News – Page 1335 – EEJournal

Nordic Semiconductor launches nRF51824 Bluetooth low energy SoC for latest connected car intelligent automotive applications and wireless in-car charging

June 8, 2016

Oslo, Norway – June 8, 2016 – Nordic Semiconductor today announces the immediate availability of the nRF51824 Bluetooth® low energy (formerly Bluetooth Smart) System-on-Chip (SoC) for the latest connected car intelligent automotive applications and wireless in-car charging.

The nRF51824 is qualified to the automotive AEC-Q100 stress test qualification for integrated circuits,and delivers the same flexible feature range and performance as Nordic’s highly successful and field-proven nRF51822 Bluetooth low energy SoC (256kB Flash and 16kB RAM variant) upon which the nRF51824 is based.

“The world of … Read More → "Nordic Semiconductor launches nRF51824 Bluetooth low energy SoC for latest connected car intelligent automotive applications and wireless in-car charging"

Ultratech Cambridge Nanotech Enter Into JDP With IMEC To Study Area-Selective Deposition Technology

June 8, 2016

SAN JOSE, Calif., June 8, 2016 /PRNewswire/ — Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography, laser processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HB LEDs), as well as atomic layer deposition (ALD) systems, announced that its Cambridge Nanotech business unit Ultratech-CNT has entered into a Joint Development Program (JDP) with IMEC in the field of Area-Selective Deposition (ASD) technology. The ASD project will concentrate on the study and use of Self-Assembled Monolayers (SAMs) as a means of functionalizing surfaces to selectively inhibit ALD-grown films. Ultratech-CNT’ … Read More → "Ultratech Cambridge Nanotech Enter Into JDP With IMEC To Study Area-Selective Deposition Technology"

SMIC and Synopsys Deliver 28-nm HKMG Low-Power Reference Flow

June 8, 2016

MOUNTAIN VIEW, Calif. and SHANGHAI, June 8, 2016 /PRNewswire/ —

Highlights:

Technology advancements in the latest release of IC Compiler II deliver exceptional quality-of-results across all key metrics: Better performance, smaller area and lower power
Speeds design setup and closure with pre-validated Synopsys Lynx Design System technology plug-in for SMIC 28-nm HKMG process

Semiconductor Manufacturing International Corporation (“SMIC”; NYSE: SMI; SEHK: 981), China’s largest and most advanced semiconductor foundry and one of the world’s largest foundries, and … Read More → "SMIC and Synopsys Deliver 28-nm HKMG Low-Power Reference Flow"

ARM Extends Solutions for Custom SoC development in Embedded and IoT Markets

June 7, 2016

Cambridge, UK, June 6, 2016 – ARM has expanded its ARM^® DesignStart™ initiative to offer simplified and expedited access to EDA tooling and design environments from Cadence and Mentor Graphics. The new partnership, announced at DAC 2016, builds on the benefits of free access to ARM Cortex^®-M0 processor IP offered through the DesignStart … Read More → "ARM Extends Solutions for Custom SoC development in Embedded and IoT Markets"

Mentor Graphics Offers Tanner Calibre One Verification Suite for the Tanner Analog/Mixed-Signal IC Design Environment

June 7, 2016

WILSONVILLE, Ore., June 06, 2016 — Mentor Graphics® Corporation (NASDAQ: MENT) today announced the Tanner Calibre One IC verification suite as an integral part of the Tanner™ analog/mixed-signal (AMS) physical design environment, creating an easy path to the proven capabilities of Calibre® verification tools for Tanner EDA’s user base. This results in a dramatically-improved IC design and verification solution for Tanner customers by providing tightly-integrated access to Calibre’s physical and circuit verification, exclusively within the Tanner L-Edit™ layout environment.

The Calibre platform is the industry-leader for physical verification and is qualified for sign-off by … Read More → "Mentor Graphics Offers Tanner Calibre One Verification Suite for the Tanner Analog/Mixed-Signal IC Design Environment"

Arastu Systems’ DFI 3.1 compatible and validated DDR4 Controller Core for increased system performance and reliability

June 7, 2016

June 7th, 2016, San Jose, CA – Arastu Systems, a company that specializes in developing IPs in the Memory and Networking area today announced its DDR4 DRAM Memory Controller considering the need for higher performing, higher densities memories in applications pertaining to Data Center and Enterprise market. The IP is compliant to popular industry standards as well customized for specific customer’s needs.

The controller is designed as per JEDEC standard JESD79-4A and works seamlessly with our partner’s DFI PHY or DFI 3.1 compatible … Read More → "Arastu Systems’ DFI 3.1 compatible and validated DDR4 Controller Core for increased system performance and reliability"

NXP Selects Synopsys As Primary SoC Verification Solution

June 7, 2016

MOUNTAIN VIEW, Calif., June 6, 2016 /PRNewswire/ — Synopsys, Inc. (NASDAQ: SNPS) today announced that it was selected by NXP Semiconductor as its primary system-on-chip (SoC) verification solution for automotive and secure connectivity applications. Synopsys’ comprehensive verification solution will be of primary use for the entire SoC verification cycle, including simulation, debug, formal verification, static verification, verification IP, emulation, and verification coverage. Synopsys’ leadership position in all of these critical verification technology areas, combined with native integrations between these products, enables NXP to have increased verification performance, productivity, faster coverage closure, and accelerated time-to-market.

“The requirements for safety and security … Read More → "NXP Selects Synopsys As Primary SoC Verification Solution"

Coventor Announces SEMulator3D 6.0 and New Electrical Analysis Capabilities

June 7, 2016

CARY, NC– June 6, 2016 – Coventor®, Inc., the leading supplier of automated software solutions for semiconductor devices and micro-electromechanical systems (MEMS), today announced the availability of SEMulator3D® 6.0 – the latest version of its semiconductor virtual fabrication platform. This new version further increases the accuracy of the process simulation, geometry and modeling of advanced semiconductor processes with new features, usability enhancements and a new add-on capability for electrical analysis. Along with SEMulator3D 6.0, Coventor is releasing an all-new SEMulator3D Electrical Analysis add-on component that allows seamless resistance and capacitance extraction … Read More → "Coventor Announces SEMulator3D 6.0 and New Electrical Analysis Capabilities"

ARM Announces POP IP for ARM Cortex-A73 on TSMC 16FFC Process

June 7, 2016

Cambridge, UK, June 7, 2016 – ARM today announced the availability of ARM^® Artisan^® physical IP, including POP™ IP, for mainstream mobile SoCs based on the new ARM Cortex^®-A73 processor on the TSMC 16FFC (FinFET Compact) process. The third-generation Artisan FinFET platform is optimized for TSMC 16FFC process and will enable ARM SoC partners to design the most power-efficient, high performance implementations of Cortex-A73 for mobile and other consumer applications for mass-market price points.

ARM taped out the first TSMC 16FFC test chip incorporating Cortex-A73 POP IP in early May 2016. The chip is … Read More → "ARM Announces POP IP for ARM Cortex-A73 on TSMC 16FFC Process"

Zuken Raises The Bar For ECAD/MCAD and Multi-user Efficiencies With CR-8000

June 7, 2016

Engineers facing extremely tight design cycles will benefit from powerful new multi-user functionality in Zuken’s Read More → "Zuken Raises The Bar For ECAD/MCAD and Multi-user Efficiencies With CR-8000"