News – Page 1347 – EEJournal

Encapsulated DC-DC converters offer chassisor DIN rail mounting

May 13, 2016

XP Power today announced the DTE series of fully encapsulated single output DC-DC converters. The series comprises three ultra-wide input voltage range models offering 20 (DTE20), 40 (DTE40) and 60 Watts (DTE60) output power. The units are available in either a chassis mount or a DIN rail format, offering flexibility to the designer of the end-product. The fully encapsulated package also helps protect the converter from environmental factors often found in industrial applications in addition to aiding heat dissipation.

These highly efficient converters, with model-dependent typical efficiency in the range 89 – 92%, run cooler and consume less power compared … Read More → "Encapsulated DC-DC converters offer chassisor DIN rail mounting"

IAR Systems Presents How to Get Smaller, Faster and Smarter Code at IoT DevCon in Santa Clara, California

May 12, 2016

Foster City, CA, United States/Uppsala, Sweden—May 9, 2016—IAR Systems® announces that the company will be exhibiting at the Internet of Things Developers Conference (IoT DevCon) 2016, in Santa Clara, California, on May 25-26. During the event, IAR Systems will guide visitors on how the … Read More → "IAR Systems Presents How to Get Smaller, Faster and Smarter Code at IoT DevCon in Santa Clara, California"

Barco Silex launches flexible eSecure IP module as cornerstone for fully-secured IoT applications

May 12, 2016

Louvain?la?Neuve, Belgium ?? May 10, 2016 ?? Barco Silex, the leading provider of IP cores for security, launches a new IP module to turn ASIC and SoC designs into fully-secured IoT (Internet of Things) applications. The eSecure module functions as a root-of-trust, guaranteeing the authenticity and integrity of the application’s hardware, software, data, and communication. It offloads all security operations to hardware and scales according to the needs of the application. Its cryptographic engine supports all latest algorithms for TLS/DTLS 1.3, Thread Networking, Apple HomeKit, Bluetooth, ZigBee and more.

The heart of the eSecure module is a secure … Read More → "Barco Silex launches flexible eSecure IP module as cornerstone for fully-secured IoT applications"

Keysight Technologies Introduces Comprehensive Transmitter Testing Software for USB 3.1 Type-CTM Designs

May 12, 2016

Highlights:

Comprehensive and accurate transmitter testing
Addition of the Gen2 SSC, SCDx/LBPM and preshoot/de-emphasis tests
Support for Type-C Gen1 and Gen2 compliance testing

SANTA ROSA, Calif., May 10, 2016 – Keysight Technologies, Inc. (NYSE: KEYS) today introduced the Read More → "Keysight Technologies Introduces Comprehensive Transmitter Testing Software for USB 3.1 Type-CTM Designs"

Avnet Introduces Industrial IoT Starter Kit to Streamline Smart Device and Cloud Development

May 12, 2016

SANTA CLARA, Calif.—May 10, 2016—Internet of Things World – Read More → "Avnet Introduces Industrial IoT Starter Kit to Streamline Smart Device and Cloud Development"

Anritsu Adds Tools to VNA Families that Improve Signal Integrity Testing Capability for Verification of High-speed Designs

May 12, 2016

Morgan Hill, CA – May 2016 – Anritsu Company continues to address the test needs of signal integrity (SI) engineers with the introduction of options for its VectorStar® and ShockLine™ vector network analyzers (VNAs). The VectorStar Eye Diagram and ShockLine Advanced Time Domain (ATD) options are part of the expanding SI capabilities offered by Anritsu and provide SI engineers with improved tools to conduct channel diagnostics and model validation of high-speed digital circuit designs.

“As data rates continue to increase, signal channel characterization becomes increasingly challenging. The result is that VNAs are becoming more of a staple in signal integrity … Read More → "Anritsu Adds Tools to VNA Families that Improve Signal Integrity Testing Capability for Verification of High-speed Designs"

Innovative air cavity packaging brings significant cost reductions and performance improvements to RF transistors used in wireless infrastructure

May 12, 2016

Nijmegen, The Netherlands – May 12th, Ampleon today announced the availability of a new package platform that will be rolled out across the entire LDMOS and GaN product portfolio. Over a dozen variants of the SOT502 and SOT539 platforms are in development. The ACP3, a copper flanged air cavity package will initially be available for GEN9 and GEN10 high power RF transistors. The first products to use the ACP3 package are the BLC9G20XS-400AVT, BLC9G20XS-550AVT and the BLC9G22XS-400AVT devices, which are now in production. Several more products covering different power levels … Read More → "Innovative air cavity packaging brings significant cost reductions and performance improvements to RF transistors used in wireless infrastructure"

GainSpan, Geo Semiconductor and ON Semiconductor Introduce HD Streaming Video/Audio Platform for Smart Homes

May 12, 2016

Santa Clara, CA, IoT World 2016 –– IoT Solutions provider GainSpan Corporation, in collaboration with Geo Semiconductor and ON Semiconductor, introduces a low-power, battery-operated video doorbell reference design capable of streaming high definition (HD) video and two-way, telephony quality audio over WiFi networks. Developed in response to the rapidly growing IoT market for video/audio streaming products in the home, the reference design platform speeds time to market and reduces product development cost and cycle times for Original Equipment Manufacturers (OEMs). Through this partnership, customers benefit from the leadership each company has shown in its respective field: Geo Semiconductor’s … Read More → "GainSpan, Geo Semiconductor and ON Semiconductor Introduce HD Streaming Video/Audio Platform for Smart Homes"

TI introduces the first differential inductive switch

May 12, 2016

DALLAS (May 11, 2016) – Texas Instruments (TI) (NASDAQ: TXN) today introduced the industry’s first differential inductive switch, with a dual-coil architecture that automatically compensates for variations in temperature and component aging. The LDC0851 detects the presence or absence of conductive material by using a simple coil drawn on a printed circuit board (PCB). This unique approach enables low-cost, highly reliable switching implementations for a variety of uses including buttons, knobs, door open/close detection, and speed and directional sensing in personal electronics, appliances, industrial equipment and communications applications. For information about the new inductive switch or to order samples, see< … Read More → "TI introduces the first differential inductive switch"

New Automotive Microcontrollers from STMicroelectronics Pave the Way to Smart Driving via More Secure and Connected Cars

May 12, 2016

Geneva, May 11, 2016 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has launched a new family of automotive microcontrollers that heralds the advent of more secure and connected cars.

This new family of power-efficient and real-time-capable MCUs brings the world´s first Power Architecture™- based devices manufactured in state-of the-art 40nm Flash technology dedicated to Car Body and Security applications. It is composed of three product lines; SPC58 B-Line, SPC58 C-Line, and SPC58 G-Line, which offer from 512KB to 6MB of embedded Flash memory.

The high level of … Read More → "New Automotive Microcontrollers from STMicroelectronics Pave the Way to Smart Driving via More Secure and Connected Cars"