoT Markets"

New Time-of-Flight Ranging Sensor from STMicroelectronics Boosts Range and Speed, in Industry’s Smallest Footprint

June 6, 2016

Geneva, June 6, 2016 – STMicroelectronics has further enhanced its leadership in Time-of-Flight (ToF) ranging sensors with the second generation of its FlightSense™ technology, now available in the new VL53L0X laser-ranging sensor.

Cadence Expands Collaboration with ARM to Accelerate Custom SoC and IoT System Designs with Industry’s First End-to-End Hosted Design Solution

June 6, 2016

SAN JOSE, Calif., June 6, 2016— Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the industry’s first complete hosted end-to-end solution to enable designers to accelerate their custom SoC and Internet of Things (IoT) design process using ARM Cortex®-M processors. This offering accelerates mixed-signal SoC design for IoT, incorporating the ARM IoT Subsystem for Cortex-M processors and Cadence’s interface IP and unified mixed-signal implementation solution, now optimized specifically for Cortex-M cores.

To further lower barriers to innovation, Cadence has also joined … Read More → "Cadence Expands Collaboration with ARM to Accelerate Custom SoC and IoT System Designs with Industry’s First End-to-End Hosted Design Solution"

Two-Channel, Bi-Directional Digital Isolators Reduce Space and System Complexity for Designers

June 3, 2016

San Jose, CA—June 1, 2016—Designers can save space and achieve more flexible designs with the MAX14933 and MAX14937 two-channel, bi-directional digital isolators from Maxim Integrated Products, Inc. (NASDAQ: MXIM). They transfer digital signals between circuits in both directions and provide complete galvanic isolation between two power domains, all while using fewer components to save board space.

Sondrel and UltraSoC partner to deliver ‘shift left’ for SoC projects

June 3, 2016

CAMBRIDGE, United Kingdom, and READING, United Kingdom, 3rd June 2016 — UltraSoC and Sondrel, the leading IC design services consultancy, today announce Sondrel’s … Read More → "Sondrel and UltraSoC partner to deliver ‘shift left’ for SoC projects"

Synopsys to Showcase Complete Silicon to Software Solutions at DAC 2016

June 2, 2016

MOUNTAIN VIEW, Calif., June 2, 2016 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS), will showcase its complete silicon to software solutions at the Design Automation Conference (DAC) 2016 in Austin, Texas, June 5 – 9, 2016. The program will include special events and presentations featuring technology experts from leading semiconductor companies, IP providers and foundries, as well as Synopsys. Topics will spotlight the best practices, tools and methodologies that are being used to design the next generation of electronics and software.

Synopsys DAC Events, Read More → "Synopsys to Showcase Complete Silicon to Software Solutions at DAC 2016"

Green Hills Software to Present and Exhibit at TU-Automotive Detroit 2016 in Novi, MI

June 2, 2016

SANTA BARBARA, CA — June 2, 2016 — Green Hills Software, the largest independent software vendor for the Internet of Things (IoT) and the largest independent vendor of embedded software, will exhibit and deliver technology presentations at TU-Automotive Detroit 2016 in Novi, MI, June 8 – 9, 2016. Green Hills Software will showcase in booth C149 its broad portfolio and forward-thinking technology for the automotive market.

Green Hills will demonstrate its latest innovations for creating and managing safety and security-critical solutions for automotive.

Samsung Foundry Closed-Loop DFM Solution Leverages Mentor Graphics Tools to Accelerate Customer Yield Ramps

June 2, 2016

Highlights:
• Samsung Foundry Closed-Loop Design for Manufacturability (DFM) solution leverages data from design, test and manufacturing to identify and classify customer product yield limiters.
• Samsung Foundry has demonstrated more than 10 percent yield gains* in products that employed this innovative continuous learning solution.
• Closed-Loop DFM solution is built on Mentor® Calibre® and Tessent® platforms.

WILSONVILLE, Ore., June 1, 2016—Mentor Graphics Corp. (NASDAQ: MENT) today announced that Samsung Foundry’s Closed-Loop DFM solution uses production Mentor Calibre and Tessent platforms to accelerate customer yield ramps. A successful yield … Read More → "Samsung Foundry Closed-Loop DFM Solution Leverages Mentor Graphics Tools to Accelerate Customer Yield Ramps"

Synopsys’ SpyGlass Solution Delivers Critical Technology to Enable Compliance with DO-254 Aviation Safety Standard

June 2, 2016

MOUNTAIN VIEW, Calif., June 2, 2016 /PRNewswire/ — Synopsys, Inc. (Nasdaq:SNPS) today announced the availability of key technology required by airborne electronic hardware (AEH) system-on-chip (SoC) teams for compliance with the DO-254 standard. The DO-254 standard is used to ensure the highest level of safety in AEH designs for airborne applications. Built upon the industry’s leading Synopsys SpyGlass® RTL Signoff solution, Synopsys’ key technology includes a comprehensive set of necessary register transfer level (RTL) and clock-domain crossing (CDC) checks, related methodologies and documentation to accelerate RTL signoff of aviation-related electronic … Read More → "Synopsys’ SpyGlass Solution Delivers Critical Technology to Enable Compliance with DO-254 Aviation Safety Standard"

MOU to promote adoption of printable, flexible electronics in key industry verticals

June 2, 2016

OTTAWA— June 02, 2016—The Canadian Printable Electronics Industry Association (www.cpeia-acei.ca) and the Institute of Electrical and Electronics Engineers, Incorporated (IEEE), have entered into a strategic partnership with the signing of a Memorandum of Understanding between the CPEIA and the IEEE Ottawa Section (Read More → "MOU to promote adoption of printable, flexible electronics in key industry verticals"