News – Page 1326 – EEJournal

Artila Releases New C Programmable I/O Controller Module

July 1, 2016

Taipei, Taiwan – July 2016 — Artila Electronics, the leading designer and manufacturer of embedded device networking and computing, is proud to release RIO-2015PG, the new FreeRTOS programmable remote I/O module. RIO-2015PG is powered by a 32-bit Atmel SAM4E16E 120MHz ARM Cortex M4 processor which is equipped with 256KB SRAM, 3MB Flash and FreeRTOS real time operating system. The industrial I/O of RIO-2015PG features one 10/100 MHz Ethernet port, one RS-232, one isolated RS-485, four isolated analog input channels, two isolated analog output channels, four isolated digital input and two channels of relay … Read More → "Artila Releases New C Programmable I/O Controller Module"

Smaller Yet More Powerful, GE’s MV7-Series Drive with UWave Technology Brings More Energy-Efficient Performance

July 1, 2016

Based on GE’s Proven MV7 Technology, the New MV7-Series UWave Drive has Smaller Filter, Leading to up to 40 Percent Footprint Reduction
Thanks to Its High Harmonic Performance, the Drive Provides High Power Quality, Ensuring Smooth Grid Integration and Enabling a More Resilient Power Network

PARIS—June 30, 2016—It has been said that energy efficiency is the invisible fuel to “keep the world turned on.” Demonstrating a commitment to helping customers extract, generate, convert or transport energy more efficiently, GE’s Power Conversion business (NYSE: GE) is proud to unveil … Read More → "Smaller Yet More Powerful, GE’s MV7-Series Drive with UWave Technology Brings More Energy-Efficient Performance"

Renesas Electronics Streamlines Memory Component Count in Data Center: Enables Quantity Reduction of Memory Devices to 1/15th and 60-Percent Reduction in Memory Power Consumption

July 1, 2016

Düsseldorf, June 30, 2016 – Renesas Electronics, a premier supplier of advanced semiconductor solutions, today announced a packet header search reference design for 100 Gigabit (Gb) communications devices such as routers, switches, and servers.

The Renesas reference design is comprised of the LLDRAM-III (RMHE41A364AGBG) power-efficient, low-latency memory (LLDRAM), proprietary exact-match search IP, and LLDRAM-III … Read More → "Renesas Electronics Streamlines Memory Component Count in Data Center: Enables Quantity Reduction of Memory Devices to 1/15th and 60-Percent Reduction in Memory Power Consumption"

Epiq Solutions Announces the Sidekiq™ M.2 Software Defined Radio Transceiver Card

June 30, 2016

SCHAUMBURG, Ill., June 29, 2016 /PRNewswire/ — Epiq Solutions, an engineering firm specializing in the development of flexible wireless communications systems, has announced the Read More → "Epiq Solutions Announces the Sidekiq™ M.2 Software Defined Radio Transceiver Card"

STMicroelectronics Introduces New Bluetooth® Low Energy Single-Chip Solution

June 30, 2016

BlueNRG-1 System-on-Chip delivers low power consumption and radio-connection reliability
SoC serves needs of fastest-growing emerging Bluetooth Low Energy markets including retail technology, wearables, connected home, automotive, industrial and medical

Geneva, June 30, 2016 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has revealed its first Bluetooth^® Low Energy wireless System-on-Chip (SoC). The Read More → "STMicroelectronics Introduces New Bluetooth® Low Energy Single-Chip Solution"

IAR Systems extends code analysis for applications based on Texas Instruments’ MSP430 MCUs

June 30, 2016

Uppsala, Sweden—June 30, 2016—IAR Systems® announces a new version of its development tools IAR Embedded Workbench® for Texas Instruments MSP430, version 6.50. The version offers extended capabilities for code quality control through the powerful static analysis tool C-STAT®, extended inline assembler and support for the latest MSP430 devices.

The static analysis functionality within the add-on tool C-STAT has been improved with the new version of the toolchain. The latest version adds approximately 150 new checks to the existing wide range of checks in C-STAT, including 90 … Read More → "IAR Systems extends code analysis for applications based on Texas Instruments’ MSP430 MCUs"

Semtech’s LoRa® Geolocation Solution for Low Power Wide Area Networks is Now Available

June 30, 2016

CAMARILLO, Calif., June 30, 2016 – Semtech Corporation (Nasdaq: SMTC), a leading supplier of analog and mixed-signal semiconductors, today announced the addition of GPS-free geolocation capability to its Read More → "Semtech’s LoRa® Geolocation Solution for Low Power Wide Area Networks is Now Available"

40V, 3.5A µModule Regulator is FMEA Compliant, Operates up to 150°C Junction Temperature

June 30, 2016

MILPITAS, CA – June 30, 2016 – Linear Technology introduces the LTM8003, a step-down DC/DC µModule^® regulator with a 40V … Read More → "40V, 3.5A µModule Regulator is FMEA Compliant, Operates up to 150°C Junction Temperature"

Applied Materials Revolutionizes Etch With Breakthrough Selective Materials Technology

June 30, 2016

Disruptive etch technology shapes features with the atomic-level precision required to advance Moore’s Law
Extreme selectivity process removes unwanted material without damaging increasingly delicate structures
In production at leading chipmakers for advanced FinFET and memory

SANTA CLARA, Calif., June 29, 2016 (GLOBE NEWSWIRE) — Applied Materials, Inc. is revolutionizing etch technology with its Read More → "Applied Materials Revolutionizes Etch With Breakthrough Selective Materials Technology"

MEMS & Sensors Industry Group Invites Collaboration in MEMS, Sensors and ICs at SEMICON West 2016

June 29, 2016

PITTSBURGH (June 29, 2016) – MEMS & Sensors Industry Group® (MSIG) invites attendees to a special half-day workshop on the convergence of MicroElectroMechanical Systems (MEMS) devices, sensors, flexible substrates and semiconductors in the Internet of Things (IoT) at Read More → "MEMS & Sensors Industry Group Invites Collaboration in MEMS, Sensors and ICs at SEMICON West 2016"