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Rohde & Schwarz presents R&S ScopeStudio, a PC-based oscilloscope solution to boost development teams

Rohde & Schwarz enhances its oscilloscope offerings with the launch of R&S ScopeStudio, an innovative application that brings the functionality of the MXO series oscilloscopes to a PC, often a more convenient and effective workspace. This advanced solution allows engineers to visualize, analyze, document and share oscilloscope measurements, making development teams more efficient.

R&S ScopeStudio is a new software solution from Rohde & Schwarz that transfers the capabilities of the MXO series oscilloscopes to a computer. This PC-based oscilloscope application facilitates the viewing, analysis, documentation and sharing of oscilloscope measurements away from the … Read More → "Rohde & Schwarz presents R&S ScopeStudio, a PC-based oscilloscope solution to boost development teams"

Infineon and the BSI pave the way for a quantum-resilient future: World’s first Common Criteria Certification for post-quantum cryptography algorithm on a security controller

  • Infineon receives world’s first Common Criteria EAL6 certification for implementing a post-quantum cryptography (PQC) algorithm in a security controller
  • Internationally accepted certification is a crucial step towards a quantum-resilient world
  • Post-quantum cryptography supports the protection of digital infrastructure from the future threats of quantum computers

Munich, Germany – 23 January 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has achieved a milestone on the way to a quantum-resilient world in collaboration with the German Federal Office for Information Security (BSI) Read More → "Infineon and the BSI pave the way for a quantum-resilient future: World’s first Common Criteria Certification for post-quantum cryptography algorithm on a security controller"

ROHM’s 2nd Generation MUS-IC Series Audio DAC Chip for Hi-Res Audio Playback with Exclusive HD Monaural Mode

Santa Clara, CA and Kyoto, Japan, Jan. 22, 2025 (GLOBE NEWSWIRE) — ROHM Semiconductor today announced a new 32-bit D/A converter IC (DAC chipRead More → "ROHM’s 2nd Generation MUS-IC Series Audio DAC Chip for Hi-Res Audio Playback with Exclusive HD Monaural Mode"

Xanadu introduces Aurora: world’s first scalable, networked and modular quantum computer

TORONTOJan. 22, 2025 /CNW/ – Xanadu has achieved a world-first in the quantum computing industry by successfully building a universal photonic quantum computer consisting of four modular and independent server racks that are photonically interconnected and networked together. This 12 qubit machine, known as Aurora, consists of 35 photonic chips and a combined 13 km of fiber optics all operating at room temperature.

With this breakthrough, Aurora could in principle be scaled up to thousands of server racks and millions of qubits … Read More → "Xanadu introduces Aurora: world’s first scalable, networked and modular quantum computer"

Multilayer Ceramic Capacitors TDK offers MLCCs with 10 nF and C0G characteristics at 1,250 V in 3225 size for automotive and commercial

  • Enabling space-saving designs and reducing the number of components
  • Qualified based on AEC-Q200

January 22, 2025

TDK Corporation (TSE: 6762) has expanded its CGA series for automotive and C series for commercial multilayer ceramic capacitors (MLCCs) to 10 nF at 1,250 V in 3225 size (3.2 x 2.5 x 2.5 mm – L x W x H), with C0G characteristics (Class I dielectric). This is the industry’s highest capacitance* for a 1,250-V rated product in 3225 size and this temperature characteristic. Mass production of the product series began December 2024.

Circuits using silicon carbide (SiC) MOSFETs, which can withstand … Read More → "Multilayer Ceramic Capacitors TDK offers MLCCs with 10 nF and C0G characteristics at 1,250 V in 3225 size for automotive and commercial"

IAR Expands Support for TMC THA6 Gen2 Series Automotive MCUs, Driving Innovation in Automotive Electronics

Uppsala, Sweden – January 22, 2025 – IAR, a global leader in embedded development solutions, announces its support for the THA6 Gen2 series automotive-grade MCUs from Tongxin Microelectronics Co., Ltd. (TMC). This collaboration, achieved through the latest release of IAR Embedded Workbench for Arm v9.60.3, enables developers to meet next-generation automotive electronics’ high-performance and functional safety demands.

The TMC THA6 Gen2 series is the first Arm Cortex-R52+ ASIL D MCU in China. Operating at a frequency of 400 MHz, it is built on the modern Armv8 architecture, offering both performance and scalability. Additionally, … Read More → "IAR Expands Support for TMC THA6 Gen2 Series Automotive MCUs, Driving Innovation in Automotive Electronics"

TRUMPF and SCHMID Group enable cost-effective high-speed chips

Ditzingen/Freudenstadt (Germany), January 22, 2025 – TRUMPF and the SCHMID Group are developing an innovative manufacturing process for the latest microchip generation for the global chip industry. This will enable manufacturers to increase the performance of high-end electronic components for smartphones, smart watches and AI applications. In the process known as advanced packaging, manufacturers combine individual chips on silicon components known as interposers. With the process from TRUMPF and SCHMID, these interposers can be made of glass in the future.

“Advanced packaging with glass is a crucial future technology for the semiconductor industry. Glass is significantly cheaper than silicon. … Read More → "TRUMPF and SCHMID Group enable cost-effective high-speed chips"

Percepio® Launches Percepio Detect™: Spearheading Observability Driven Development for Embedded Software

Västerås, Sweden, 21 January 2025 – Percepio AB, a leader in continuous observability solutions for embedded systems and edge devices renowned for its award-winning product Tracealyzer®, announces the launch of Percepio Detect, a groundbreaking tool that redefines how embedded software developers tackle testing, debugging, and observability challenges. Supporting the new best practice of Observability Driven Development (ODD), Percepio Detect enables next-generation DevOps for embedded software by seamlessly extending the capabilities of existing Continuous Integration and Continuous Testing (CI/CT) processes. Designed for edge devices and real-time systems, Percepio Detect empowers developers with real-time … Read More → "Percepio® Launches Percepio Detect™: Spearheading Observability Driven Development for Embedded Software"

New Ceramic Catalyst Uses Sodium and Boron to Drive Sustainable Industrial Reactions

Transition metals have long been used as catalysts to activate small molecules and turn them into valuable products. However, as these metals can be expensive and less abundant, scientists are increasingly looking at more common elements as alternatives. In a recent study, researchers used a concept called “frustrated Lewis pairs” to develop a transition metal-free catalyst for activating hydrogen. This breakthrough could lead to more sustainable, cost-effective, and efficient chemical processes.
Heterogeneous catalysts speed up chemical reactions by being in a different state than the reactants. They are efficient and stable, even under challenging conditions … Read More → "New Ceramic Catalyst Uses Sodium and Boron to Drive Sustainable Industrial Reactions"
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