News – Page 1346 – EEJournal

Imec Expands its Silicon Platform for Quantum Computing Applications

May 17, 2016

Leuven (Belgium) – May 17, 2016 – At the Quantum Europe conference, taking place in Amsterdam, Belgian’s nanoelectronincs research center imec announced today that it is ramping-up its R&D activities focused on quantum computing. Imec will implement qubits and supporting nanoelectronic functionality for quantum computing, leveraging its advanced silicon (Si) platform that was established within the framework of its industrial affiliation program with additional support from the EU through e.g. ECSEL projects SENATE and TAKE-5.

Widely seen as a possible solution to complex computing problems which are intractable on classical computers, quantum computing uses … Read More → "Imec Expands its Silicon Platform for Quantum Computing Applications"

Avnet Expands PicoZed Ecosystem with Updated FMC Carrier Card Kit

May 17, 2016

PHOENIX—May 17, 2016—Read More → "Avnet Expands PicoZed Ecosystem with Updated FMC Carrier Card Kit"

Toshiba Expands Synopsys IC Compiler II Usage Across Groups to Shorten Design Cycle

May 17, 2016

MOUNTAIN VIEW, Calif., May 17, 2016 /PRNewswire/ —

Highlights:

IC Compiler II has enabled Toshiba to achieve successful tapeout for over a dozen designs across established and emerging processes
Best-in-class quality of results establishes IC Compiler II as plan of record for performance-critical designs at Toshiba, making IC Compiler II the predominant place and route flow at Toshiba applied to internal designs as well as external designs.
Toshiba has rolled out the latest version of their IC Compiler II-based … Read More → "Toshiba Expands Synopsys IC Compiler II Usage Across Groups to Shorten Design Cycle"

Lattice Announces First Programmable ASSP (pASSP) Interface Bridge for Mobile Image Sensors and Displays

May 16, 2016

Industry’s first programmable bridging device that resolves interface mismatches between mobile application processors, image sensors and displays.
Defines a new class of programmable ASSPs combining the flexibility and fast time to market of an FPGA with the power and functional optimization of an ASSP.
Ideal for a variety of markets including VR, drones, cameras, wearable devices, mobile devices and human machine interfaces (HMIs).

PORTLAND, OR – May 16, 2016 – Lattice Semiconductor Corporation (NASDAQ: LSCC), the leading provider of customizable smart connectivity solutions, today … Read More → "Lattice Announces First Programmable ASSP (pASSP) Interface Bridge for Mobile Image Sensors and Displays"

Automotive industry qualified power inductors from TT Electronics are robust and efficient

May 16, 2016

Weybridge, UK, 16 May 2016 – TT Electronics, a global provider of engineered electronics for performance critical applications, today launched the HA78 series of power inductors aimed at LED driver and braking control system applications in the automotive market. The inductors are Ideal for high power density applications where size is critical and particularly where high-efficiency DC-DC converters are using high switching frequencies to 3Mhz as well as EMI and low pass DC filters.

Bearing the all important automotive industry AEC-Q200 certification, the HA78 series … Read More → "Automotive industry qualified power inductors from TT Electronics are robust and efficient"

ProTek Devices Beefs Up Circuit Protection Offering Across Networking, Mobile and other Computing Applications

May 16, 2016

TEMPE, Ariz. – May. 16, 2016 – ProTek Devices™ has introduced two new circuit protection components that shield a variety of networking, mobile and other computing applications from the destructive effects of electrical transients. The GBLC03CIDNHP is an ultra-low capacitance (0.6pF typical) transient voltage suppressor array (TVS array) available in a bidirectional configuration. The SRV25-4LC is a port protection array that also boasts ultra-low capacitance (1.0pF typical).

ProTek Devices’ GBLC03CIDNHP is ideal for Ethernet 10/100/1000 Base T, smartphones and other handheld wireless systems, and USB interfaces. It is rated at 500 Watts for an 8/20 micro second waveshape. It meets … Read More → "ProTek Devices Beefs Up Circuit Protection Offering Across Networking, Mobile and other Computing Applications"

UltraSoC announces significant product update, improved support for analytics and ‘any CPU’ capability

May 16, 2016

CAMBRIDGE, United Kingdom, 16th May 2016 — UltraSoC today announced the latest version of its advanced semiconductor IP and software tools for SoC development, debug, optimization and hardware security. The latest release in UltraSoC’s continuous development program includes extended support for data analytics and visualization, improved performance monitoring and system optimization capabilities, enhanced integration with third-party tool-chains, improved support for … Read More → "UltraSoC announces significant product update, improved support for analytics and ‘any CPU’ capability"

STMicroelectronics Reveals Advanced Silicon-Carbide Power Devices to Accelerate Automotive Electrification

May 16, 2016

Complete set of devices allows full conversion of auto power modules to silicon carbide (SiC) for greater vehicle range, convenience, and reliability
Advanced 6-inch wafer capability and process to bring superior SiC offer to carmakers and automotive suppliers
AEC-Q101 qualification program to complete in early 2017, ready for new OEM product launches

Geneva, May 16, 2016 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronic applications, has announced advanced high-efficiency power semiconductors for Hybrid and Electric Vehicles (EVs) with a timetable for qualification to the automotive quality standard AEC-Q101.</ … Read More → "STMicroelectronics Reveals Advanced Silicon-Carbide Power Devices to Accelerate Automotive Electrification"

Micronas Deploys ClioSoft SOS Design Collaboration Platform

May 16, 2016

REMONT, Calif., May 17, 2016 – Micronas, a TDK group company and the most preferred partner for sensing and control, has deployed ClioSoft’s SOS7 Design Management Platform. ClioSoft is the pioneer and leading developer of system-on-chip (SoC) design configuration and enterprise intellectual property (IP) management solutions for the semiconductor industry. ClioSoft’s SOS platform is integrated with major EDA flows from Cadence Design Systems, Keysight Technologies, Mentor Graphics and Synopsys.

The deployment of ClioSoft SOS for Synopsys Custom Compiler™ at Micronas’ operational headquarters in Freiburg, Germany, will improve design collaboration and data management among design teams as well as … Read More → "Micronas Deploys ClioSoft SOS Design Collaboration Platform"

Uurmi Fog Removal Software Now Available on Cadence Tensilica Vision DSPs

May 16, 2016

SAN JOSE, Calif., May 16, 2016–Cadence Design Systems, Inc. (NASDAQ: CDNS) and Uurmi Systems today announced that Uurmi’s fog removal software targeted for automotive and camera markets is now available on the Cadence® Tensilica® Vision digital signal processor (DSP). By porting their fog removal software to the Tensilica Vision DSP, Uurmi achieved up to 5X higher performance, with 15X less power consumption.

Uurmi’s fog removal software eliminates fog present in the photo and applies correction to improve the image. It uses … Read More → "Uurmi Fog Removal Software Now Available on Cadence Tensilica Vision DSPs"