News – Page 13 – EEJournal

Socionext and Innatera Introduce Integrated 60 GHz FMCW Radar and Neuromorphic Edge AI for Human Presence Detection

Embedded World 2026 | Nuremberg | March 10–12 | Booth 4A-628

February 23, 2026

[Langen/Germany, Yokohama/Japan. February 23, 2026] – Socionext and Innatera today announced a jointly developed human-presence detection solution that combines 60 GHz FMCW radar sensing with neuromorphic edge AI to deliver reliable, always-on detection with drastically reduced power consumption. A live demonstration of technology will be showcased at Embedded World 2026 in Nuremberg (Booth 4A-628).

The solution integrates Socionext’s compact 60 GHz FMCW radar, which captures detailed 3D environmental information under all lighting and weather conditions, with Innatera’s ultra-low-power Spiking Neural Processor, which interprets radar patterns directly at the sensor edge. The neuromorphic processor distinguishes human … Read More → "Socionext and Innatera Introduce Integrated 60 GHz FMCW Radar and Neuromorphic Edge AI for Human Presence Detection"

Rohde & Schwarz highlights its comprehensive embedded systems test solutions at embedded world 2026

February 23, 2026

Embedded systems are fundamental to modern electronics, encompassing everything from power input and control PCBs to motors, sensors and user interfaces. Each of these comes with its own testing needs to guarantee optimal performance, reliability and a fast market release of the final product. At embedded world 2026, Rohde & Schwarz will highlight its comprehensive portfolio of advanced test solutions, addressing these critical needs, from the earliest stages of development to compliance and certification through to final production.

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SEGGER Receives ISO 27001 Certification, Strengthening Information Security and Customer Trust

SEGGER has successfully achieved ISO 27001 certification, confirming that the company’s Information Security Management System (ISMS) complies with internationally recognized requirements for managing risk and protecting sensitive information.

February 23, 2026

Monheim am Rhein, Germany — February 20, 2026 — Information security is a long-standing priority at SEGGER, guiding the protection of intellectual property and the responsible handling of customer data. ISO/IEC 27001 certification confirms that these principles are firmly anchored in defined organizational processes.

The certified ISMS establishes clear responsibilities, formalized procedures, and measurable controls across key operational areas, including software development, internal IT infrastructure, product releases, and the handling of sensitive information. It ensures that security measures are regularly reviewed and adapted to evolving requirements.

For customers and partners, certification serves as documented third-party validation that SEGGER’s … Read More → "SEGGER Receives ISO 27001 Certification, Strengthening Information Security and Customer Trust"

Taara Unveils Photonics Platform for Wireless Communication, and Taara Beam, Latest Product in Taara’s Portfolio and First on the New Photonic Core

New silicon photonics-based approach to wireless communication enables deployable, high-performance infrastructure that scales like semiconductors

February 23, 2026

Sunnyvale, CA – February 23, 2026 – Taara, a graduate of X, Google’s Moonshot Factory, today announced a breakthrough approach to commercial communications and connectivity infrastructure, unveiling Taara Photonics, the world’s first wireless communication platform based on optical phased arrays, along with Taara Beam, its first product based on this photonic core. By moving the core functionality of high-speed wireless optical communication into an integrated circuit that controls light electronically, Taara now enables networks that can be deployed in hours, scaled more flexibly, and improved over time, without the constraints of trenching fiber or securing scarce spectrum.

New KYOCERA AVX Capacitors for Optical Communications

February 23, 2026

KYOCERA AVX expanded its selection of 550/560 Series ultra-broadband capacitors to better satisfy surging demand for high-speed, high-bandwidth optical communication systems in a steadily growing range of cross-market applications.

FOUNTAIN INN, S.C. (February 23, 2026) – Read More → "New KYOCERA AVX Capacitors for Optical Communications"

TDK introduces two new DC link capacitor series optimized for on-board chargers in electric vehicles

February 20, 2026

February 19, 2026

TDK Corporation (TSE: 6762) introduces the new B43655 and B43656 series of aluminum electrolytic capacitors designed specifically for DC links in on-board chargers (OBCs) of electric vehicles. Both series are optimized for forced cooling operation, supporting the growing trend toward higher voltages and currents in next-generation OBC platforms. Due to their compact design and high ripple current capability, such capacitors are commonly used in applications requiring maximum efficiency and reliability in confined spaces.

With a high voltage rating … Read More → "TDK introduces two new DC link capacitor series optimized for on-board chargers in electric vehicles"

Keysight Introduces Infiniium XR8 Oscilloscopes to Accelerate High-Speed Digital Validation and Compliance

Next-generation architecture delivers faster analysis, clearer insights, and a compact design to turn days of digital validation into hours

February 19, 2026

SANTA ROSA, Calif. – Keysight Technologies, Inc. (NYSE: KEYS) launched its next-generation Infiniium XR8 Real-Time oscilloscopes, designed to accelerate high-speed digital and compliance testing while improving efficiency and … Read More → "Keysight Introduces Infiniium XR8 Oscilloscopes to Accelerate High-Speed Digital Validation and Compliance"

SECO launches new Genio 360- and Genio 360P-based SOMs and expands its Edge AI portfolio with MediaTek at Embedded World 2026

From cost-efficient Edge AI modules to AI-powered HMIs for industrial and medical application

February 19, 2026

Arezzo, Italy – February 19, 2026– At Embedded World 2026 (March 10–12, Nuremberg), SECO will showcase a portfolio of MediaTek–based solutions, reinforcing its partnership and highlighting how their combined technologies enable advanced Edge AI across multiple verticals.

SOM-Trizeps-X-Genio360/360P: cost-efficient Edge AI SOMs based on MediaTek Genio 360 and pin-to-pin compatible Genio 360P

At Embedded World 2026, SECO will introduce Read More → "SECO launches new Genio 360- and Genio 360P-based SOMs and expands its Edge AI portfolio with MediaTek at Embedded World 2026"

STMicroelectronics’ phase-shift control ICs squeeze more efficiency from resonant converters

February 19, 2026

Geneva, Switzerland, February 18, 2026 — STMicroelectronics has introduced the STNRG599A and Read More → "STMicroelectronics’ phase-shift control ICs squeeze more efficiency from resonant converters"

Aitech’s SP1 SpaceVPX SBC Showcases Strategic Integration of Teledyne’s Advanced Space Computing Capabilities

February 19, 2026

CHATSWORTH, CA & Grenoble, France — Feb. 18, 2026 — Aitech and Teledyne e2v Semiconductors are proud to highlight their continued collaboration in advancing space-grade computing. Through their ongoing partnership, Teledyne e2v’s high-reliability semiconductor are being integrated into Aitech’s SP1, a radiation-tolerant 3U SpaceVPX single-board computer (SBC).

Designed for deployment in LEO, GEO, lunar, and deep space missions, the SP1 is a … Read More → "Aitech’s SP1 SpaceVPX SBC Showcases Strategic Integration of Teledyne’s Advanced Space Computing Capabilities"