News – Page 1319 – EEJournal

Pervasive Displays collaborates with Energia IDE to add ultra-low power e-paper driver support to TI LaunchPad™ development kits

September 21, 2016

Tainan City, Taiwan – 21 September, 2016. Pervasive Displays (PDi), a world leader in e-paper displays today announced the results of its collaboration with community-driven and open source electronics prototyping platform provider Energia. http://energia.nu/ The Energia integrated development environment (IDE) provides similar support for the Texas Instruments (TI) family of LaunchPad™ < … Read More → "Pervasive Displays collaborates with Energia IDE to add ultra-low power e-paper driver support to TI LaunchPad™ development kits"

Mentor Graphics Extends Offering to Support TSMC 7nm and 16FFC FinFET Process Technologies

September 21, 2016

WILSONVILLE, Ore., September 21, 2016—Mentor Graphics Corp. (NASDAQ: MENT) today announced further enhancements and optimizations for various products within the Calibre® Platform, and Analog FastSPICE (AFS™) Platform, as well as the completion of further certifications and reference flows for Taiwan Semiconductor Manufacturing Corporation (TSMC) 16FFC FinFET and 7nm FinFET processes. Moreover, the Calibre offering has been extended on additional established TSMC processes in support of the growing Internet of Things (IoT) design market requirements.

Dual µModule Regulator in 15mm x 9mm x 2.42mm BGA is Configurable as SEPIC (Buck-Boost) and Inverting

September 21, 2016

MILPITAS, CA – September 21, 2016 – Linear Technology introduces the LTM8049, a dual output, two-function DC/DC µModule® (power module) regulator in 15mm x 9mm x 2.42mm BGA package. One function is SEPIC (single-ended primary-inductor converter) in which the output voltage is regulated while the input voltage can vary to be less, equal or more than the value of the output voltage. The second function of the LTM8049 is an inverting conversion such that a positive input voltage is converted to a regulated negative output voltage. As a dual regulator, either output of the LTM8049 can be configured for a combination of … Read More → "Dual µModule Regulator in 15mm x 9mm x 2.42mm BGA is Configurable as SEPIC (Buck-Boost) and Inverting"

EMA Provides Supply Chain Driven Part Selection with New PLM and ERP Integrations for the OrCAD Solution

September 21, 2016

Rochester, NY (September 21, 2016) EMA Design Automation® (ema-eda.com), a full-service provider and innovator of Electronic Design Automation (EDA) solutions, has just announced EMA Enterprise Integrate to enable OrCAD customers to bring products to market faster with a direct integration between OrCAD data and corporate PLM and ERP/MRP systems. “A fully … Read More → "EMA Provides Supply Chain Driven Part Selection with New PLM and ERP Integrations for the OrCAD Solution"

Samsung SDS Selects Sensory as Biometric Partner

September 21, 2016

SAN FRANCISCO AND SANTA CLARA, Calif., – September 21, 2016 – Sensory Inc., a Silicon Valley company focused on improving the user experience and security of consumer electronics through state-of-the-art embedded voice and vision technologies, and Samsung SDS, a global ICT service provider, today announced a global partnership that will provide customers with a more secure, more convenient way to use mobile banking and enterprise authentication services. Samsung SDS … Read More → "Samsung SDS Selects Sensory as Biometric Partner"

Synopsys Foundation IP Meets Stringent Automotive AEC-Q100 Grade 1 Temperature Requirements for TSMC 16FFC and 28HPC+ Processes

September 21, 2016

Highlights:

DesignWare Foundation IP meets automotive Grade 1 temperature (-40C to +150C junction) requirements, delivering high reliability for automotive SoCs
ASIL D Ready Embedded Memories, STAR Memory System and STAR Hierarchical System accelerate ISO 26262 functional safety assessments to help reach target ASIL levels
High-speed, high-density and ultra-high-density logic libraries, memory compilers and HPC Design Kits deliver superior performance, power and area on TSMC 16FFC and 28HPC+

Synopsys, Inc. (Nasdaq: SNPS) today announced that its DesignWare® Foundation IP, including Read More → "Synopsys Foundation IP Meets Stringent Automotive AEC-Q100 Grade 1 Temperature Requirements for TSMC 16FFC and 28HPC+ Processes"

Synopsys Accelerates Development of Safety-Critical Products with Design Solutions for ARM Cortex-R52

September 20, 2016

MOUNTAIN VIEW, Calif., Sept. 19, 2016 /PRNewswire/ —

Highlights:

Galaxy Design Platform tools, including IC Compiler II place and route, Design Compiler Graphical synthesis, and ISO 26262-certified TetraMAX II ATPG enable optimal power, performance and area for ARM Cortex-R52 designs
Verification Continuum Platform technologies, including:
- High speed Z01X and Certitude fault simulation help assure functional safety for automotive safety standards, including ISO 26262 and IEC 61508
- VCS, ZeBu, HAPS and Verdi solutions accelerate hardware/software integration and debug
- Virtualizer Development Kits for the ARM Cortex-R52 Fast … Read More → "Synopsys Accelerates Development of Safety-Critical Products with Design Solutions for ARM Cortex-R52"

Real Intent Sets a New Benchmark in Early Verification of Digital Designs with Release 2016.A of Ascent Lint

September 20, 2016

SUNNYVALE, Calif. – Sep 20, 2016 — Real Intent Inc., Inc., a leading provider of EDA software to accelerate functional verification and design sign-off, today announced significant enhancements to its Ascent Lint product, the industry’s fastest and most accurate tool for Lint verification of digital designs.

Real Intent’s Ascent products find design errors leading to improved quality of results and … Read More → "Real Intent Sets a New Benchmark in Early Verification of Digital Designs with Release 2016.A of Ascent Lint"

Quantum 2.0 has potential to create step change in computing and communications

September 20, 2016

20 September 2016: “The potential impact of Quantum technology is absolutely profound,” said Professor Neil Stansfield, Head of Excellence for Technology Innovation at the Defence Science and Technology Laboratory, at last week’s CW (Cambridge Wireless) Technology and Engineering Conference (CW TEC) 2016. Opening the event at the University of Cambridge Computer Laboratory, Stansfield also underlined the UK’s world-leading expertise in Quantum research supported by a £300million Government-funded programme and additional £50million earmarked for new innovation projects.

Stansfield pointed to a number of potential practical applications of Quantum technology from detecting micro changes in gravity to identify … Read More → "Quantum 2.0 has potential to create step change in computing and communications"

UltraSoC supports RISC-V: “the Linux of the semiconductor industry”

September 20, 2016

CAMBRIDGE, United Kingdom, 20th September 2016 UltraSoC, the leading provider of semiconductor IP for on-chip analytics, performance optimization and hardware-based security, today announced that it will provide support within its universal system-on-chip (SoC) debug solution for products based on the RISC-V open-source instruction architecture (ISA). The company also lent its support to the RISC-V Foundation, the non-profit corporation that directs … Read More → "UltraSoC supports RISC-V: “the Linux of the semiconductor industry”"