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Mentor Graphics Extends the PADS PCB Product Creation Platform with Advanced Analog/Mixed-Signal and High Speed Analysis for Mainstream Engineers

July 11, 2016

WILSONVILLE, Ore., July 11, 2016 — Mentor Graphics Corporation (NASDAQ: MENT) today announced the latest additions to the PADS® PCB Product Creation Platform. New analog/mixed-signal (AMS) and high-speed analysis products address engineering challenges associated with mixed-signal design, DDR implementation, and electrically-correct design signoff. Tightly integrated and highly affordable, the new PADS AMS Design Suite, PADS AMS Cloud, PADS HyperLynx® DRC, and PADS HyperLynx DDR products streamline the design process and ensure circuit performance goals are met, reducing the need for prototypes and design re-spins.  Combined with the recently announced PADS HyperLynx® DC Drop and PADS FloTHERM® XT products for power … Read More → "Mentor Graphics Extends the PADS PCB Product Creation Platform with Advanced Analog/Mixed-Signal and High Speed Analysis for Mainstream Engineers"

Intersil Announces Industry’s First Rad Tolerant 36V Instrumentation Amplifier with Integrated Differential ADC Driver

July 11, 2016

Milpitas, Calif., July 11, 2016 – Intersil Corporation (NASDAQ: ISIL), a leading provider of innovative power management and precision analog solutions, today introduced the industry’s first radiation tolerant 36V instrumentation amplifier (in-amp) featuring an integrated differential analog-to-digital converter (ADC) driver. The high performance ISL70617SEH differential input, rail-to-rail output in-amp delivers the industry’s highest signal processing performance for low-level sensor telemetry data critical … Read More → "Intersil Announces Industry’s First Rad Tolerant 36V Instrumentation Amplifier with Integrated Differential ADC Driver"

Synopsys Releases Coverity 8.5 Static Analysis Tool

July 11, 2016

MOUNTAIN VIEW, Calif., July 11, 2016 /PRNewswire/ —  

Highlights:

  • Introduces Coverity static analysis capabilities for Ruby and node.js web applications, as well as Android mobile applications
  • Expands Coverity security analysis to mitigate a wider range of security vulnerabilities
  • Adds full support for MISRA C 2012 coding guidelines used in automotive, medical device and other safety-critical industries
  • Enhances development lifecycle integration and reporting, including consolidated reporting functionality across several tools in the Software Integrity Platform
  • Adds localization in simplified Chinese to Coverity user interface and documentation
< … Read More → "Synopsys Releases Coverity 8.5 Static Analysis Tool"

Imec and ARM collaborate on Design-Technology Co-Optimization for 7nm technology and beyond

July 11, 2016

Leuven (Belgium) and Cambridge (UK) – July 11, 2016 – World-leading nanoelectronics research center imec has signed a strategic partnership with ARM, the company whose semiconductor IP technologies enable a third of all intelligent digital goods sold each year. ARM’s involvement with imec’s INSITE program will focus on addressing the impacts of circuit design and system-level architecture on power, performance, area and cost of nanotechnology chip process nodes from 7nm and beyond.

“This strategic collaboration with ARM is extremely important for imec,” stated Luc Van den hove, president and CEO at imec. “Collaborating with ARM enables … Read More → "Imec and ARM collaborate on Design-Technology Co-Optimization for 7nm technology and beyond"

Applied Materials’ Next-Generation E-Beam Inspection System Provides Industry’s Highest Resolution

July 11, 2016

KLA-Tencor Introduces Comprehensive Wafer Inspection and Review Portfolio for Leading IC Technologies

July 11, 2016

SAN FRANCISCO, July 11, 2016 /PRNewswire/ — In advance of SEMICON West, KLA-Tencor Corporation  (NASDAQ: KLAC) today introduced six advanced wafer defect inspection and review systems for leading-edge IC device manufacturing: the 3900 Series (previously referred to as Gen 5) and 2930 Series broadband plasma optical inspectors, the Puma™ 9980 laser scanning inspector, the CIRCL™5 all-surface inspection cluster, the Surfscan®SP5XP unpatterned wafer inspector and the eDR7280™ e-beam review and classification tool. These systems employ a range of innovative technologies to form a comprehensive wafer inspection solution that enables discovery … Read More → "KLA-Tencor Introduces Comprehensive Wafer Inspection and Review Portfolio for Leading IC Technologies"

Percepio Launches Tracealyzer for Micrium’s µC/OS-III with Streaming Trace

July 8, 2016

Västerås, Sweden, 7th July 2016 – Percepio AB, the Swedish developer of RTOS visualization tools, today announced the launch of Tracealyzer for Micrium’s µC/OS-III® with streaming trace. The new Tracealyzer for µC/OS-III is built on Percepio’s latest Tracealyzer 3.0 platform and contains its streaming trace recorder, which allows for capturing arbitrarily long trace recordings as well as the traditional snapshot (RAM buffer) recorder. The new Tracealyzer for µC/OS-III is an easy upgrade for licensed users of µC/Trace.

Percepio founder and CEO Dr. Johan Kraft said “Having Micrium’s µC/ … Read More → "Percepio Launches Tracealyzer for Micrium’s µC/OS-III with Streaming Trace"

Micron Introduces Industry’s Best-in-Class SLC NAND Flash for IoT and Automotive

July 8, 2016

BOISE, Idaho, July 07, 2016 (GLOBE NEWSWIRE) — Micron Technology, Inc. (NASDAQ:MU), today announced its newest embedded SLC NAND Flash optimized for the next generation of Internet of Things (IoT) and automotive applications. Available with differing interfaces to accommodate design,  Micron’s second generation Serial (SPI) NAND and fifth generation parallel SLC NAND, offers the industry’s best-in-class reliability1 and read and program performance, ease of design and advanced security features.

Gartner projects that the IoT endpoint hardware and services market will rise to a $3.5 trillion industry by 20202. As system designers seek embedded … Read More → "Micron Introduces Industry’s Best-in-Class SLC NAND Flash for IoT and Automotive"

Multiprotocol Transceiver Simplifies Industrial Designs & Supports Legacy Peripherals

July 7, 2016
  • Supports broader range of RS-232 peripherals with wide ±10V RS-232 driver output
  • Reduces component count and saves board space as a result of integrated cable termination
  • Supports full DB9 RS-232 or RS-485/RS-422 serial protocols from one IC

Fremont, CA – July 7, 2016 – Exar Corporation (NYSE: EXAR), a leading supplier of analog mixed-signal products serving the industrial, high-end consumer and infrastructure markets, expanded its family of single-chip RS-232/RS-485/RS-422 serial transceivers by adding the XR34350.Read More → "Multiprotocol Transceiver Simplifies Industrial Designs & Supports Legacy Peripherals"

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